A3M39TL039T2

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Product content declaration of A3M39TL039T2		Last Revision (GMT): Friday, 28 May 2021, 07:02:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
A3M39TL039T2	SOT1831	HLLGA27	161.550698 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 191 54528	2023-03-08	4	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.575040	99.990000	0.355951
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000058	0.010000	0.000036
			Subtotal		0.575098	100.0000000	0.355986

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.107000	25.000000	0.066233
		Manganese and its compounds	Manganese oxide	1344-43-0	0.021400	5.000000	0.013247
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.042800	10.000000	0.026493
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.256800	60.000000	0.158959
			Subtotal		0.428000	100.0000000	0.264932
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.017998	99.990000	0.011141
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
			Subtotal		0.018000	100.0000000	0.011142
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013999	99.990000	0.008665
			Subtotal		0.014000	100.0000000	0.008666
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003200	2.000000	0.001981
		Copper and its compounds	Copper, metal	7440-50-8	0.144000	90.000000	0.089136
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012800	8.000000	0.007923
			Subtotal		0.160000	100.0000000	0.099040
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.039996	99.990000	0.024758
			Subtotal		0.040000	100.0000000	0.024760

Capacitor 2	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	2.556000	60.000000	1.582166
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.426000	10.000000	0.263694
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	1.278000	30.000000	0.791083
			Subtotal		4.260000	100.0000000	2.636943
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000112	0.010000	0.000069
		Nickel and its compounds	Nickel, metal	7440-02-0	1.115888	99.990000	0.690736
			Subtotal		1.116000	100.0000000	0.690805
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.010000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.071993	99.990000	0.044564
			Subtotal		0.072000	100.0000000	0.044568
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.015280	2.000000	0.009458
		Copper and its compounds	Copper, metal	7440-50-8	0.687600	90.000000	0.425625
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.061120	8.000000	0.037833
			Subtotal		0.764000	100.0000000	0.472917
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000019	0.010000	0.000012
		Tin and its compounds	Tin, metal	7440-31-5	0.187981	99.990000	0.116361
			Subtotal		0.188000	100.0000000	0.116372

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.038566
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.007713
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.015426
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.092558
			Subtotal		0.249213	100.0000000	0.154263
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.006487
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.006488
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.005045
			Subtotal		0.008152	100.0000000	0.005046
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001153
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.051901
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.004614
			Subtotal		0.093163	100.0000000	0.057668
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.014416
			Subtotal		0.023291	100.0000000	0.014417

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.107000	25.000000	0.066233
		Manganese and its compounds	Manganese oxide	1344-43-0	0.021400	5.000000	0.013247
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.042800	10.000000	0.026493
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.256800	60.000000	0.158959
			Subtotal		0.428000	100.0000000	0.264932
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.017998	99.990000	0.011141
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
			Subtotal		0.018000	100.0000000	0.011142
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013999	99.990000	0.008665
			Subtotal		0.014000	100.0000000	0.008666
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003200	2.000000	0.001981
		Copper and its compounds	Copper, metal	7440-50-8	0.144000	90.000000	0.089136
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012800	8.000000	0.007923
			Subtotal		0.160000	100.0000000	0.099040
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.039996	99.990000	0.024758
			Subtotal		0.040000	100.0000000	0.024760

Capacitor 5	Capacitor	Barium and its compounds	Barium oxide	1304-28-5	0.307439	39.999900	0.190305
		Boron and its compounds	Boron oxide	1303-86-2	0.003540	0.460600	0.002191
		Copper and its compounds	Copper, metal	7440-50-8	0.159310	20.727300	0.098613
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.014161	1.842400	0.008766
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.051240	6.666700	0.031718
		Nickel and its compounds	Nickel, metal	7440-02-0	0.034937	4.545500	0.021626
		Tin and its compounds	Tin, metal	7440-31-5	0.044253	5.757600	0.027393
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.153720	20.000000	0.095153
			Subtotal		0.768600	100.0000000	0.475764

