A3M39TL039T2

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Product content declaration of A3M39TL039T2Last Revision (GMT):
Wednesday, 21 February 2024, 03:45:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A3M39TL039T2SOT1831HLLGA27138.255398 mg YesNoYesNickel/Palladium/Gold (Ni/Pd/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 191 545282023-11-245Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.57504099.9900000.415926
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000580.0100000.000042
Subtotal0.575098100.00000000.415968
Capacitor 1CeramicCalcium and its compoundsCalcium monoxide1305-78-80.10700025.0000000.077393
Manganese and its compoundsManganese oxide1344-43-00.0214005.0000000.015479
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.04280010.0000000.030957
Zirconium and its compoundsZirconium oxide1314-23-40.25680060.0000000.185743
Subtotal0.428000100.00000000.309572
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.01799899.9900000.013018
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Subtotal0.018000100.00000000.013019
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01399999.9900000.010125
Subtotal0.014000100.00000000.010126
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0032002.0000000.002315
Copper and its compoundsCopper, metal7440-50-80.14400090.0000000.104155
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0128008.0000000.009258
Subtotal0.160000100.00000000.115728
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000003
Tin and its compoundsTin, metal7440-31-50.03999699.9900000.028929
Subtotal0.040000100.00000000.028932
Capacitor 2CeramicCalcium and its compoundsCalcium monoxide1305-78-80.06230325.0000000.045064
Manganese and its compoundsManganese oxide1344-43-00.0124615.0000000.009013
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02492110.0000000.018025
Zirconium and its compoundsZirconium oxide1314-23-40.14952860.0000000.108153
Subtotal0.249213100.00000000.180255
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.01048099.9900000.007580
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.010481100.00000000.007581
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00815199.9900000.005896
Subtotal0.008152100.00000000.005896
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0018632.0000000.001348
Copper and its compoundsCopper, metal7440-50-80.08384790.0000000.060647
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0074538.0000000.005391
Subtotal0.093163100.00000000.067385
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.02328999.9900000.016845
Subtotal0.023291100.00000000.016846
Capacitor 3CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400825.0000000.017365
Manganese and its compoundsManganese oxide1344-43-00.0048025.0000000.003473
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960310.0000000.006946
Zirconium and its compoundsZirconium oxide1314-23-40.05761860.0000000.041675
Subtotal0.096030100.00000000.069458
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399299.9000000.002887
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.1000000.000003
Subtotal0.003996100.00000000.002890
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00598899.9000000.004331
Subtotal0.005994100.00000000.004335
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000868
Copper and its compoundsCopper, metal7440-50-80.05399590.0000000.039054
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0047998.0000000.003472
Subtotal0.059994100.00000000.043394
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.1000000.000010
Tin and its compoundsTin, metal7440-31-50.01397299.9000000.010106
Subtotal0.013986100.00000000.010116
Capacitor 4CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400825.0000000.017365
Manganese and its compoundsManganese oxide1344-43-00.0048025.0000000.003473
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960310.0000000.006946
Zirconium and its compoundsZirconium oxide1314-23-40.05761860.0000000.041675
Subtotal0.096030100.00000000.069458
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399299.9000000.002887
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.1000000.000003
Subtotal0.003996100.00000000.002890
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00598899.9000000.004331
Subtotal0.005994100.00000000.004335
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000868
Copper and its compoundsCopper, metal7440-50-80.05399590.0000000.039054
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0047998.0000000.003472
Subtotal0.059994100.00000000.043394
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.1000000.000010
Tin and its compoundsTin, metal7440-31-50.01397299.9000000.010106
Subtotal0.013986100.00000000.010116
Capacitor 5CapacitorBoron and its compoundsBoron oxide1303-86-20.0088440.6700000.006397
Calcium and its compoundsCalcium monoxide1305-78-80.14084410.6700000.101872
Copper and its compoundsCopper, metal7440-50-80.49566037.5500000.358510
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0352442.6700000.025492
Manganese and its compoundsManganese carbonate598-62-90.0352442.6700000.025492
