TJA1051TK/3,118

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of TJA1051TK/3,118Last Revision (GMT):
Friday, 15 December 2023, 09:34:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TJA1051TK/3,118SOT782HVSON826.007668 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 852 911182023-11-25151 / Unlimited26030 sec.1 / Unlimited24020 sec.3Bangkok, Thailand;Suzhou, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000004
Gold and its compoundsGold, metal7440-57-50.05609098.8400000.215666
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000050.0080000.000017
Palladium and its compoundsPalladium, metal7440-05-30.0006531.1500000.002509
Subtotal0.056748100.00000000.218197
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-89.45459097.47000036.353086
Iron and its compoundsIron, metal7439-89-60.2328002.4000000.895121
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0029100.0300000.011189
Zinc and its compoundsZinc, metal7440-66-60.0097000.1000000.037297
Subtotal9.700000100.000000037.296693
Die EncapsulantDie EncapsulantEpoxy ResinsOther Non-halogenated Epoxy resins0.5050083.6072001.941766
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-60.2164261.5459000.832162
Inorganic Silicon compoundsSilica, vitreous60676-86-011.95329885.38070045.960668
Inorganic compoundsCarbon Black1333-86-40.0254660.1819000.097917
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.5021803.5870001.930892
Organic Phosphorus compoundsOther organic phosphorous compounds0.0111020.0793000.042687
Phenols and Phenolic Resins1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol25917-04-80.0442540.3161000.170157
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.5088583.6347001.956569
Zinc and its compoundsZinc Hydroxide20427-58-10.2334081.6672000.897458
Subtotal14.000000100.000000053.830278
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0099509.9500000.038258
Palladium and its compoundsProprietary Material-Other palladium compounds0.0000500.0500000.000192
PolymersAmines, C36-alkylenedi-, maleated682800-79-90.01000010.0000000.038450
Silver and its compoundsSilver, metal7440-22-40.08000080.0000000.307602
Subtotal0.100000100.00000000.384502
Pre-plating - Precious metal - OtherPre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.0090003.0000000.034605
Nickel and its compoundsNickel, metal7440-02-00.27690092.3000001.064686
Palladium and its compoundsPalladium, metal7440-05-30.0093003.1000000.035759
Silver and its compoundsSilver, metal7440-22-40.0048001.6000000.018456
Subtotal0.300000100.00000001.153506
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-31.81390298.0000006.974488
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0370182.0000000.142337
Subtotal1.850920100.00000007.116824
Total26.007668100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 TJA1051TK/3,118
Product content declaration of TJA1051TK/3,118
上次修订 Last Revision (GMT):
Friday, 15 December 2023, 09:34:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of TJA1051TK/3,118Last Revision (GMT):
Friday, 15 December 2023, 09:34:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Copper Lead-Frame, Pre-PlatedAG PLATINGTest Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
AU PLATINGTest Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
C194Test Report
27 Dec 2022
Test Report
27 Dec 2022
Test Report
27 Dec 2022
Test Report
27 Dec 2022
NI PLATINGTest Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
PD PLATINGTest Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Pre-plating - Precious metal - OtherTest Report
1 Jan 2024
Test Report
1 Jan 2024
Test Report
1 Jan 2024
Not Available
Semiconductor DieTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.