Analog Companion Chip | NXP Semiconductors

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2 documents

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CES04-PRELIMINARY_1[CES04-PRELIMINARY_1]

PDFJan 1, 2004Rev 0.1

plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad[SOT638-1]

PDFFeb 8, 2016Rev 1.0

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