Nickel and its compoundsNickel, metal7440-02-00.0439563.3300000.031793
Tin and its compoundsTin, metal7440-31-50.1026967.7800000.074280
Zirconium and its compoundsZirconium oxide1314-23-40.45751234.6600000.330918
Subtotal1.320000100.00000000.954755
Capacitor 6CeramicCalcium and its compoundsCalcium monoxide1305-78-80.10700025.0000000.077393
Manganese and its compoundsManganese oxide1344-43-00.0214005.0000000.015479
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.04280010.0000000.030957
Zirconium and its compoundsZirconium oxide1314-23-40.25680060.0000000.185743
Subtotal0.428000100.00000000.309572
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.01799899.9900000.013018
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Subtotal0.018000100.00000000.013019
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01399999.9900000.010125
Subtotal0.014000100.00000000.010126
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0032002.0000000.002315
Copper and its compoundsCopper, metal7440-50-80.14400090.0000000.104155
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0128008.0000000.009258
Subtotal0.160000100.00000000.115728
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000003
Tin and its compoundsTin, metal7440-31-50.03999699.9900000.028929
Subtotal0.040000100.00000000.028932
Capacitor 7CeramicCalcium and its compoundsCalcium monoxide1305-78-80.06230325.0000000.045064
Manganese and its compoundsManganese oxide1344-43-00.0124615.0000000.009013
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02492110.0000000.018025
Zirconium and its compoundsZirconium oxide1314-23-40.14952860.0000000.108153
Subtotal0.249213100.00000000.180255
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.01048099.9900000.007580
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.010481100.00000000.007581
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00815199.9900000.005896
Subtotal0.008152100.00000000.005896
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0018632.0000000.001348
Copper and its compoundsCopper, metal7440-50-80.08384790.0000000.060647
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0074538.0000000.005391
Subtotal0.093163100.00000000.067385
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.02328999.9900000.016845
Subtotal0.023291100.00000000.016846
Capacitor 8CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01200425.0000000.008682
Manganese and its compoundsManganese oxide1344-43-00.0024015.0000000.001736
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00480210.0000000.003473
Zirconium and its compoundsZirconium oxide1314-23-40.02880960.0000000.020837
Subtotal0.048015100.00000000.034729
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00199699.9000000.001444
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000001
Subtotal0.001998100.00000000.001445
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.1000000.000002
Nickel and its compoundsNickel, metal7440-02-00.00299499.9000000.002166
Subtotal0.002997100.00000000.002168
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0006002.0000000.000434
Copper and its compoundsCopper, metal7440-50-80.02699790.0000000.019527
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0024008.0000000.001736
Subtotal0.029997100.00000000.021697
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000070.1000000.000005
Tin and its compoundsTin, metal7440-31-50.00698699.9000000.005053
Subtotal0.006993100.00000000.005058
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Hydroxide21645-51-20.9782201.0000000.707546
Inorganic Silicon compoundsSilica, vitreous60676-86-064.56252066.00000046.698010
Inorganic Silicon compoundsSilicon dioxide7631-86-919.56440020.00000014.150912
Inorganic compoundsCarbon Black1333-86-40.4891100.5000000.353773
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins4.4019904.5000003.183955
PolymersPlastic: EP - Epoxide, Epoxy7.8257608.0000005.660365
Subtotal97.822000100.000000070.754561
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0287453.0612000.020791
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0287453.0612000.020791
Silver and its compoundsSilver, metal7440-22-40.88151193.8776000.637596
Subtotal0.939000100.00000000.679178
Inductor 1InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.07440024.8000000.053814
Boron and its compoundsBoron oxide1303-86-20.0204006.8000000.014755
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0012000.4000000.000868
Inorganic Silicon compoundsSilicon dioxide7631-86-90.10560035.2000000.076380
Nickel and its compoundsNickel, metal7440-02-00.0144004.8000000.010415
Silver and its compoundsSilver, metal7440-22-40.06540021.8000000.047304
Tin and its compoundsTin, metal7440-31-50.0186006.2000000.013453
Subtotal0.300000100.00000000.216990
Inductor 2InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.03720024.8000000.026907
Boron and its compoundsBoron oxide1303-86-20.0102006.8000000.007378
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0006000.4000000.000434
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05280035.2000000.038190
