AFSC5G35E38T2

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NXP Semiconductors
Product content declaration of AFSC5G35E38T2Last Revision (GMT):
Wednesday, 03 May 2023, 08:20:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
AFSC5G35E38T2SOT1831HLLGA27159.425578 mg YesNoYesNickel/Palladium/Gold (Ni/Pd/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 089 765282023-11-244Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.57504099.9900000.360695
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000580.0100000.000036
Subtotal0.575098100.00000000.360731
Capacitor 1CeramicCalcium and its compoundsCalcium monoxide1305-78-80.05350025.0000000.033558
Manganese and its compoundsManganese oxide1344-43-00.0107005.0000000.006712
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02140010.0000000.013423
Zirconium and its compoundsZirconium oxide1314-23-40.12840060.0000000.080539
Subtotal0.214000100.00000000.134232
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00899999.9900000.005645
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.009000100.00000000.005645
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699999.9900000.004390
Subtotal0.007000100.00000000.004391
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0016002.0000000.001004
Copper and its compoundsCopper, metal7440-50-80.07200090.0000000.045162
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0064008.0000000.004014
Subtotal0.080000100.00000000.050180
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01999899.9900000.012544
Subtotal0.020000100.00000000.012545
Capacitor 2CeramicBarium and its compoundsBarium oxide1304-28-50.13200060.0000000.082797
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02200010.0000000.013799
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.06600030.0000000.041399
Subtotal0.220000100.00000000.137995
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00799999.9900000.005018
Subtotal0.008000100.00000000.005018
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699999.9900000.004390
Subtotal0.007000100.00000000.004391
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0015202.0000000.000953
Copper and its compoundsCopper, metal7440-50-80.06840090.0000000.042904
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0060808.0000000.003814
Subtotal0.076000100.00000000.047671
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01899899.9900000.011917
Subtotal0.019000100.00000000.011918
Capacitor 3CeramicCalcium and its compoundsCalcium monoxide1305-78-80.10251225.0000000.064301
Manganese and its compoundsManganese oxide1344-43-00.0205025.0000000.012860
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.04100510.0000000.025720
Zirconium and its compoundsZirconium oxide1314-23-40.24602960.0000000.154322
Subtotal0.410048100.00000000.257203
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.01704699.9000000.010692
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000170.1000000.000011
Subtotal0.017063100.00000000.010703
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000260.1000000.000016
Nickel and its compoundsNickel, metal7440-02-00.02556999.9000000.016038
Subtotal0.025594100.00000000.016054
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0051232.0000000.003214
Copper and its compoundsCopper, metal7440-50-80.23055790.0000000.144617
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0204948.0000000.012855
Subtotal0.256174100.00000000.160686
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000600.1000000.000037
Tin and its compoundsTin, metal7440-31-50.05966099.9000000.037422
Subtotal0.059720100.00000000.037460
Capacitor 4CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400825.0000000.015059
Manganese and its compoundsManganese oxide1344-43-00.0048025.0000000.003012
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960310.0000000.006024
Zirconium and its compoundsZirconium oxide1314-23-40.05761860.0000000.036141
Subtotal0.096030100.00000000.060235
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399299.9000000.002504
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.1000000.000003
Subtotal0.003996100.00000000.002507
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00598899.9000000.003756
Subtotal0.005994100.00000000.003760
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000753
Copper and its compoundsCopper, metal7440-50-80.05399590.0000000.033868
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0047998.0000000.003011
Subtotal0.059994100.00000000.037631
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.1000000.000009
Tin and its compoundsTin, metal7440-31-50.01397299.9000000.008764
Subtotal0.013986100.00000000.008773
Capacitor 5CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400825.0000000.015059
Manganese and its compoundsManganese oxide1344-43-00.0048025.0000000.003012
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960310.0000000.006024
Zirconium and its compoundsZirconium oxide1314-23-40.05761860.0000000.036141
Subtotal0.096030100.00000000.060235
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399299.9000000.002504
