TFF1044HN/N1Y

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of TFF1044HN/N1YLast Revision (GMT):
Wednesday, 28 December 2022, 01:23:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TFF1044HN/N1YSOT1359HVFLGA3623.469800 mg YesYesYesNot ApplicableOtherNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 044 325182023-11-2593 / 168 hours26030 sec.NA / Not Available24020 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantEpoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-61.1881205.9406005.062335
Inorganic Silicon compoundsQuartz14808-60-70.0396000.1980000.168728
Inorganic Silicon compoundsSilica, vitreous60676-86-016.83168084.15840071.716333
Inorganic compoundsCarbon Black1333-86-40.1980200.9901000.843723
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.2772201.3861001.181177
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1584200.7921000.674995
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins1.1881205.9406005.062335
Zinc and its compoundsZinc Hydroxide20427-58-10.1188200.5941000.506268
Subtotal20.000000100.000000085.215894
Semiconductor DieSemiconductor DieCopper and its compoundsCopper, metal7440-50-80.0550772.2300000.234670
Inorganic Silicon compoundsSilicon7440-21-32.38432396.53910010.159109
Tin and its compoundsTin, metal7440-31-50.0301321.2200000.128384
Titanium and its compoundsTitanium, metal7440-32-60.0002440.0099000.001042
Tungsten and its compoundsTungsten, metal7440-33-70.0000250.0010000.000105
Subtotal2.469800100.000000010.523311
SubstrateSubstrateBarium and its compoundsBarium sulfate7727-43-70.0151001.5100000.064338
Copper and its compoundsCopper phthalocyanine147-14-80.0003000.0300000.001278
Copper and its compoundsCopper, metal7440-50-80.28000028.0000001.193023
Epoxy ResinsProprietary Material-Other Epoxy resins0.0587005.8700000.250109
Gold and its compoundsGold, metal7440-57-50.0020000.2000000.008522
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.29800029.8000001.269717
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0003000.0300000.001278
Magnesium and its compoundsTalc14807-96-60.0028000.2800000.011930
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.31150031.1500001.327238
Nickel and its compoundsNickel, metal7440-02-00.0294002.9400000.125267
Thallium and its compoundsThallium, metal7440-28-00.0019000.1900000.008096
Subtotal1.000000100.00000004.260795
Total23.469800100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 TFF1044HN/N1Y
Product content declaration of TFF1044HN/N1Y
上次修订 Last Revision (GMT):
Wednesday, 28 December 2022, 01:23:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of TFF1044HN/N1YLast Revision (GMT):
Wednesday, 28 December 2022, 01:23:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
SubstrateCOPPERTest Report
4 Jan 2024
Test Report
4 Jan 2024
Not AvailableTest Report
4 Jan 2024
HL832NSTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
11 Mar 2022
Test Report
29 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.