Nickel and its compoundsNickel, metal7440-02-00.0072004.8000000.005208
Silver and its compoundsSilver, metal7440-22-40.03270021.8000000.023652
Tin and its compoundsTin, metal7440-31-50.0093006.2000000.006727
Subtotal0.150000100.00000000.108495
Inductor 3Ceramic 1Aluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0003985.0000000.000288
Boron and its compoundsBoron oxide1303-86-20.00119415.0000000.000864
Cobalt and its compoundsCobalt oxide1307-96-60.0003985.0000000.000288
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00557470.0000000.004032
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0003985.0000000.000288
Subtotal0.007963100.00000000.005759
Ceramic 2Aluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04771940.0000000.034515
Boron and its compoundsBoron oxide1303-86-20.01193010.0000000.008629
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05964950.0000000.043144
Subtotal0.119298100.00000000.086288
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000002
Silver and its compoundsSilver, metal7440-22-40.02386899.9900000.017263
Subtotal0.023870100.00000000.017265
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00318499.9900000.002303
Subtotal0.003185100.00000000.002304
Outer ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.01590699.9900000.011505
Subtotal0.015908100.00000000.011506
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00477799.9900000.003455
Subtotal0.004777100.00000000.003455
Inductor 4Ceramic 1Aluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0003985.0000000.000288
Boron and its compoundsBoron oxide1303-86-20.00119415.0000000.000864
Cobalt and its compoundsCobalt oxide1307-96-60.0003985.0000000.000288
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00557470.0000000.004032
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0003985.0000000.000288
Subtotal0.007963100.00000000.005759
Ceramic 2Aluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04771940.0000000.034515
Boron and its compoundsBoron oxide1303-86-20.01193010.0000000.008629
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05964950.0000000.043144
Subtotal0.119298100.00000000.086288
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000002
Silver and its compoundsSilver, metal7440-22-40.02386899.9900000.017263
Subtotal0.023870100.00000000.017265
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00318499.9900000.002303
Subtotal0.003185100.00000000.002304
Outer ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.01590699.9900000.011505
Subtotal0.015908100.00000000.011506
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00477799.9900000.003455
Subtotal0.004777100.00000000.003455
Inductor 5CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.08235240.0000000.059565
Boron and its compoundsBoron oxide1303-86-20.02058810.0000000.014891
Inorganic Silicon compoundsQuartz14808-60-70.10294050.0000000.074457
Subtotal0.205880100.00000000.148913
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000003
Silver and its compoundsSilver, metal7440-22-40.04117399.9900000.029781
Subtotal0.041177100.00000000.029784
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01358699.9900000.009827
Subtotal0.013587100.00000000.009827
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.0100000.000004
Silver and its compoundsSilver, metal7440-22-40.05558199.9900000.040202
Subtotal0.055587100.00000000.040206
Protective CoatingAluminum and its compoundsAluminum oxide1302-74-50.0007835.0000000.000566
Boron and its compoundsBoron oxide1303-86-20.00234815.0000000.001698
Cobalt and its compoundsCobalt oxide1307-96-60.0007835.0000000.000566
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01095670.0000000.007925
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0007835.0000000.000566
Subtotal0.015652100.00000000.011321
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01811499.9900000.013102
Subtotal0.018116100.00000000.013103
Resistor 1Alumina SubstrateAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.58375396.0000000.422228
Inorganic Silicon compoundsQuartz14808-60-70.0121622.0000000.008796
Magnesium and its compoundsMagnesium-oxide1309-48-40.0121622.0000000.008796
Subtotal0.608076100.00000000.439821
GlassLead and its compoundsFrits, chemicals65997-18-40.00777337.2300000.005622
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.01310662.7700000.009479
Subtotal0.020879100.00000000.015102
Inner Electrode 1Palladium and its compoundsPalladium, metal7440-05-30.0001781.5000000.000129
Silver and its compoundsSilver, metal7440-22-40.01170998.5000000.008469
Subtotal0.011887100.00000000.008598
Inner Electrode 2Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.01721999.9900000.012455
Subtotal0.017221100.00000000.012456
Resistive LayerLead and its compoundsFrits, chemicals65997-18-40.00161818.0000000.001171
Ruthenium and its compoundsRuthenium oxide12036-10-10.00647472.0000000.004683
Silver and its compoundsSilver, metal7440-22-40.00089910.0000000.000650
Subtotal0.008991100.00000000.006504
TerminationNickel and its compoundsNickel, metal7440-02-00.06234165.6600000.045091
Tin and its compoundsTin, metal7440-31-50.03260434.3400000.023582