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.1000000.000003
Subtotal0.003996100.00000000.002507
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00598899.9000000.003756
Subtotal0.005994100.00000000.003760
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000753
Copper and its compoundsCopper, metal7440-50-80.05399590.0000000.033868
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0047998.0000000.003011
Subtotal0.059994100.00000000.037631
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.1000000.000009
Tin and its compoundsTin, metal7440-31-50.01397299.9000000.008764
Subtotal0.013986100.00000000.008773
Capacitor 6CeramicCalcium and its compoundsCalcium monoxide1305-78-80.06230325.0000000.039080
Manganese and its compoundsManganese oxide1344-43-00.0124615.0000000.007816
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02492110.0000000.015632
Zirconium and its compoundsZirconium oxide1314-23-40.14952860.0000000.093791
Subtotal0.249213100.00000000.156319
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.01048099.9900000.006574
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.010481100.00000000.006574
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00815199.9900000.005113
Subtotal0.008152100.00000000.005113
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0018632.0000000.001169
Copper and its compoundsCopper, metal7440-50-80.08384790.0000000.052593
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0074538.0000000.004675
Subtotal0.093163100.00000000.058437
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.02328999.9900000.014608
Subtotal0.023291100.00000000.014609
Capacitor 7CeramicCalcium and its compoundsCalcium monoxide1305-78-80.06230325.0000000.039080
Manganese and its compoundsManganese oxide1344-43-00.0124615.0000000.007816
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02492110.0000000.015632
Zirconium and its compoundsZirconium oxide1314-23-40.14952860.0000000.093791
Subtotal0.249213100.00000000.156319
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.01048099.9900000.006574
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.010481100.00000000.006574
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00815199.9900000.005113
Subtotal0.008152100.00000000.005113
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0018632.0000000.001169
Copper and its compoundsCopper, metal7440-50-80.08384790.0000000.052593
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0074538.0000000.004675
Subtotal0.093163100.00000000.058437
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.02328999.9900000.014608
Subtotal0.023291100.00000000.014609
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins4.8911005.0000003.067952
Inorganic Silicon compoundsSilica, vitreous60676-86-085.10514087.00000053.382362
Inorganic Silicon compoundsSilicon dioxide7631-86-92.9346603.0000001.840771
Inorganic compoundsCarbon Black1333-86-40.4891100.5000000.306795
Magnesium and its compoundsProprietary Material-Other magnesium compounds0.0978220.1000000.061359
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.2716861.3000000.797667
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins2.9346603.0000001.840771
Zinc and its compoundsProprietary Material-Other zinc compounds0.0978220.1000000.061359
Subtotal97.822000100.000000061.359037
Epoxy AdhesiveEpoxy AdhesiveAnhydridesProprietary Material - Other anhydrides0.0281703.0000000.017670
Epoxy ResinsProprietary Material-Other Epoxy resins0.0610356.5000000.038284
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0046950.5000000.002945
Silver and its compoundsSilver, metal7440-22-40.84510090.0000000.530091
Subtotal0.939000100.00000000.588990
Inductor 1InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.01984024.8000000.012445
Boron and its compoundsBoron oxide1303-86-20.0054406.8000000.003412
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0003200.4000000.000201
Inorganic Silicon compoundsSilicon dioxide7631-86-90.02816035.2000000.017663
Nickel and its compoundsNickel, metal7440-02-00.0038404.8000000.002409
Silver and its compoundsSilver, metal7440-22-40.01744021.8000000.010939
Tin and its compoundsTin, metal7440-31-50.0049606.2000000.003111
Subtotal0.080000100.00000000.050180
Inductor 2CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04117740.0000000.025828
Boron and its compoundsBoron oxide1303-86-20.01029410.0000000.006457
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05147150.0000000.032285
Subtotal0.102942100.00000000.064571
GlassAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0003915.0000000.000245
Boron and its compoundsBoron oxide1303-86-20.00117415.0000000.000736
Cobalt and its compoundsCobalt oxide1307-96-60.0003915.0000000.000245
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00547770.0000000.003436
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0003915.0000000.000245
Subtotal0.007824100.00000000.004908
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000210.1000000.000013
Silver and its compoundsSilver, metal7440-22-40.02056899.9000000.012901
Subtotal0.020589100.00000000.012914
