MC7447AVU1420LB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC7447AVU1420LBLast Revision (GMT):
Tuesday, 21 May 2024, 06:57:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC7447AVU1420LBSOT1603-4CBGA3603125.869700 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 093 361572023-11-2411Not ApplicableNot ApplicableNot Applicable1 / Unlimited26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-753.36640065.4000001.707250
Copper and its compoundsCopper, metal7440-50-811.26080013.8000000.360245
Nickel and its compoundsNickel, metal7440-02-015.91200019.5000000.509042
Tin and its compoundsTin, metal7440-31-51.0608001.3000000.033936
Subtotal81.600000100.00000002.610473
Ceramic SubstrateCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-159.3920943.1016001.900018
Barium and its compoundsBarium oxide1304-28-5360.17850418.80940011.522505
Boron and its compoundsBoron oxide1303-86-278.5505254.1021002.512917
Calcium and its compoundsCalcium monoxide1305-78-844.0653492.3012001.409699
Chromium and Chromium III compoundsDichromium trioxide1308-38-97.6633720.4002000.245160
Copper and its compoundsCuprous oxide1317-39-11.9168000.1001000.061321
Inorganic Silicon compoundsSilicon dioxide7631-86-91320.01302868.93430042.228665
Strontium and its compoundsStrontium Oxide1314-11-04.7891290.2501000.153209
Zirconium and its compoundsZirconium oxide1314-23-438.3168622.0010001.225798
Subtotal1914.885664100.000000061.259293
Copper PlatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.1747050.0700000.005589
Barium and its compoundsBarium oxide1304-28-51.0731860.4300000.034332
Boron and its compoundsBoron oxide1303-86-20.1996620.0800000.006387
Calcium and its compoundsCalcium monoxide1305-78-80.1497470.0600000.004791
Copper and its compoundsCopper, metal7440-50-8238.89620495.7200007.642552
Inorganic Silicon compoundsSilicon dioxide7631-86-97.6620493.0700000.245117
Magnesium and its compoundsMagnesium-oxide1309-48-41.4225950.5700000.045510
Subtotal249.578149100.00000007.984279
Gold PlatingGold and its compoundsGold, metal7440-57-52.54137199.9900000.081301
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0002540.0100000.000008
Subtotal2.541625100.00000000.081309
Nickel PlatingLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0081030.0600000.000259
Nickel and its compoundsNickel, metal7440-02-012.13609889.8600000.388247
Palladium and its compoundsPalladium, metal7440-05-30.1458601.0800000.004666
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-01.2155019.0000000.038885
Subtotal13.505562100.00000000.432058
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped135.10740989.1000004.322234
Lead and its compoundsLead, metallic lead and lead alloys7439-92-114.2805959.4177000.456852
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.3647210.9000000.043659
Nickel and its compoundsNickel, metal7440-02-00.1251000.0825000.004002
Tin and its compoundsTin, metal7440-31-50.7515060.4956000.024042
Titanium and its compoundsTitanium, metal7440-32-60.0063690.0042000.000204
Subtotal151.635700100.00000004.850992
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-421.6518053.5000000.692665
Tin and its compoundsTin, metal7440-31-5596.97119596.50000019.097763
Subtotal618.623000100.000000019.790428
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-843.52150096.5000001.392300
Silver and its compoundsSilver, metal7440-22-41.3530003.0000000.043284
Tin and its compoundsTin, metal7440-31-50.2255000.5000000.007214
Subtotal45.100000100.00000001.442799
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amines1.4520003.0000000.046451
Epoxy Resins(Chloromethyl)oxirane,homopolymer61788-97-414.03600029.0000000.449027
Inorganic Silicon compoundsSilica, vitreous60676-86-016.45600034.0000000.526446
Inorganic Silicon compoundsSilicon dioxide7631-86-916.45600034.0000000.526446
Subtotal48.400000100.00000001.548369
Total3125.869700100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC7447AVU1420LB
Product content declaration of MC7447AVU1420LB
上次修订 Last Revision (GMT):
Tuesday, 21 May 2024, 06:57:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
陶瓷基板
Ceramic Substrate
陶瓷的
Ceramic
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC7447AVU1420LBLast Revision (GMT):
Tuesday, 21 May 2024, 06:57:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Ceramic SubstrateAU PLATINGNot AvailableNot AvailableNot AvailableNot Available
CERAMICNot AvailableNot AvailableNot AvailableNot Available
METALLIZATIONNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieBUMPNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Solder Ball - Lead FreeTest Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.