Silicon Tuner IC

  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

Roll over image to zoom in

Buy/Parametrics










































































































N true 0 PSPTDA18271HDen 2 Application Note Application Note t789 1 Package Information Package Information t790 1 en_US en_US en Application Note Application Note 1 1 9.0 English Provides Assembly guidelines for QFN and SON packages handling and board mounting. Including recommendations for printed-circuit board (PCB) design, soldering, and rework. NOTE: combined with AN10365. 112GNLnm PSP 9.3 MB None None documents None 112GNLnm /docs/en/application-note/AN1902.pdf 9332633 /docs/en/application-note/AN1902.pdf AN1902 documents N N 2016-10-31 AN1902: Assembly Guidelines for QFN and SON Packages Application Note /docs/en/application-note/AN1902.pdf /docs/en/application-note/AN1902.pdf Application Note N 645036621402383989 2023-06-08 pdf N en Mar 30, 2021 645036621402383989 Application Note Y N AN1902: Assembly Guidelines for QFN and SON Packages Application Note Package Information Package Information 1 2 1.0 English 1455079408130738826588 PSP 217.0 KB None None documents None 1455079408130738826588 /docs/en/package-information/SOT903-1.pdf 217000 /docs/en/package-information/SOT903-1.pdf SOT903-1 documents N 2016-02-09 plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm /docs/en/package-information/SOT903-1.pdf /docs/en/package-information/SOT903-1.pdf Package Information N 302435339416912908 2022-12-07 pdf en Feb 8, 2016 302435339416912908 Package Information Y N plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm false 0 TDA18271HD downloads en true 1 Y PSP Application Note 1 /docs/en/application-note/AN1902.pdf 2016-10-31 112GNLnm PSP 1 Mar 30, 2021 Application Note Provides Assembly guidelines for QFN and SON packages handling and board mounting. Including recommendations for printed-circuit board (PCB) design, soldering, and rework. NOTE: combined with AN10365. None /docs/en/application-note/AN1902.pdf English documents 9332633 None 645036621402383989 2023-06-08 N /docs/en/application-note/AN1902.pdf AN1902: Assembly Guidelines for QFN and SON Packages Application Note /docs/en/application-note/AN1902.pdf documents 645036621402383989 Application Note N en None Y pdf 9.0 N N AN1902: Assembly Guidelines for QFN and SON Packages Application Note 9.3 MB AN1902 N 112GNLnm Package Information 1 /docs/en/package-information/SOT903-1.pdf 2016-02-09 1455079408130738826588 PSP 2 Feb 8, 2016 Package Information None /docs/en/package-information/SOT903-1.pdf English documents 217000 None 302435339416912908 2022-12-07 /docs/en/package-information/SOT903-1.pdf plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm /docs/en/package-information/SOT903-1.pdf documents 302435339416912908 Package Information N en None Y pdf 1.0 N plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm 217.0 KB SOT903-1 N 1455079408130738826588 true Y Products

Documentation

Quick reference to our documentation types.

2 documents

Compact List

Design Files

Support

What do you need help with?