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000070.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00678799.9000000.004257
Subtotal0.006794100.00000000.004261
Outer ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000280.1000000.000017
Silver and its compoundsSilver, metal7440-22-40.02776699.9000000.017416
Subtotal0.027793100.00000000.017434
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000090.1000000.000006
Tin and its compoundsTin, metal7440-31-50.00904999.9000000.005676
Subtotal0.009058100.00000000.005682
Inductor 3CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.08235240.0000000.051656
Boron and its compoundsBoron oxide1303-86-20.02058810.0000000.012914
Inorganic Silicon compoundsQuartz14808-60-70.10294050.0000000.064570
Subtotal0.205880100.00000000.129139
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000003
Silver and its compoundsSilver, metal7440-22-40.04117399.9900000.025826
Subtotal0.041177100.00000000.025829
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01358699.9900000.008522
Subtotal0.013587100.00000000.008523
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.0100000.000003
Silver and its compoundsSilver, metal7440-22-40.05558199.9900000.034864
Subtotal0.055587100.00000000.034867
Protective CoatingAluminum and its compoundsAluminum oxide1302-74-50.0007835.0000000.000491
Boron and its compoundsBoron oxide1303-86-20.00234815.0000000.001473
Cobalt and its compoundsCobalt oxide1307-96-60.0007835.0000000.000491
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01095670.0000000.006872
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0007835.0000000.000491
Subtotal0.015652100.00000000.009818
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01811499.9900000.011362
Subtotal0.018116100.00000000.011363
ResistorAlumina SubstrateAluminum and its compoundsAluminum oxide1302-74-50.19584196.0000000.122842
Inorganic Silicon compoundsQuartz14808-60-70.0051002.5000000.003199
Magnesium and its compoundsMagnesium-oxide1309-48-40.0030601.5000000.001919
Subtotal0.204001100.00000000.127960
GlazeLead and its compoundsFrits, chemicals65997-18-40.00150199.9000000.000941
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000001
Subtotal0.001502100.00000000.000942
Inner Electrode 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.0006856.0000000.000430
Palladium and its compoundsPalladium, metal7440-05-30.0000570.5000000.000036
PolymersEthyl cellulose9004-57-30.0007426.5000000.000465
Silver and its compoundsSilver, metal7440-22-40.00993487.0000000.006231
Subtotal0.011418100.00000000.007162
Inner Electrode 2Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000130.1000000.000008
Nickel and its compoundsNickel, metal7440-02-00.01315899.9000000.008253
Subtotal0.013171100.00000000.008262
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000110.1000000.000007
Tin and its compoundsTin, metal7440-31-50.01100799.9000000.006904
Subtotal0.011018100.00000000.006911
Protective CoatingInorganic Silicon compoundsSilicon dioxide7631-86-90.00194246.7300000.001218
Inorganic compoundsCarbon Black1333-86-40.0002726.5400000.000170
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.00194246.7300000.001218
Subtotal0.004157100.00000000.002607
Resistive LayerInorganic Silicon compoundsSilicon dioxide7631-86-90.00287556.0000000.001803
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0001773.4400000.000111
Ruthenium and its compoundsRuthenium oxide12036-10-10.00208240.5600000.001306
Subtotal0.005133100.00000000.003220
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-38.50940289.6000005.337538
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0854740.9000000.053614
Nickel and its compoundsNickel, metal7440-02-00.0474850.5000000.029785
Silver and its compoundsSilver, metal7440-22-40.0299160.3150000.018765
Tin and its compoundsTin, metal7440-31-50.8248238.6850000.517372
Subtotal9.497100100.00000005.957074
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.0027751.0200000.001741
Inorganic Silicon compoundsSilicon, doped0.26391997.0004000.165544
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0053861.9796000.003378
Subtotal0.272080100.00000000.170663
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.0167661.0200000.010516
Inorganic Silicon compoundsSilicon7440-21-31.59439697.0004001.000088
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0325391.9796000.020410
Subtotal1.643700100.00000001.031014
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.0006272.9864000.000393
Glycol Ethers and Acetates - Specific2-(2-butoxyethoxy)ethanol112-34-50.0005712.7181000.000358
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.00261512.4509000.001640
Silver and its compoundsSilver, metal7440-22-40.0009044.3053000.000567
Tin and its compoundsTin, metal7440-31-50.01628377.5393000.010214
Subtotal0.021000100.00000000.013172
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0430942.9864000.027031
Glycol Ethers and Acetates - Specific2-(2-butoxyethoxy)ethanol112-34-50.0392222.7181000.024602
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.17966712.4509000.112696
