MC7447AHX1167NB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of MC7447AHX1167NBLast Revision (GMT):
Tuesday, 06 August 2024, 09:47:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC7447AHX1167NBSOT1603-1CBGA3604236.780700 mg NoNoNoTin/Lead (Sn10Pb90)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 134 851572023-11-2417Not ApplicableNot ApplicableNot Applicable1 / Unlimited26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-753.36640065.4000001.259598
Copper and its compoundsCopper, metal7440-50-811.26080013.8000000.265787
Nickel and its compoundsNickel, metal7440-02-015.91200019.5000000.375568
Tin and its compoundsTin, metal7440-31-51.0608001.3000000.025038
Subtotal81.600000100.00000001.925991
Ceramic SubstrateCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-159.3920943.1016001.401821
Barium and its compoundsBarium oxide1304-28-5360.17850418.8094008.501231
Boron and its compoundsBoron oxide1303-86-278.5505254.1021001.854014
Calcium and its compoundsCalcium monoxide1305-78-844.0653492.3012001.040067
Chromium and Chromium III compoundsDichromium trioxide1308-38-97.6633720.4002000.180877
Copper and its compoundsCuprous oxide1317-39-11.9168000.1001000.045242
Inorganic Silicon compoundsSilicon dioxide7631-86-91320.01302868.93430031.156039
Strontium and its compoundsStrontium Oxide1314-11-04.7891290.2501000.113037
Zirconium and its compoundsZirconium oxide1314-23-438.3168622.0010000.904386
Subtotal1914.885664100.000000045.196714
Copper PlatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.1747050.0700000.004124
Barium and its compoundsBarium oxide1304-28-51.0731860.4300000.025330
Boron and its compoundsBoron oxide1303-86-20.1996620.0800000.004713
Calcium and its compoundsCalcium monoxide1305-78-80.1497470.0600000.003534
Copper and its compoundsCopper, metal7440-50-8238.89620495.7200005.638626
Inorganic Silicon compoundsSilicon dioxide7631-86-97.6620493.0700000.180846
Magnesium and its compoundsMagnesium-oxide1309-48-41.4225950.5700000.033577
Subtotal249.578149100.00000005.890750
Gold PlatingGold and its compoundsGold, metal7440-57-52.54137199.9900000.059984
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0002540.0100000.000006
Subtotal2.541625100.00000000.059990
Nickel PlatingLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0081030.0600000.000191
Nickel and its compoundsNickel, metal7440-02-012.13609889.8600000.286446
Palladium and its compoundsPalladium, metal7440-05-30.1458601.0800000.003443
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-01.2155019.0000000.028689
Subtotal13.505562100.00000000.318769
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped135.10740989.1000003.188917
Lead and its compoundsLead, metallic lead and lead alloys7439-92-114.2805959.4177000.337062
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.3647210.9000000.032211
Nickel and its compoundsNickel, metal7440-02-00.1251000.0825000.002953
Tin and its compoundsTin, metal7440-31-50.7515060.4956000.017738
Titanium and its compoundsTitanium, metal7440-32-60.0063690.0042000.000150
Subtotal151.635700100.00000003.579031
Solder Ball - High LeadSolder Ball - High LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-11297.69093089.50000030.629174
Tin and its compoundsTin, metal7440-31-5152.24307010.5000003.593367
Subtotal1449.934000100.000000034.222541
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-843.55045096.5000001.027914
Silver and its compoundsSilver, metal7440-22-41.3539003.0000000.031956
Tin and its compoundsTin, metal7440-31-50.2256500.5000000.005326
Subtotal45.130000100.00000001.065196
Solder PasteSolder PasteLead and its compoundsLead, metallic lead and lead alloys7439-92-1103.45570037.0000002.441847
Tin and its compoundsTin, metal7440-31-5176.15430063.0000004.157739
Subtotal279.610000100.00000006.599586
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amines1.4508003.0000000.034243
Epoxy Resins(Chloromethyl)oxirane,homopolymer61788-97-414.02440029.0000000.331016
Inorganic Silicon compoundsSilica, vitreous60676-86-016.44240034.0000000.388087
Inorganic Silicon compoundsSilicon dioxide7631-86-916.44240034.0000000.388087
Subtotal48.360000100.00000001.141433
Total4236.780700100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC7447AHX1167NB
Product content declaration of MC7447AHX1167NB
上次修订 Last Revision (GMT):
Tuesday, 06 August 2024, 09:47:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
陶瓷基板
Ceramic Substrate
陶瓷的
Ceramic
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊球 - 高铅
Solder Ball - High Lead
焊球 - 高铅
Solder Ball - High Lead
XOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
XOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC7447AHX1167NBLast Revision (GMT):
Tuesday, 06 August 2024, 09:47:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Ceramic SubstrateAU PLATINGNot AvailableNot AvailableNot AvailableNot Available
CERAMICNot AvailableNot AvailableNot AvailableNot Available
METALLIZATIONNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieBUMPNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Solder Ball - High LeadNot AvailableNot AvailableNot AvailableNot Available
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Solder PasteNot AvailableNot AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.