FS32V234CMN1VUB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FS32V234CMN1VUBLast Revision (GMT):
Thursday, 28 April 2022, 07:46:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FS32V234CMN1VUBSOT1840FBGA6212143.958000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 515 775572020-05-0483 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-74.28000040.0000000.199631
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.60500015.0000000.074861
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-24.81500045.0000000.224585
Subtotal10.700000100.00000000.499077
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-81249.04651195.00620058.258908
Nickel and its compoundsNickel, metal7440-02-065.6534894.9938003.062256
Subtotal1314.700000100.000000061.321164
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-397.21600098.0000004.534417
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.9840002.0000000.092539
Subtotal99.200000100.00000004.626956
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-45.4025303.5000000.251989
Tin and its compoundsTin, metal7440-31-5148.95547096.5000006.947686
Subtotal154.358000100.00000007.199675
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8186.29837399.9800008.689460
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0372670.0200000.001738
Subtotal186.335640100.00000008.691198
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-33.39020110.4500000.158128
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.39020110.4500000.158128
Inorganic Silicon compoundsSilicon dioxide7631-86-913.57702741.8500000.633269
PolymersPlastic: EP - Epoxide, Epoxy12.08469037.2500000.563663
Subtotal32.442120100.00000001.513188
Solder BallCopper and its compoundsCopper, metal7440-50-80.0856490.5000000.003995
Silver and its compoundsSilver, metal7440-22-40.5138963.0000000.023970
Tin and its compoundsTin, metal7440-31-516.53033496.5000000.771019
Subtotal17.129880100.00000000.798984
Solder MaskBarium and its compoundsBarium sulfate7727-43-74.50279025.0000000.210022
Inorganic Silicon compoundsSilica, vitreous60676-86-01.80111610.0000000.084009
Organic compoundsOther organic compounds.0.9005585.0000000.042005
PolymersPlastic: EP - Epoxide, Epoxy10.80669660.0000000.504054
Subtotal18.011160100.00000000.840089
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3148.44060050.0000006.923671
Inorganic Silicon compoundsSilica, vitreous60676-86-059.37624020.0000002.769468
PolymersPlastic: EP - Epoxide, Epoxy89.06436030.0000004.154203
Subtotal296.881200100.000000013.847342
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-59.50400072.0000000.443292
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1320001.0000000.006157
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones1.1880009.0000000.055412
Zinc and its compoundsZinc oxide1314-13-22.37600018.0000000.110823
Subtotal13.200000100.00000000.615684
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-00.60000060.0000000.027986
Inorganic compoundsCarbon Black1333-86-40.0010000.1000000.000047
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0090000.9000000.000420
PolymersPlastic: EP - Epoxide, Epoxy0.39000039.0000000.018191
Subtotal1.000000100.00000000.046643
Total2143.958000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FS32V234CMN1VUB
Product content declaration of FS32V234CMN1VUB
上次修订 Last Revision (GMT):
Thursday, 28 April 2022, 07:46:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FS32V234CMN1VUBLast Revision (GMT):
Thursday, 28 April 2022, 07:46:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Heat SpreaderC1100Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
NI PLATINGTest Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - Lead FreeTest Report
28 Apr 2021
Test Report
28 Apr 2021
Test Report
28 Apr 2021
Test Report
13 Mar 2020
SubstrateCU FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E700GRTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
PHP-900 IR-6Test Report
17 Feb 2022
Test Report
17 Feb 2022
Test Report
17 Feb 2022
Test Report
17 Feb 2022
SR7300GRBTest Report
24 Feb 2022
Test Report
24 Feb 2022
Test Report
24 Feb 2022
Test Report
24 Feb 2022
Thermally Conductive GelTest Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.