Silver and its compoundsSilver, metal7440-22-40.0621264.3053000.038968
Tin and its compoundsTin, metal7440-31-51.11889277.5393000.701827
Subtotal1.443000100.00000000.905124
Substrate, Pre-plated NiPdAuSubstrate, Pre-plated NiPdAuAcrylatesProprietary Material-Other acrylates0.8159941.8630000.511834
Aliphatic AminesProprietary Material-Other aliphatic amines0.0600060.1370000.037639
Barium and its compoundsBarium sulfate7727-43-70.3600360.8220000.225833
Cyanide compoundsPhthalocyanine Blue57455-37-50.0118260.0270000.007418
Epoxy ResinsOther Epoxy resins0.3600360.8220000.225833
Gold and its compoundsGold, metal7440-57-50.0109500.0250000.006868
Inorganic Silicon compoundsFibrous-glass-wool65997-17-312.23334027.9300007.673386
Inorganic Silicon compoundsSilica, vitreous60676-86-00.3600360.8220000.225833
Inorganic Silicon compoundsSilicon dioxide7631-86-916.83058838.42600010.557019
Magnesium and its compoundsTalc14807-96-60.0600060.1370000.037639
Miscellaneous substancesProprietary Material-Other miscellaneous substances.3.2687947.4630002.050357
Nickel and its compoundsNickel, metal7440-02-00.6000601.3700000.376389
Palladium and its compoundsPalladium, metal7440-05-30.0109500.0250000.006868
PolymersAcrylic acid ester copolymer78506-70-40.1800180.4110000.112917
PolymersBT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]8.63736019.7200005.417801
Subtotal43.800000100.000000027.473634
Total159.425578100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 AFSC5G35E38T2
Product content declaration of AFSC5G35E38T2
上次修订 Last Revision (GMT):
Wednesday, 03 May 2023, 08:20:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 4
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 5
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 6
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 7
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
电感
Inductor 1
电感
Inductor
OOOOOO
电感
Inductor 2
陶瓷的
Ceramic
OOOOOO

玻璃
Glass
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电阻
Resistor
氧化铝基材
Alumina Substrate
OOOOOO


Glaze
XOOOOO

内电极
Inner Electrode 1
OOOOOO

内电极
Inner Electrode 2
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
基板,预镀镍钯金
Substrate, Pre-plated NiPdAu
基板,预镀镍钯金
Substrate, Pre-plated NiPdAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of AFSC5G35E38T2Last Revision (GMT):
Wednesday, 03 May 2023, 08:20:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Capacitor 1CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 2CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 3CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 4CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 5CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 6CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 7CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Die EncapsulantTest Report
17 Feb 2023
Test Report
17 Feb 2023
Test Report
17 Feb 2023
Test Report
17 Feb 2023
Epoxy AdhesiveTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Not Available
Inductor 1ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Inductor 2ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Inductor 3ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Not AvailableNot Available
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
ResistorCERAMICNot AvailableNot AvailableTest Report
13 Feb 2020
Not Available
EXTERNAL ELECTRODETest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
INTERNAL ELECTRODETest Report
27 Dec 2019
Test Report
27 Dec 2019
Test Report
27 Dec 2019Test Report
15 Sep 2020
Test Report
27 Dec 2019
NI PLATINGNot AvailableNot AvailableTest Report
4 Oct 2020
Test Report
4 Oct 2020
OVERCOATTest Report
27 Aug 2020
Test Report
27 Aug 2020
Not AvailableNot Available
OVERGLAZETest Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
RESISTIVE ELECTRODETest Report
19 Oct 2020
Test Report
19 Oct 2020
Not AvailableNot Available
SECONDARY ELECTRODETest Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
SN PLATINGTest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
SUSBTRATETest Report
13 Feb 2020
Test Report
13 Feb 2020
Not AvailableTest Report
13 Feb 2020
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 3Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Solder FluxTest Report
6 Nov 2019
Test Report
6 Nov 2019
Not AvailableNot Available
Solder PasteTest Report
14 Oct 2022
Test Report
14 Oct 2022
Test Report
15 Feb 2020
Test Report
14 Oct 2022
Substrate, Pre-plated NiPdAuAU PLATINGTest Report
25 Nov 2022
Test Report
25 Nov 2022
Test Report
25 Nov 2022
Test Report
25 Nov 2022
AUS SR-1Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
COPPER FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
CU PLATINGTest Report
2 May 2022
Test Report
2 May 2022
Test Report
2 May 2022
Test Report
2 May 2022
GHPL-970LFTest Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
8 Feb 2023
Test Report
6 Apr 2020
NI PLATINGTest Report
26 Jun 2023
Test Report
26 Jun 2023
Test Report
26 Jun 2023
Test Report
26 Jun 2023
PD PLATINGTest Report
5 Dec 2022
Test Report
5 Dec 2022
Test Report
5 Dec 2022
Test Report
5 Dec 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.