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Package Version Package Name Package Description Reference Codes Issue Date
HLQFP256 plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; heatsink MS-026(JEDEC 2008-12-19
HLQFP176 plastic thermal enhanced low profile quad flat package, 176 terminals, 0.4 mm pitch, 20 mm x 20 mm x 1.4 mm body MS-026(JEDEC 2011-04-20
HLQFP208 plastic thermal enhanced low profile quad flat package: 208 leads MS-026(JEDEC 2011-11-04
HLQFP208 HLQFP208, plastic, thermal enhanced low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body 2017-06-11
HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body; 4.9 mm x 4.9 mm exposed pad MS-026 BCD(JEDEC 2018-08-07
HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body MS-026 BCD(JEDEC 2018-06-29
HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body FL-PQFP-G64(JEDEC 2017-06-11
HLQFP64 plastic, thermal enhanced low profile quad flat package; 64 leads; body 10 x 10 x 1.5 mm 2016-07-12
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body 2016-01-08
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body 2017-03-27
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body 2018-03-02
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body 2021-12-14
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body 2022-02-18
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026-BBC(JEDEC 2017-12-14
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC 2017-06-11
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC 2017-06-11
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body 2017-06-11
HLQFP48 plastic, thermal enhanced low profile quad flat package; 48 leads; body 7 x 7 x 1.5 mm 2016-07-14
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.5 mm body; 4.4 mm x 4.4 mm exposed pad 2022-03-30
HLQFP48 plastic, thermal enhanced low profile quad flat package; 48 leads; 0.5 mm pitch, 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC 2017-08-28
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC 2018-03-01
HLQFP80 HLQFP80, plastic, thermal enhanced, low profile quad; flat leaded package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1.4 mm body 2017-03-27
HLQFP156 HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body NON-JEDEC(JEDEC 2017-06-11
HLQFP156 HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body 2018-10-26
HLQFP64 plastic, thermal enhanced low profile quad flat package; 64 leads; 14 x 14 x 1.5 mm body; exposed die pad 2016-09-01
HLQFP100 plastic thermal enhanced low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm; heatsink MS-026(JEDEC 2003-02-20
HLQFP100 plastic thermal enhanced low profile quad flat package; 100 leads; exposed die pad MS-026(JEDEC 2013-04-24
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body 2016-03-18
HLQFP100 plastic, thermal enhanced low profile quad flat package; 100 leads; body 14 mm x 14 mm x 1.6 mm; exposed die pad 2017-03-03
HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad MS-026(JEDEC 2004-07-05
HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad MS-026(JEDEC 2004-07-05
HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad MS-026(JEDEC 2004-07-05
HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad MS-026(JEDEC 2008-01-18
HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad MS-026(JEDEC 2008-11-21
HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad MS-026(JEDEC 2010-02-25
HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads MS-026(JEDEC 2011-11-28
HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 mm x 24 mm x 1.4 mm; exposed die pad MS-026(JEDEC 2002-06-13
HLQFP176 Plastic thermal enhanced low profile quad flat package; 176 leads, 0.5 mm pitch, 24 mm x 24 mm x 1.4 mm body MS-026(JEDEC 2014-04-01
HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body 2017-06-11
HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.50 mm pitch; 24 mm x 24 mm x 1.6 mm body 2017-03-27
HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body 2017-06-11
HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad; flat leaded package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body 2017-03-27
HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body 2017-06-11
HLQFP44 plastic thermal enhanced low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm; heatsink MS-026(JEDEC 2002-11-15
HLQFP128 HLQFP128, plastic, thermal enhanced low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body 2017-06-11
HLQFP128 HLQFP128, plastic, thermal enhanced low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body 2017-03-08