MC07XSF517BEKR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC07XSF517BEKR2Last Revision (GMT):
Thursday, 30 June 2022, 08:39:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC07XSF517BEKR2SOT1747HSOP54771.126748 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 705 195182020-03-1673 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-50.11600399.9900000.015043
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000120.0100000.000002
Subtotal0.116015100.00000000.015045
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.42702398.8200000.185057
Gold and its compoundsGold, metal7440-57-50.0011550.0800000.000150
Palladium and its compoundsPalladium, metal7440-05-30.0158851.1000000.002060
Subtotal1.444063100.00000000.187267
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-8195.91099597.29100025.405810
Iron and its compoundsIron, metal7439-89-64.7723742.3700000.618883
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0342320.0170000.004439
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3342680.1660000.043348
Tin and its compoundsTin, metal7440-31-50.0604100.0300000.007834
Zinc and its compoundsZinc, metal7440-66-60.2537210.1260000.032903
Subtotal201.366000100.000000026.113217
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0002030.0100000.000026
Silver and its compoundsSilver, metal7440-22-42.03379799.9900000.263744
Subtotal2.034000100.00000000.263770
Die EncapsulantDie EncapsulantEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-216.4310003.0000002.130778
Epoxy ResinsProprietary Material-Other Epoxy resins16.4310003.0000002.130778
Inorganic Silicon compoundsSilica, vitreous60676-86-0479.23750087.50000062.147695
Inorganic Silicon compoundsSilicon dioxide7631-86-916.4310003.0000002.130778
Inorganic compoundsCarbon Black1333-86-42.7385000.5000000.355130
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins16.4310003.0000002.130778
Subtotal547.700000100.000000071.025937
Epoxy Adhesive 1Epoxy AdhesiveCyanide compoundsPolymethylene polyphenyl isocyanate (PAPI)9016-87-90.0107100.5100000.001389
Epoxy ResinsOther Non-halogenated Epoxy resins0.0914764.3560000.011863
Organic Tin compounds - SpecificDibutyltin dilaurate77-58-70.0007140.0340000.000093
Organic compoundsAlkanes, C14-1690622-46-10.29400014.0000000.038126
Polymers1,3-Benzenedicarboxylic acid, polymer with 1,4-benzenedicarboxylic acid, 1,4-butanediol and hexanedioic acid66027-02-90.1071005.1000000.013889
Silver and its compoundsSilver, metal7440-22-41.59600076.0000000.206970
Subtotal2.100000100.00000000.272329
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.94500045.0000000.122548
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0002100.0100000.000027
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1050005.0000000.013616
PolymersPlastic: EP - Epoxide, Epoxy1.04979049.9900000.136137
Subtotal2.100000100.00000000.272329
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0010600.0200000.000138
Tin and its compoundsTin, metal7440-31-55.29894099.9800000.687168
Subtotal5.300000100.00000000.687306
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped3.88733798.0000000.504111
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0793332.0000000.010288
Subtotal3.966670100.00000000.514399
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped4.90000098.0000000.635434
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1000002.0000000.012968
Subtotal5.000000100.00000000.648402
Total771.126748100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC07XSF517BEKR2
Product content declaration of MC07XSF517BEKR2
上次修订 Last Revision (GMT):
Thursday, 30 June 2022, 08:39:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC07XSF517BEKR2Last Revision (GMT):
Thursday, 30 June 2022, 08:39:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
1 Oct 2021
Test Report
1 Oct 2021
Test Report
1 Oct 2021
Test Report
1 Oct 2021
Bonding Wire - CuPdTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Copper Lead-FrameAG PLATINGTest Report
15 Nov 2021
Test Report
15 Nov 2021
Test Report
15 Nov 2021
Test Report
15 Nov 2021
CDA 194Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
Die EncapsulantTest Report
25 Feb 2021
Test Report
25 Feb 2021
Test Report
25 Feb 2021
Test Report
25 Feb 2021
Epoxy Adhesive 1Test Report
6 Jul 2021
Test Report
6 Jul 2021
Test Report
6 Jul 2021
Test Report
6 Jul 2021
Epoxy Adhesive 2Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Post-plating - Lead FreeTest Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
23 Jul 2021
Semiconductor Die 1Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Semiconductor Die 2Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.