MCF54452CVR200

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCF54452CVR200Last Revision (GMT):
Tuesday, 03 October 2023, 06:52:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCF54452CVR200SOT1708-1BGA3601756.912744 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 253 935572023-11-2483 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-524.78426599.9900001.410671
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0024790.0100000.000141
Subtotal24.786744100.00000001.410813
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins30.9550005.0000001.761897
Inorganic Silicon compoundsQuartz14808-60-712.3820002.0000000.704759
Inorganic Silicon compoundsSilica, vitreous60676-86-0544.80800088.00000031.009394
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins30.9550005.0000001.761897
Subtotal619.100000100.000000035.237948
Epoxy AdhesiveEpoxy AdhesiveAcrylates1,4-Butanediol dimethacrylate2082-81-70.2015006.5000000.011469
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0155000.5000000.000882
Silver and its compoundsSilver, metal7440-22-42.88300093.0000000.164095
Subtotal3.100000100.00000000.176446
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped18.93458098.0000001.077719
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3864202.0000000.021994
Subtotal19.321000100.00000001.099713
Solder Ball - Lead FreeSolder Ball - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0377510.0125000.002149
Silver and its compoundsSilver, metal7440-22-410.5701753.5000000.601634
Tin and its compoundsTin, metal7440-31-5291.39707496.48750016.585745
Subtotal302.005000100.000000017.189528
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8299.76223899.90000017.061874
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3000620.1000000.017079
Subtotal300.062300100.000000017.078953
Gold PlatingGold and its compoundsGold, metal7440-57-50.15756299.9000000.008968
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001580.1000000.000009
Subtotal0.157720100.00000000.008977
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0007890.1000000.000045
Nickel and its compoundsNickel, metal7440-02-00.78781199.9000000.044841
Subtotal0.788600100.00000000.044886
Solder MaskBarium and its compoundsBarium sulfate7727-43-772.63124329.1000004.134027
Inorganic Silicon compoundsSilicon dioxide7631-86-91.4975510.6000000.085238
Magnesium and its compoundsTalc14807-96-67.4877573.0000000.426188
Organic compoundsOther organic compounds.8.9853083.6000000.511426
PolymersPlastic: EP - Epoxide, Epoxy48.92001219.6000002.784430
PolymersPlastic: PAK110.07002844.1000006.264968
Subtotal249.591900100.000000014.206278
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-333.59436050.0000001.912125
Inorganic Silicon compoundsSilica, vitreous60676-86-03.3594365.0000000.191213
PolymersPlastic: EP - Epoxide, Epoxy30.23492445.0000001.720912
Subtotal67.188720100.00000003.824249
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-385.40538050.0000004.861105
Inorganic Silicon compoundsSilica, vitreous60676-86-08.5405385.0000000.486111
PolymersPlastic: EP - Epoxide, Epoxy76.86484245.0000004.374995
Subtotal170.810760100.00000009.722211
Total1756.912744100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCF54452CVR200
Product content declaration of MCF54452CVR200
上次修订 Last Revision (GMT):
Tuesday, 03 October 2023, 06:52:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCF54452CVR200Last Revision (GMT):
Tuesday, 03 October 2023, 06:52:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Die EncapsulantTest Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Not Available
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
10 Jan 2023
Test Report
10 Jan 2023
Test Report
10 Jan 2023
Test Report
10 Jan 2023
CORETest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
10 Jan 2023
Test Report
10 Jan 2023
Test Report
10 Jan 2023
Test Report
10 Jan 2023
SOLDER MASKTest Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.