LPC54016JBD100Y

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC54016JBD100YLast Revision (GMT):
Saturday, 13 November 2021, 02:13:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC54016JBD100YSOT407LQFP100700.581160 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 509 385182020-11-12-3 / 168 hours26030 sec.3 / 168 hours24020 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.00222196.5500000.000317
Gold and its compoundsGold, metal7440-57-50.0000080.3500000.000001
Palladium and its compoundsPalladium, metal7440-05-30.0000713.1000000.000010
Subtotal0.002300100.00000000.000328
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-8159.91326096.20000022.825801
Inorganic Silicon compoundsSilicon7440-21-31.0804950.6500000.154228
Magnesium and its compoundsMagnesium, metal7439-95-40.2493450.1500000.035591
Nickel and its compoundsNickel, metal7440-02-04.9869003.0000000.711823
Subtotal166.230000100.000000023.727444
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins17.8241003.5000002.544188
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-617.8241003.5000002.544188
Inorganic Silicon compoundsQuartz14808-60-72.5463000.5000000.363455
Inorganic Silicon compoundsSilica, vitreous60676-86-0377.36166074.10000053.864089
Inorganic Silicon compoundsSilicon dioxide7631-86-961.11120012.0000008.722929
Inorganic compoundsCarbon Black1333-86-42.0370400.4000000.290764
Phenols and Phenolic ResinsOther phenolic resins30.5556006.0000004.361465
Subtotal509.260000100.000000072.691078
Epoxy AdhesiveEpoxy AdhesiveAcrylatesEthylene dimethacrylate97-90-50.0772853.3897000.011032
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.0936994.1096000.013374
Guanidine compounds1-cyanoguanidine461-58-50.0047880.2100000.000683
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2083719.1391000.029743
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.1404346.1594000.020045
Silver and its compoundsSilver, metal7440-22-41.75542276.9922000.250567
Subtotal2.280000100.00000000.325444
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0002450.0030000.000035
Bismuth and its compoundsBismuth, metal7440-69-90.0000820.0010000.000012
Copper and its compoundsCopper, metal7440-50-80.0000820.0010000.000012
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0004090.0050000.000058
Tin and its compoundsTin, metal7440-31-58.16918399.9900001.166058
Subtotal8.170000100.00000001.166175
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000120.0100000.000002
Silver and its compoundsSilver, metal7440-22-40.11998899.9900000.017127
Subtotal0.120000100.00000000.017129
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-314.22848398.0000002.030954
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2903772.0000000.041448
Subtotal14.518860100.00000002.072402
Total700.581160100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC54016JBD100Y
Product content declaration of LPC54016JBD100Y
上次修订 Last Revision (GMT):
Saturday, 13 November 2021, 02:13:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC54016JBD100YLast Revision (GMT):
Saturday, 13 November 2021, 02:13:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Copper Lead-FrameAG PLATINGTest Report
18 Jan 2021
Test Report
18 Jan 2021
Test Report
18 Jan 2021
Test Report
18 Jan 2021
C7025Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Die EncapsulantTest Report
20 Apr 2021
Test Report
20 Apr 2021
Test Report
20 Apr 2021
Test Report
20 Apr 2021
Epoxy AdhesiveTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Post-plating - Lead FreeTest Report
28 May 2021
Test Report
28 May 2021
Test Report
28 May 2021
Test Report
28 May 2021
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.