KMA321Z

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of KMA321ZLast Revision (GMT):
Friday, 16 June 2023, 05:39:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
KMA321ZSOT1188SIL4450.211480 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 698 811412022-03-16211 / Unlimited26030 sec.1 / Unlimited23520 sec.3Bangkok, Thailand;Cabuyao, Philippines
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.04232298.9999000.009401
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0004230.9901000.000094
Palladium and its compoundsPalladium, metal7440-05-30.0000040.0100000.000001
Subtotal0.042750100.00000000.009496
Capacitor 1CeramicBarium and its compoundsBarium oxide1304-28-51.27744159.9850000.283742
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.21296010.0000000.047302
Titanium and its compoundsTitanium dioxide1317-70-00.63919930.0150000.141978
Subtotal2.129600100.00000000.473022
GlassBoron and its compoundsBoron oxide1303-86-20.00768020.0000000.001706
Inorganic Silicon compoundsSilicon dioxide7631-86-90.03072080.0000000.006823
Subtotal0.038400100.00000000.008529
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0055811.0000000.001240
Nickel and its compoundsNickel, metal7440-02-00.55249999.0000000.122720
Subtotal0.558080100.00000000.123960
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003621.0000000.000080
Nickel and its compoundsNickel, metal7440-02-00.03579899.0000000.007952
Subtotal0.036160100.00000000.008032
Outer ElectrodeCopper and its compoundsCopper, metal7440-50-80.34024399.0000000.075574
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0034371.0000000.000763
Subtotal0.343680100.00000000.076338
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0009411.0000000.000209
Palladium and its compoundsPalladium, metal7440-05-30.09313999.0000000.020688
Subtotal0.094080100.00000000.020897
Capacitor 2CeramicBarium and its compoundsBarium oxide1304-28-50.63872059.9850000.141871
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.10648010.0000000.023651
Titanium and its compoundsTitanium dioxide1317-70-00.31960030.0150000.070989
Subtotal1.064800100.00000000.236511
GlassBoron and its compoundsBoron oxide1303-86-20.00384020.0000000.000853
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01536080.0000000.003412
Subtotal0.019200100.00000000.004265
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0027901.0000000.000620
Nickel and its compoundsNickel, metal7440-02-00.27625099.0000000.061360
Subtotal0.279040100.00000000.061980
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001811.0000000.000040
Nickel and its compoundsNickel, metal7440-02-00.01789999.0000000.003976
Subtotal0.018080100.00000000.004016
Outer ElectrodeCopper and its compoundsCopper, metal7440-50-80.17012299.0000000.037787
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0017181.0000000.000382
Subtotal0.171840100.00000000.038169
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0004701.0000000.000105
Palladium and its compoundsPalladium, metal7440-05-30.04657099.0000000.010344
Subtotal0.047040100.00000000.010448
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-8155.84400099.90000034.615732
Zirconium and its compoundsZirconium, metal7440-67-70.1560000.1000000.034650
Subtotal156.000000100.000000034.650382
Die EncapsulantDie EncapsulantEpoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-65.5800002.0000001.239418
Inorganic Silicon compoundsSilica, vitreous60676-86-0220.41000079.00000048.956992
Inorganic compoundsCarbon Black1333-86-40.5580000.2000000.123942
Magnesium and its compoundsMagnesium dihydroxide1309-42-816.7400006.0000003.718253
Miscellaneous substancesProprietary Material-Other miscellaneous substances.24.5520008.8000005.453437
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-611.1600004.0000002.478835
Subtotal279.000000100.000000061.970877
Epoxy Adhesive 1Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.12000075.0000000.026654
Organic compoundsOther organic compounds.0.0024001.5000000.000533
PolymersPlastic: EP - Epoxide, Epoxy0.03760023.5000000.008352
Subtotal0.160000100.00000000.035539
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.01700010.0000000.003776
Glycidyl ethersP-Tertbutylphenyl glycidyl ether3101-60-80.0127507.5000000.002832
Guanidine compounds1-cyanoguanidine461-58-50.0008500.5000000.000189
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0119007.0000000.002643
Silver and its compoundsSilver, metal7440-22-40.12750075.0000000.028320
Subtotal0.170000100.00000000.037760
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0001740.0030000.000039
Bismuth and its compoundsBismuth, metal7440-69-90.0000580.0010000.000013
Copper and its compoundsCopper, metal7440-50-80.0000580.0010000.000013
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0002900.0050000.000064
Tin and its compoundsTin, metal7440-31-55.79942099.9900001.288155
Subtotal5.800000100.00000001.288283
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.0100000.000003
Silver and its compoundsSilver, metal7440-22-40.13998699.9900000.031093
Subtotal0.140000100.00000000.031096
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-34.01675598.0000000.892193
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0819752.0000000.018208
Subtotal4.098730100.00000000.910401
Total450.211480100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 KMA321Z
Product content declaration of KMA321Z
上次修订 Last Revision (GMT):
Friday, 16 June 2023, 05:39:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

玻璃
Glass
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

钯镀层
Palladium Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

玻璃
Glass
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

钯镀层
Palladium Plating
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of KMA321ZLast Revision (GMT):
Friday, 16 June 2023, 05:39:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
24 Apr 2023
Test Report
24 Apr 2023
Test Report
24 Apr 2023
Test Report
24 Apr 2023
Capacitor 1CERAMICTest Report
22 Dec 2022
Test Report
22 Dec 2022
Test Report
22 Dec 2022
Test Report
22 Dec 2022
INNER EELCTRODENot AvailableNot AvailableTest Report
6 Oct 2022
Test Report
6 Oct 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Not AvailableNot Available
NI PLATINGTest Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
PD PLATINGTest Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 2CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
PD PLATINGTest Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
14 Nov 2022
Test Report
14 Nov 2022
Test Report
14 Nov 2022
Test Report
14 Nov 2022
C151Test Report
5 Sep 2018
Test Report
5 Sep 2018
Test Report
5 Sep 2018
Test Report
5 Sep 2018
Die EncapsulantTest Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
Epoxy Adhesive 1Test Report
30 Mar 2023
Test Report
30 Mar 2023
Test Report
30 Mar 2023
Test Report
30 Mar 2023
Epoxy Adhesive 2Test Report
5 Oct 2022
Test Report
5 Oct 2022
Test Report
5 Oct 2022
Test Report
5 Oct 2022
Post-plating - Lead FreeTest Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Pre-plating - Precious metal - AgTest Report
29 Dec 2021
Test Report
29 Dec 2021
Test Report
29 Dec 2021
Not Available
Semiconductor DieTest Report
20 Jun 2023
Test Report
20 Jun 2023
Test Report
20 Jun 2023
Test Report
20 Jun 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.