This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.
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The OM13496 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13496 supports the following packages: QSOP16 (SOT519-1), XFBGA16 (SOT1354-1), XQFN16 (SOT1161-1), TSSOP28 (SOT361-1).