Vending Machine

Block Diagram

Vending Machine

Vending Machine BD1

Supported Devices

Sensors

I3C/I²C Digital Temp. Sensors

Power Management

PMICs

BLDC, H-Bridge, Stepper

Processors and Microcontrollers

i.MX 8 Applications Processors

Security and Authentication

Authentication

Wireless Connectivity

Wi-Fi® + Bluetooth® + 802.15.4

Analog and Mixed Signal

Real-Time Clocks

Multicore Processing

  • 4x Cortex®-A53 core platforms up to 1.8 GHz per core
  • 32 KB L1-I Cache/ 32 kB L1-D Cache
  • 512 kB L2 Cache
  • 1x Cortex-M4 core up to 400 MHz
  • 16 kB L1-I Cache/ 16 kB L2-D Cache

GPU

  • 3D GPU (1x shader, OpenGL® ES 2.0)
  • 2D GPU
  • Display Interface 1x MIPI DSI (4-lane) with PHY

Features

  • IEEE 802.11ac (wave2) with MU-MIMO receive
  • Virtual Dual MAC (via optimized DRCS)
  • Wi-Fi Stations (STA), Access Point (AP), Wi-Fi Direct (P2P)
  • WPA3 Encryption
  • Bluetooth 5.2 support
  • 2-antenna configuration for Wi-Fi/Bluetooth coexistence

Documentation

Quick reference to our documentation types.

7 documents

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Support

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