Subtotal0.094945100.00000000.068674
Resistor 2Alumina SubstrateAluminum and its compoundsAluminum oxide1302-74-50.19584196.0000000.141652
Inorganic Silicon compoundsQuartz14808-60-70.0051002.5000000.003689
Magnesium and its compoundsMagnesium-oxide1309-48-40.0030601.5000000.002213
Subtotal0.204001100.00000000.147554
GlazeLead and its compoundsFrits, chemicals65997-18-40.00150199.9000000.001086
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000001
Subtotal0.001502100.00000000.001087
Inner Electrode 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.0006856.0000000.000495
Palladium and its compoundsPalladium, metal7440-05-30.0000570.5000000.000041
PolymersEthyl cellulose9004-57-30.0007426.5000000.000537
Silver and its compoundsSilver, metal7440-22-40.00993487.0000000.007185
Subtotal0.011418100.00000000.008259
Inner Electrode 2Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000130.1000000.000010
Nickel and its compoundsNickel, metal7440-02-00.01315899.9000000.009517
Subtotal0.013171100.00000000.009527
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000110.1000000.000008
Tin and its compoundsTin, metal7440-31-50.01100799.9000000.007961
Subtotal0.011018100.00000000.007969
Protective CoatingInorganic Silicon compoundsSilicon dioxide7631-86-90.00194246.7300000.001405
Inorganic compoundsCarbon Black1333-86-40.0002726.5400000.000197
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.00194246.7300000.001405
Subtotal0.004157100.00000000.003006
Resistive LayerInorganic Silicon compoundsSilicon dioxide7631-86-90.00287556.0000000.002079
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0001773.4400000.000128
Ruthenium and its compoundsRuthenium oxide12036-10-10.00208240.5600000.001506
Subtotal0.005133100.00000000.003713
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-38.50940289.6000006.154842
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0854740.9000000.061823
Nickel and its compoundsNickel, metal7440-02-00.0474850.5000000.034346
Silver and its compoundsSilver, metal7440-22-40.0299160.3150000.021638
Tin and its compoundsTin, metal7440-31-50.8248238.6850000.596594
Subtotal9.497100100.00000006.869243
Semiconductor Die 2DieInorganic Silicon compoundsSilicon7440-21-318.61431698.00000013.463717
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3798842.0000000.274770
Subtotal18.994200100.000000013.738487
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon7440-21-31.64684889.6000001.191164
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0165420.9000000.011965
Nickel and its compoundsNickel, metal7440-02-00.0091900.5000000.006647
Silver and its compoundsSilver, metal7440-22-40.0057900.3150000.004188
Tin and its compoundsTin, metal7440-31-50.1596308.6850000.115460
Subtotal1.838000100.00000001.329424
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0468572.9864000.033891
Glycol Ethers and Acetates - Specific2-(2-butoxyethoxy)ethanol112-34-50.0426472.7181000.030846
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.19535512.4509000.141300
Silver and its compoundsSilver, metal7440-22-40.0675504.3053000.048859
Tin and its compoundsTin, metal7440-31-51.21659277.5393000.879960
Subtotal1.569000100.00000001.134856
Substrate, Pre-plated NiPdAuNickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01372699.9900000.009928
Subtotal0.013728100.00000000.009929
Palladium PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Palladium and its compoundsPalladium, metal7440-05-30.00200399.9900000.001449
Subtotal0.002004100.00000000.001449
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.00688121.0000000.004977
Cyanide compoundsPhthalocyanine Blue57455-37-50.0003281.0000000.000237
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0016385.0000000.001185
Magnesium and its compoundsTalc14807-96-60.0016385.0000000.001185
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00327710.0000000.002370
Organic compoundsProprietary Material-Other organic compounds.0.0001640.5000000.000118
PolymersPlastic: EP - Epoxide, Epoxy0.00491515.0000000.003555
PolymersPlastic: PAK0.01392542.5000000.010072
Subtotal0.032766100.00000000.023699
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-30.21884623.0000000.158291
Inorganic Silicon compoundsSilicon dioxide7631-86-90.43198245.4000000.312452
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0789758.3000000.057122
PolymersBT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]0.22170023.3000000.160356
Subtotal0.951503100.00000000.688221
Total138.255398100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A3M39TL039T2
Product content declaration of A3M39TL039T2
上次修订 Last Revision (GMT):
Wednesday, 21 February 2024, 03:45:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 4
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 5
电容器
Capacitor
OOOOOO
电容器
Capacitor 6
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 7
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 8
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
电感
Inductor 1
电感
Inductor
OOOOOO
电感
Inductor 2
电感
Inductor
OOOOOO
电感
Inductor 3
陶瓷的
Ceramic 1
OOOOOO