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.038566
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.007713
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.015426
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.092558
			Subtotal		0.249213	100.0000000	0.154263
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.006487
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.006488
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.005045
			Subtotal		0.008152	100.0000000	0.005046
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001153
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.051901
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.004614
			Subtotal		0.093163	100.0000000	0.057668
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.014416
			Subtotal		0.023291	100.0000000	0.014417

Capacitor 7	Capacitor	Barium and its compounds	Barium oxide	1304-28-5	0.307439	39.999900	0.190305
		Boron and its compounds	Boron oxide	1303-86-2	0.003540	0.460600	0.002191
		Copper and its compounds	Copper, metal	7440-50-8	0.159310	20.727300	0.098613
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.014161	1.842400	0.008766
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.051240	6.666700	0.031718
		Nickel and its compounds	Nickel, metal	7440-02-0	0.034937	4.545500	0.021626
		Tin and its compounds	Tin, metal	7440-31-5	0.044253	5.757600	0.027393
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.153720	20.000000	0.095153
			Subtotal		0.768600	100.0000000	0.475764

Capacitor 8	Capacitor	Barium and its compounds	Barium oxide	1304-28-5	0.153720	39.999900	0.095153
		Boron and its compounds	Boron oxide	1303-86-2	0.001770	0.460600	0.001096
		Copper and its compounds	Copper, metal	7440-50-8	0.079655	20.727300	0.049307
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007080	1.842400	0.004383
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.025620	6.666700	0.015859
		Nickel and its compounds	Nickel, metal	7440-02-0	0.017468	4.545500	0.010813
		Tin and its compounds	Tin, metal	7440-31-5	0.022127	5.757600	0.013696
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.076860	20.000000	0.047576
			Subtotal		0.384300	100.0000000	0.237882

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		4.891100	5.000000	3.027595
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	85.105140	87.000000	52.680144
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	2.934660	3.000000	1.816557
		Inorganic compounds	Carbon Black	1333-86-4	0.489110	0.500000	0.302759
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.097822	0.100000	0.060552
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271686	1.300000	0.787175
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		2.934660	3.000000	1.816557
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.097822	0.100000	0.060552
			Subtotal		97.822000	100.0000000	60.551890

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.028745	3.061200	0.017793
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.028745	3.061200	0.017793
		Silver and its compounds	Silver, metal	7440-22-4	0.881511	93.877600	0.545656
			Subtotal		0.939000	100.0000000	0.581242

Inductor 1	Inductor	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.074400	24.800000	0.046054
		Boron and its compounds	Boron oxide	1303-86-2	0.020400	6.800000	0.012628
		Cobalt and its compounds	C.I. Pigment Blue 28	1345-16-0	0.001200	0.400000	0.000743
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.105600	35.200000	0.065366
		Nickel and its compounds	Nickel, metal	7440-02-0	0.014400	4.800000	0.008914
		Silver and its compounds	Silver, metal	7440-22-4	0.065400	21.800000	0.040483
		Tin and its compounds	Tin, metal	7440-31-5	0.018600	6.200000	0.011513
			Subtotal		0.300000	100.0000000	0.185700

Inductor 2	Inductor	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.037200	24.800000	0.023027
		Boron and its compounds	Boron oxide	1303-86-2	0.010200	6.800000	0.006314
		Cobalt and its compounds	C.I. Pigment Blue 28	1345-16-0	0.000600	0.400000	0.000371
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.052800	35.200000	0.032683
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007200	4.800000	0.004457
		Silver and its compounds	Silver, metal	7440-22-4	0.032700	21.800000	0.020241
		Tin and its compounds	Tin, metal	7440-31-5	0.009300	6.200000	0.005757
			Subtotal		0.150000	100.0000000	0.092850

Inductor 3	Ceramic 1	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000398	5.000000	0.000246
		Boron and its compounds	Boron oxide	1303-86-2	0.001194	15.000000	0.000739
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000398	5.000000	0.000246
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005574	70.000000	0.003450
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000398	5.000000	0.000246
			Subtotal		0.007963	100.0000000	0.004929
	Ceramic 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.047719	40.000000	0.029538
		Boron and its compounds	Boron oxide	1303-86-2	0.011930	10.000000	0.007384
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.059649	50.000000	0.036923
			Subtotal		0.119298	100.0000000	0.073845
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.023868	99.990000	0.014774
			Subtotal		0.023870	100.0000000	0.014776
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003184	99.990000	0.001971
			Subtotal		0.003185	100.0000000	0.001972
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.015906	99.990000	0.009846
			Subtotal		0.015908	100.0000000	0.009847
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004777	99.990000	0.002957
			Subtotal		0.004777	100.0000000	0.002957

