BGU7004,115

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of BGU7004,115Last Revision (GMT):
Monday, 03 October 2022, 09:48:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
BGU7004,115SOT886XSON62.172580 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 652 271152020-10-1541 / Unlimited26030 sec.1 / Unlimited24020 sec.3Seremban, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.00955399.0000000.439731
Palladium and its compoundsPalladium, metal7440-05-30.0000971.0000000.004442
Subtotal0.009650100.00000000.444172
Copper Lead-Frame, Pre-Plated NiPdAuCopper AlloyCopper and its compoundsCopper, metal7440-50-81.01752496.20000046.834812
Inorganic Silicon compoundsSilicon7440-21-30.0068750.6500000.316451
Magnesium and its compoundsMagnesium, metal7439-95-40.0015870.1500000.073027
Nickel and its compoundsNickel, metal7440-02-00.0317323.0000001.460545
Subtotal1.057717100.000000048.684836
Gold PlatingGold and its compoundsGold, metal7440-57-50.00099999.9900000.046024
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000005
Subtotal0.001000100.00000000.046028
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.0100000.000139
Nickel and its compoundsNickel, metal7440-02-00.03008199.9900001.384575
Subtotal0.030084100.00000001.384713
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000005
Palladium and its compoundsPalladium, metal7440-05-30.00119899.9900000.055182
Subtotal0.001199100.00000000.055188
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.0240003.0000001.104677
Inorganic Silicon compoundsSilica, vitreous60676-86-00.56000070.00000025.775806
Inorganic Silicon compoundsSilicon dioxide7631-86-90.16400020.5000007.548629
Inorganic compoundsCarbon Black1333-86-40.0040000.5000000.184113
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.0240003.0000001.104677
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0240003.0000001.104677
Subtotal0.800000100.000000036.822580
Epoxy AdhesiveEpoxy AdhesiveAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.00800040.0000000.368226
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0010005.0000000.046028
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.00200010.0000000.092056
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-30.00300015.0000000.138085
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.00600030.0000000.276169
Subtotal0.020000100.00000000.920564
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000010.0030000.000041
Bismuth and its compoundsBismuth, metal7440-69-90.0000010.0010000.000014
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000014
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000020.0050000.000069
Tin and its compoundsTin, metal7440-31-50.02999699.9900001.380709
Subtotal0.030000100.00000001.380847
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.21847198.00000010.055851
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0044592.0000000.205221
Subtotal0.222930100.000000010.261072
Total2.172580100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 BGU7004,115
Product content declaration of BGU7004,115
上次修订 Last Revision (GMT):
Monday, 03 October 2022, 09:48:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of BGU7004,115Last Revision (GMT):
Monday, 03 October 2022, 09:48:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
C7025Test Report
7 Dec 2021
Test Report
7 Dec 2021
Test Report
7 Dec 2021
Test Report
7 Dec 2021
NI PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
PD PLATINGTest Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Test Report
3 May 2022
Die EncapsulantTest Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
Epoxy AdhesiveTest Report
21 Jun 2022
Test Report
21 Jun 2022
Test Report
21 Jun 2022
Test Report
21 Jun 2022
Post-plating - Lead FreeTest Report
3 Jun 2022
Test Report
3 Jun 2022
Test Report
3 Jun 2022
Test Report
3 Jun 2022
Semiconductor DieTest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.