WLAN7202CY

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of WLAN7202CYLast Revision (GMT):
Saturday, 16 September 2023, 10:22:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
WLAN7202CYSOT2013HWFLGA166.010280 mg YesYesYesNot ApplicableOtherNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 722 145182023-11-2553 / 168 hours26030 sec.3 / 168 hours24020 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Hydroxide21645-51-20.1702507.5000002.832647
Epoxy ResinsProprietary Material-Other Epoxy resins0.1589007.0000002.643804
Inorganic Silicon compoundsSilica, vitreous60676-86-01.20196552.95000019.998486
Inorganic Silicon compoundsSilicon dioxide7631-86-90.68100030.00000011.330587
Inorganic compoundsCarbon Black1333-86-40.0124850.5500000.207727
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0454002.0000000.755373
Subtotal2.270000100.000000037.768623
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-31.05769498.00000017.598089
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0215862.0000000.359145
Subtotal1.079280100.000000017.957233
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-80.59227999.9900009.854439
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000590.0100000.000986
Subtotal0.592339100.00000009.855424
Copper PlatingCopper and its compoundsCopper, metal7440-50-80.90757699.99000015.100400
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000910.0100000.001510
Subtotal0.907667100.000000015.101910
Gold PlatingGold and its compoundsGold, metal7440-57-50.00931299.9900000.154944
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000016
Subtotal0.009314100.00000000.154960
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000250.0100000.000423
Nickel and its compoundsNickel, metal7440-02-00.25410099.9900004.227758
Subtotal0.254126100.00000004.228181
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.02901219.4000000.482712
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01495510.0000000.248821
Magnesium and its compoundsTalc14807-96-60.0044863.0000000.074646
Organic compoundsOther organic compounds.0.0082255.5000000.136851
Phosphorus compoundsDiphenyl(2,4,6-trimethylbenzoyl)phosphine oxide75980-60-80.0011960.8000000.019906
PolymersPlastic: EP - Epoxide, Epoxy0.01854412.4000000.308538
PolymersPlastic: PAK0.07312948.9000001.216733
Subtotal0.149548100.00000002.488207
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-30.41402255.3500006.888563
Inorganic Silicon compoundsSilicon dioxide7631-86-90.15498720.7200002.578700
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0431605.7700000.718103
PolymersPlastic: EP - Epoxide, Epoxy0.13583818.1600002.260096
Subtotal0.748007100.000000012.445462
Total6.010280100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 WLAN7202CY
Product content declaration of WLAN7202CY
上次修订 Last Revision (GMT):
Saturday, 16 September 2023, 10:22:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of WLAN7202CYLast Revision (GMT):
Saturday, 16 September 2023, 10:22:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
25 Apr 2023
Test Report
25 Apr 2023
Test Report
25 Apr 2023
Test Report
25 Apr 2023
Semiconductor DieAG PLATINGTest Report
31 Aug 2021
Not AvailableNot AvailableNot Available
COPPER PLATINGTest Report
4 Feb 2021
Test Report
4 Feb 2021
Test Report
4 Feb 2021
Test Report
4 Feb 2021
DIETest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
NI PLATINGTest Report
28 Jun 2021
Test Report
28 Jun 2021
Test Report
28 Jun 2021
Test Report
28 Jun 2021
SN PLATINGTest Report
31 Aug 2020
Not AvailableNot AvailableNot Available
SubstrateAUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Not AvailableNot Available
COPPERTest Report
1 Mar 2022
Test Report
1 Mar 2022
Not AvailableTest Report
1 Mar 2022
HL832NSTest Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.