Inductor 4	Ceramic 1	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000398	5.000000	0.000246
		Boron and its compounds	Boron oxide	1303-86-2	0.001194	15.000000	0.000739
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000398	5.000000	0.000246
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005574	70.000000	0.003450
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000398	5.000000	0.000246
			Subtotal		0.007963	100.0000000	0.004929
	Ceramic 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.047719	40.000000	0.029538
		Boron and its compounds	Boron oxide	1303-86-2	0.011930	10.000000	0.007384
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.059649	50.000000	0.036923
			Subtotal		0.119298	100.0000000	0.073845
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.023868	99.990000	0.014774
			Subtotal		0.023870	100.0000000	0.014776
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003184	99.990000	0.001971
			Subtotal		0.003185	100.0000000	0.001972
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.015906	99.990000	0.009846
			Subtotal		0.015908	100.0000000	0.009847
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004777	99.990000	0.002957
			Subtotal		0.004777	100.0000000	0.002957

Inductor 5	Inductor	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.086800	24.800000	0.053729
		Boron and its compounds	Boron oxide	1303-86-2	0.023800	6.800000	0.014732
		Cobalt and its compounds	C.I. Pigment Blue 28	1345-16-0	0.001400	0.400000	0.000867
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.123200	35.200000	0.076261
		Nickel and its compounds	Nickel, metal	7440-02-0	0.016800	4.800000	0.010399
		Silver and its compounds	Silver, metal	7440-22-4	0.076300	21.800000	0.047230
		Tin and its compounds	Tin, metal	7440-31-5	0.021700	6.200000	0.013432
			Subtotal		0.350000	100.0000000	0.216650

Resistor 1	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.109641	96.100000	0.067868
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000456	0.400000	0.000282
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001711	1.500000	0.001059
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.002282	2.000000	0.001412
			Subtotal		0.114090	100.0000000	0.070622
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000452	13.799000	0.000280
		Boron and its compounds	Boron oxide	1303-86-2	0.000039	1.200000	0.000024
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000151	4.608000	0.000093
		Silver and its compounds	Silver, metal	7440-22-4	0.002631	80.393000	0.001629
			Subtotal		0.003273	100.0000000	0.002026
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000196	4.500000	0.000121
		Boron and its compounds	Boron oxide	1303-86-2	0.000009	0.200000	0.000005
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000118	2.700000	0.000073
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000161	3.700000	0.000100
		Silver and its compounds	Silver, metal	7440-22-4	0.003879	88.900000	0.002401
			Subtotal		0.004364	100.0000000	0.002701
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000724	16.600000	0.000448
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000188	4.300000	0.000116
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.001091	25.000000	0.000675
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.002361	54.100000	0.001461
			Subtotal		0.004364	100.0000000	0.002701
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006545	99.990000	0.004052
			Subtotal		0.006546	100.0000000	0.004052
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000146	6.698000	0.000091
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.001647	75.476000	0.001020
		Boron and its compounds	Boron oxide	1303-86-2	0.000023	1.031000	0.000014
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000367	16.795000	0.000227
			Subtotal		0.002182	100.0000000	0.001351
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000300	5.501000	0.000186
		Boron and its compounds	Boron oxide	1303-86-2	0.000049	0.900000	0.000030
		Copper and its compounds	Cupric oxide	1317-38-0	0.000049	0.900000	0.000030
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001074	19.702000	0.000665
		Lead and its compounds	Lead monooxide	1317-36-8	0.000308	5.641000	0.000190
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000098	1.800000	0.000061
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000491	9.001000	0.000304
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000491	9.001000	0.000304
		Silver and its compounds	Silver, metal	7440-22-4	0.002343	42.954000	0.001450
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000153	2.800000	0.000095
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000098	1.800000	0.000061
			Subtotal		0.005454	100.0000000	0.003376
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	34.965000	0.000216
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.035000	0.000403
			Subtotal		0.001000	100.0000000	0.000619
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.008726	99.990000	0.005402
			Subtotal		0.008727	100.0000000	0.005402

