TFF11139HN/N1X

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of TFF11139HN/N1XLast Revision (GMT):
Friday, 02 December 2022, 05:13:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TFF11139HN/N1XSOT616-1HVQFN2436.277432 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 892 941152021-12-1751 / Unlimited26030 sec.1 / Unlimited24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000040.0010000.000010
Calcium and its compoundsCalcium7440-70-20.0000080.0020000.000021
Copper and its compoundsCopper, metal7440-50-80.0000040.0010000.000010
Gold and its compoundsGold, metal7440-57-50.37565198.8420001.035495
Iron and its compoundsIron, metal7439-89-60.0000040.0010000.000010
Magnesium and its compoundsMagnesium, metal7439-95-40.0000040.0010000.000010
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0010000.000010
Palladium and its compoundsPalladium, metal7440-05-30.0043711.1500000.012048
Silver and its compoundsSilver, metal7440-22-40.0000040.0010000.000010
Subtotal0.380052100.00000001.047627
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-816.57840097.52000045.698935
Iron and its compoundsIron, metal7439-89-60.3910002.3000001.077805
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0051000.0300000.014058
Zinc and its compoundsZinc, metal7440-66-60.0255000.1500000.070292
Subtotal17.000000100.000000046.861090
Die EncapsulantDie EncapsulantEpoxy ResinsOther Non-halogenated Epoxy resins0.6132243.6072001.690373
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-60.2628031.5459000.724426
Inorganic Silicon compoundsSilica, vitreous60676-86-014.51471985.38070040.010326
Inorganic compoundsCarbon Black1333-86-40.0309230.1819000.085240
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.6097903.5870001.680907
Organic Phosphorus compoundsOther organic phosphorous compounds0.0134810.0793000.037161
Phenols and Phenolic Resins1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol25917-04-80.0537370.3161000.148128
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.6178993.6347001.703260
Zinc and its compoundsZinc Hydroxide20427-58-10.2834241.6672000.781268
Subtotal17.000000100.000000046.861090
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0497509.9500000.137138
Palladium and its compoundsProprietary Material-Other palladium compounds0.0002500.0500000.000689
PolymersAmines, C36-alkylenedi-, maleated682800-79-90.05000010.0000000.137827
Silver and its compoundsSilver, metal7440-22-40.40000080.0000001.102614
Subtotal0.500000100.00000001.378267
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0060001.0000000.016539
Nickel and its compoundsNickel, metal7440-02-00.58200097.0000001.604303
Palladium and its compoundsPalladium, metal7440-05-30.0120002.0000000.033078
Subtotal0.600000100.00000001.653921
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.78143298.0000002.154046
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0159482.0000000.043960
Subtotal0.797380100.00000002.198006
Total36.277432100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 TFF11139HN/N1X
Product content declaration of TFF11139HN/N1X
上次修订 Last Revision (GMT):
Friday, 02 December 2022, 05:13:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of TFF11139HN/N1XLast Revision (GMT):
Friday, 02 December 2022, 05:13:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
CDA 194Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
NI PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
PD PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Die EncapsulantTest Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Epoxy AdhesiveTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Pre-plating - Precious metal - NiPdAuTest Report
29 Dec 2021
Test Report
29 Dec 2021
Test Report
29 Dec 2021
Not Available
Semiconductor DieTest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.