陶瓷的
Ceramic 2
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 4
陶瓷的
Ceramic 1
OOOOOO

陶瓷的
Ceramic 2
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 5
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电阻
Resistor 1
氧化铝基材
Alumina Substrate
OOOOOO

玻璃
Glass
XOOOOO

内电极
Inner Electrode 1
OOOOOO

内电极
Inner Electrode 2
OOOOOO

电阻层
Resistive Layer
XOOOOO

终端材料
Termination
OOOOOO
电阻
Resistor 2
氧化铝基材
Alumina Substrate
OOOOOO


Glaze
XOOOOO

内电极
Inner Electrode 1
OOOOOO

内电极
Inner Electrode 2
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
基板,预镀镍钯金
Substrate, Pre-plated NiPdAu
镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A3M39TL039T2Last Revision (GMT):
Wednesday, 21 February 2024, 03:45:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Capacitor 1CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 2CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 3CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 4CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 5Not AvailableNot AvailableNot AvailableNot Available
Capacitor 6CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 7CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 8CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveTest Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Inductor 1ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Inductor 2ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Inductor 3ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Test Report
24 Sep 2021
Test Report
24 Sep 2021
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Test Report
15 Nov 2021
Test Report
15 Nov 2021
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Inductor 4ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Test Report
24 Sep 2021
Test Report
24 Sep 2021
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Test Report
15 Nov 2021
Test Report
15 Nov 2021
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Inductor 5ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Not AvailableNot Available
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Resistor 1CERAMIC SUSBTRATETest Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
INKTest Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
INNER ELECTRODE 1Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
INNER ELECTRODE 2Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
NI TERMINATIONTest Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
OVERCOATTest Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
PRIMARY GLASSTest Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
RESISTIVE LAYERTest Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
Test Report
2 Mar 2021
SN TERMINATIONTest Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Resistor 2CERAMICNot AvailableNot AvailableTest Report
13 Feb 2020
Not Available
EXTERNAL ELECTRODETest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
INTERNAL ELECTRODETest Report
27 Dec 2019
Test Report
27 Dec 2019
Test Report
27 Dec 2019Test Report
15 Sep 2020
Test Report
27 Dec 2019
NI PLATINGNot AvailableNot AvailableTest Report
4 Oct 2020
Test Report
4 Oct 2020
OVERCOATTest Report
27 Aug 2020
Test Report
27 Aug 2020
Not AvailableNot Available
OVERGLAZETest Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
RESISTIVE ELECTRODETest Report
19 Oct 2020
Test Report
19 Oct 2020
Not AvailableNot Available
SECONDARY ELECTRODETest Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
SN PLATINGTest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
SUSBTRATETest Report
13 Feb 2020
Test Report
13 Feb 2020
Not AvailableTest Report
13 Feb 2020
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 3Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Solder PasteTest Report
14 Oct 2022
Test Report
14 Oct 2022
Test Report
15 Feb 2020
Test Report
14 Oct 2022
Substrate, Pre-plated NiPdAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.