Resistor 2	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.330232	96.100000	0.204414
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.001375	0.400000	0.000851
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005155	1.500000	0.003191
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.006873	2.000000	0.004254
			Subtotal		0.343633	100.0000000	0.212709
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.001355	13.799000	0.000839
		Boron and its compounds	Boron oxide	1303-86-2	0.000118	1.200000	0.000073
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000452	4.608000	0.000280
		Silver and its compounds	Silver, metal	7440-22-4	0.007894	80.393000	0.004886
			Subtotal		0.009819	100.0000000	0.006078
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000589	4.500000	0.000365
		Boron and its compounds	Boron oxide	1303-86-2	0.000026	0.200000	0.000016
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000353	2.700000	0.000219
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000484	3.700000	0.000300
		Silver and its compounds	Silver, metal	7440-22-4	0.011638	88.900000	0.007204
			Subtotal		0.013090	100.0000000	0.008103
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.002173	16.600000	0.001345
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000563	4.300000	0.000348
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.003273	25.000000	0.002026
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.007082	54.100000	0.004384
			Subtotal		0.013090	100.0000000	0.008103
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.019636	99.990000	0.012155
			Subtotal		0.019638	100.0000000	0.012156
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000439	6.698000	0.000271
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.004942	75.476000	0.003059
		Boron and its compounds	Boron oxide	1303-86-2	0.000068	1.031000	0.000042
		Inorganic Silicon compounds	Quartz	14808-60-7	0.001100	16.795000	0.000681
			Subtotal		0.006548	100.0000000	0.004053
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000900	5.501000	0.000557
		Boron and its compounds	Boron oxide	1303-86-2	0.000147	0.900000	0.000091
		Copper and its compounds	Cupric oxide	1317-38-0	0.000147	0.900000	0.000091
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003224	19.702000	0.001995
		Lead and its compounds	Lead monooxide	1317-36-8	0.000923	5.641000	0.000571
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000295	1.800000	0.000182
		Palladium and its compounds	Palladium, metal	7440-05-3	0.001473	9.001000	0.000912
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.001473	9.001000	0.000912
		Silver and its compounds	Silver, metal	7440-22-4	0.007028	42.954000	0.004350
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000458	2.800000	0.000284
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000295	1.800000	0.000182
			Subtotal		0.016362	100.0000000	0.010128
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000573	34.965000	0.000354
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001065	65.035000	0.000659
			Subtotal		0.001638	100.0000000	0.001014
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.026178	99.990000	0.016204
			Subtotal		0.026181	100.0000000	0.016206

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	8.509402	89.600000	5.267326
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.085474	0.900000	0.052908
		Nickel and its compounds	Nickel, metal	7440-02-0	0.047485	0.500000	0.029394
		Silver and its compounds	Silver, metal	7440-22-4	0.029916	0.315000	0.018518
		Tin and its compounds	Tin, metal	7440-31-5	0.824823	8.685000	0.510566
			Subtotal		9.497100	100.0000000	5.878712

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	17.018803	89.600000	10.534652
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.170948	0.900000	0.105817
		Nickel and its compounds	Nickel, metal	7440-02-0	0.094971	0.500000	0.058787
		Silver and its compounds	Silver, metal	7440-22-4	0.059832	0.315000	0.037036
		Tin and its compounds	Tin, metal	7440-31-5	1.649646	8.685000	1.021132
			Subtotal		18.994200	100.0000000	11.757424

Semiconductor Die 3	Die	Inorganic Silicon compounds	Silicon	7440-21-3	18.614316	98.000000	11.522275
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.379884	2.000000	0.235149
			Subtotal		18.994200	100.0000000	11.757424

