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The MMG3006NT1 is a general purpose amplifier that is internally input prematched and designed for a broad range of Class A, small-signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 400 to 2400 MHz such as Cellular, PCS, WLL, PHS, VHF, UHF, UMTS and general small-signal RF.

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Data Sheet

Application Notes

Product Details

Features

Frequency: 400-2400 MHz
P1dB: 33 dBm @ 900 MHz
Small-Signal Gain: 17.5 dB @ 900 MHz
Third Order Output Intercept Point: 49 dBm @ 900 MHz
Single 5 V Supply
Internally Input Prematched to 50 Ohms
RoHS Compliant
In Tape and Reel. T1 Suffix = 1000 Units, 12 mm Tape Width, 13-inch Reel.

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Documentation

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8 documents

Compact List

Thermal Characterization Methodology of RF Power Amplifiers - Application Note[AN1955]

PDFJul 11, 2024Rev 2
General Purpose Amplifier and MMIC Biasing[AN3100]

PDFMar 30, 2011Rev 3
PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778[AN3778]

PDFFeb 26, 2010Rev 0

RF GaAs Solutions[BR1609]

PDFDec 21, 2011Rev 1

MMG3006NT1 400-2400 MHz, 33 dBm P1dB GPA Data Sheet[MMG3006NT1]

PDFDec 29, 2017Rev 6

General Purpose Amplifiers Fact Sheet[RFGPAFS]

PDFDec 30, 2014Rev 2

98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins[SOT1592-1]

PDFMar 21, 2016Rev C

RF MMIC and GPA Cross Reference[MMICGPAQRG]

PDFDec 21, 2011Rev 2

Design Resources

Design Files

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2 design files

Receive the full breakdown. See the product footprint and more in the eCad file.

Models
MMG3006NT1 S-Parameters

S2PRev 0Feb 7, 2008 00:00:008.97 KBMMG3006N_SP

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Printed Circuit Boards and Schematics
MMG3006NT1 CAD DXF File

ZIPRev 0May 10, 2010 00:00:00906.99 KBMMG3006N_DXF_PCB
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400-2400 MHz, 17.5 dB, 33 dBm InGaP HBT GPA

Product Details

Features

Buy/Parametrics

Documentation

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Application Note (3)

Thermal Characterization Methodology of RF Power Amplifiers - Application Note[AN1955]

General Purpose Amplifier and MMIC Biasing[AN3100]

PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778[AN3778]

Brochure (1)

RF GaAs Solutions[BR1609]

Data Sheet (1)

MMG3006NT1 400-2400 MHz, 33 dBm P1dB GPA Data Sheet[MMG3006NT1]

Fact Sheet (1)

General Purpose Amplifiers Fact Sheet[RFGPAFS]

Package Information (1)

98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins[SOT1592-1]

Quick Reference Guide (1)

RF MMIC and GPA Cross Reference[MMICGPAQRG]

MMG3006NT1 400-2400 MHz, 33 dBm P1dB GPA Data Sheet

Thermal Characterization Methodology of RF Power Amplifiers - Application Note

General Purpose Amplifier and MMIC Biasing

PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778

RF GaAs Solutions

General Purpose Amplifiers Fact Sheet

98ASA10761D, QFN-EP Punch, 4.0x4.0x0.85, Pitch 0.65, 16 Pins

RF MMIC and GPA Cross Reference

Design Resources

Design Files

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MMG3006NT1 S-Parameters

MMG3006NT1 CAD DXF File

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