TJA1055T/2Z

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of TJA1055T/2ZLast Revision (GMT):
Saturday, 18 June 2022, 10:09:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TJA1055T/2ZSOT108SO14126.478060 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 439 324312021-07-0581 / Unlimited26030 sec.1 / Unlimited24020 sec.3Bangkok, Thailand;Suzhou, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000010.0010000.000001
Calcium and its compoundsCalcium7440-70-20.0000020.0020000.000002
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000001
Gold and its compoundsGold, metal7440-57-50.09173598.8420000.072531
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000001
Magnesium and its compoundsMagnesium, metal7439-95-40.0000010.0010000.000001
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0010000.000001
Palladium and its compoundsPalladium, metal7440-05-30.0010671.1500000.000844
Silver and its compoundsSilver, metal7440-22-40.0000010.0010000.000001
Subtotal0.092810100.00000000.073380
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-856.53260097.47000044.697555
Iron and its compoundsIron, metal7439-89-61.3920002.4000001.100586
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0174000.0300000.013757
Zinc and its compoundsZinc, metal7440-66-60.0580000.1000000.045858
Subtotal58.000000100.000000045.857756
Die EncapsulantDie EncapsulantBoron and its compoundsTetraphenylphosphonium tetraphenylborate15525-15-20.3200000.5000000.253008
Epoxy Resins2,5-Di-tert-butyl-1,4-phenylenebis(oxymethyloxirane)64777-22-61.2800002.0000001.012033
Epoxy ResinsProprietary Material-Other Epoxy resins1.2800002.0000001.012033
Inorganic Silicon compoundsSilica, vitreous60676-86-055.04000086.00000043.517429
Inorganic compoundsCarbon Black1333-86-40.3200000.5000000.253008
Magnesium and its compoundsMagnesium Aluminum Hydroxide Carbonate11097-59-90.3200000.5000000.253008
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.9600001.5000000.759025
Organic Silicon compoundsOther organic Silicon Compounds0.3200000.5000000.253008
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.3200000.5000000.253008
Organic compoundsOther organic compounds.0.3200000.5000000.253008
Phenols and Phenolic ResinsPhenol polymer with 4, 4'- bis (methoxymethyl)- 1, 1'-bisphenyl205830-20-22.5600004.0000002.024066
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.6400001.0000000.506017
Zinc and its compoundsZinc Hydroxide20427-58-10.3200000.5000000.253008
Subtotal64.000000100.000000050.601661
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0099283.3094000.007850
AcrylatesProprietary Material-Other acrylates0.0264768.8252000.020933
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0099283.3094000.007850
Palladium and its compoundsPalladium, metal7440-05-30.0004960.1655000.000393
PolymersProprietary Material-Other polymers0.0049641.6547000.003925
Silver and its compoundsSilver, metal7440-22-40.24820782.7358000.196245
Subtotal0.300000100.00000000.237195
Pre-plating - Precious metal - OtherPre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.0390003.0000000.030835
Nickel and its compoundsNickel, metal7440-02-01.19990092.3000000.948702
Palladium and its compoundsPalladium, metal7440-05-30.0403003.1000000.031863
Silver and its compoundsSilver, metal7440-22-40.0208001.6000000.016445
Subtotal1.300000100.00000001.027846
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-32.72954598.0000002.158117
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0557052.0000000.044043
Subtotal2.785250100.00000002.202161
Total126.478060100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 TJA1055T/2Z
Product content declaration of TJA1055T/2Z
上次修订 Last Revision (GMT):
Saturday, 18 June 2022, 10:09:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of TJA1055T/2ZLast Revision (GMT):
Saturday, 18 June 2022, 10:09:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Copper Lead-Frame, Pre-Plated NiPdAuAG PLATINGTest Report
15 Nov 2021
Test Report
15 Nov 2021
Test Report
15 Nov 2021
Test Report
15 Nov 2021
AU PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
CDA 194Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
NI PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
PD PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Die EncapsulantTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Epoxy AdhesiveTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Pre-plating - Precious metal - OtherNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.