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.046857	2.986400	0.029004
		Glycol Ethers and Acetates - Specific	2-(2-butoxyethoxy)ethanol	112-34-5	0.042647	2.718100	0.026398
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.195355	12.450900	0.120925
		Silver and its compounds	Silver, metal	7440-22-4	0.067550	4.305300	0.041814
		Tin and its compounds	Tin, metal	7440-31-5	1.216592	77.539300	0.753071
			Subtotal		1.569000	100.0000000	0.971212

Substrate, Pre-plated NiPdAu	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.002027	99.990000	0.001255
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
			Subtotal		0.002028	100.0000000	0.001255
	Palladium Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Palladium and its compounds	Palladium, metal	7440-05-3	0.002027	99.990000	0.001255
			Subtotal		0.002028	100.0000000	0.001255
	Solder Mask	Barium and its compounds	Barium sulfate	7727-43-7	0.006962	21.000000	0.004310
		Cyanide compounds	Phthalocyanine Blue	57455-37-5	0.000331	1.000000	0.000205
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.001658	5.000000	0.001026
		Magnesium and its compounds	Talc	14807-96-6	0.001658	5.000000	0.001026
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.003315	10.000000	0.002052
		Organic compounds	Proprietary Material-Other organic compounds.		0.000166	0.500000	0.000103
		Polymers	Plastic: EP - Epoxide, Epoxy		0.004973	15.000000	0.003078
		Polymers	Plastic: PAK		0.014091	42.500000	0.008722
			Subtotal		0.033154	100.0000000	0.020522
	Substrate Core	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.221442	23.000000	0.137073
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.437107	45.400000	0.270569
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.079912	8.300000	0.049465
		Polymers	BT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]		0.224330	23.300000	0.138860
			Subtotal		0.962790	100.0000000	0.595968

			Total		161.550698	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 A3M39TL039T2 Product content declaration of A3M39TL039T2		上次修订 Last Revision (GMT): Friday, 28 May 2021, 07:02:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	电容器 Capacitor	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	电容器 Capacitor	O	O	O	O	O	O
电容器 Capacitor 8	电容器 Capacitor	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	电感 Inductor	O	O	O	O	O	O
电感 Inductor 2	电感 Inductor	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic 1	O	O	O	O	O	O
	陶瓷的 Ceramic 2	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	陶瓷的 Ceramic 1	O	O	O	O	O	O
	陶瓷的 Ceramic 2	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 5	电感 Inductor	O	O	O	O	O	O
电阻 Resistor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	镀金材料 Gold Plating	O	O	O	O	O	O
	钯镀层 Palladium Plating	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O
	有机基质芯 Substrate Core	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of A3M39TL039T2		Last Revision (GMT): Friday, 28 May 2021, 07:02:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 13 Jul 2023	Test Report 13 Jul 2023	Test Report 13 Jul 2023	Test Report 13 Jul 2023
Capacitor 1	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 5	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Capacitor 6	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 7	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Not Available
Capacitor 8	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Die Encapsulant		Test Report 17 Feb 2023	Test Report 17 Feb 2023	Test Report 17 Feb 2023	Test Report 17 Feb 2023
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Inductor 2	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Inductor 3	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Inductor 4	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Inductor 5	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Not Available	Not Available
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 4 Jun 2021
Resistor 1	1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	ALUMINA SUBSTRATE	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Resistor 2	1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	ALUMINA SUBSTRATE	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Semiconductor Die 1		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Semiconductor Die 2	CU PILLAR	Test Report 22 Jan 2020	Test Report 22 Jan 2020	Test Report 22 Jan 2020	Not Available
	SOLDER BUMP	Test Report 31 Aug 2020	Test Report 31 Aug 2020	Test Report 31 Aug 2020	Not Available
	WAFER	Test Report 18 Jul 2022	Test Report 18 Jul 2022	Test Report 18 Jul 2022	Test Report 18 Jul 2022
Semiconductor Die 3		Test Report 18 Jul 2022	Test Report 18 Jul 2022	Test Report 18 Jul 2022	Test Report 18 Jul 2022
Solder Paste		Test Report 14 Oct 2022	Test Report 14 Oct 2022	Test Report 15 Feb 2020	Test Report 14 Oct 2022
Substrate, Pre-plated NiPdAu		Not Available	Not Available	Not Available	Not Available
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Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer