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Package Version Package Name Package Description Reference Codes Issue Date
HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2010-03-31
HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2010-07-13
HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2013-09-12
HTSSOP28 HTSSOP28, plastic, thermal enhanced thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 1 mm body TS-PDSO-G28(JEDEC 2017-06-11
HTSSOP38 plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad 2012-09-21
HTSSOP16 HTSSOP16, plastic, thermal enhanced thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body TS-PDSO-G16(JEDEC 2017-06-11
HTSSOP20 plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad MO-153(JEDEC 2005-11-02
HTSSOP20 HTSSOP20, plastic, thermal enhanced thin shrink small outline package; 20 terminals; 0.65 mm pitch; 4.4 mm x 6.5 mm x 0.9 mm body TS-PDSO-G28(JEDEC 2017-06-11
HTSSOP32 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2005-11-02
HTSSOP32 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2005-11-02
HTSSOP38 plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 2004-01-22
HTSSOP8 plastic thermal enhanced thin shrink small outline package; 8 leads; body width 3 mm; exposed die pad 2002-05-14
HTSSOP56 plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad MO-153(JEDEC);143E36T(IEC 2003-03-04
HTSSOP24 plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2005-12-06