MCIMX6D6AVT08AE

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NXP Semiconductors
Product content declaration of MCIMX6D6AVT08AELast Revision (GMT):
Thursday, 21 March 2024, 07:39:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX6D6AVT08AESOT1643FBGA6243297.325000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 576 095572023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCopper and its compoundsCopper, metal7440-50-81986.13800099.00000060.234827
Nickel and its compoundsNickel, metal7440-02-020.0620001.0000000.608433
Subtotal2006.200000100.000000060.843259
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-72.91000030.0000000.088253
Inorganic Silicon compoundsSilylated silica68909-20-60.3880004.0000000.011767
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0019400.0200000.000059
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.3880004.0000000.011767
Organic Silicon compoundsOther siloxanes and silicones0.2910003.0000000.008825
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-80.4365004.5000000.013238
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.23800054.0000000.158856
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0291000.3000000.000883
Organic compoundsOther organic compounds.0.0145500.1500000.000441
Platinum and its compoundsOther platinum compounds0.0029100.0300000.000088
Subtotal9.700000100.00000000.294178
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-333.95840089.6000001.029877
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3411000.9000000.010345
Nickel and its compoundsNickel, metal7440-02-00.1895000.5000000.005747
Silver and its compoundsSilver, metal7440-22-40.1193850.3150000.003621
Tin and its compoundsTin, metal7440-31-53.2916158.6850000.099827
Subtotal37.900000100.00000001.149417
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.8157500.6000000.055067
Silver and its compoundsSilver, metal7440-22-49.0787503.0000000.275337
Tin and its compoundsTin, metal7440-31-5291.73050096.4000008.847490
Subtotal302.625000100.00000009.177894
SubstrateCopper PlatingCopper and its compoundsCopper, metal7440-50-8369.19870699.99000011.196916
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0369240.0100000.001120
Subtotal369.235630100.000000011.198036
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-39.19834110.4500000.278964
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-59.19834110.4500000.278964
Inorganic Silicon compoundsSilicon dioxide7631-86-936.83737441.8500001.117190
PolymersPlastic: EP - Epoxide, Epoxy32.78834437.2500000.994392
Subtotal88.022400100.00000002.669509
Solder 1Copper and its compoundsCopper, metal7440-50-80.0096280.5000000.000292
Silver and its compoundsSilver, metal7440-22-40.0577653.0000000.001752
Tin and its compoundsTin, metal7440-31-51.85809896.5000000.056352
Subtotal1.925490100.00000000.058396
Solder 2Copper and its compoundsCopper, metal7440-50-80.0820630.5000000.002489
Silver and its compoundsSilver, metal7440-22-40.4923753.0000000.014933
Tin and its compoundsTin, metal7440-31-515.83807296.5000000.480331
Subtotal16.412510100.00000000.497752
Solder MaskBarium and its compoundsBarium sulfate7727-43-712.17615731.1000000.369274
Copper and its compoundsCopper phthalocyanine147-14-80.0783030.2000000.002375
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1957580.5000000.005937
Magnesium and its compoundsTalc14807-96-61.4094593.6000000.042745
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.4306681.1000000.013061
Organic compoundsProprietary Material-Other organic compounds.0.0391520.1000000.001187
PolymersPlastic: EP - Epoxide, Epoxy24.82213363.4000000.752796
Subtotal39.151630100.00000001.187376
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3199.28821550.0000006.043936
Inorganic Silicon compoundsSilica, vitreous60676-86-019.9288225.0000000.604394
PolymersPlastic: EP - Epoxide, Epoxy179.35939445.0000005.439542
Subtotal398.576430100.000000012.087872
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-11.87215052.3545000.056778
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.2650727.4127000.008039
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0187310.5238000.000568
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.79937722.3545000.024243
PolymersPlastic: EP - Epoxide, Epoxy0.62058117.3545000.018821
Subtotal3.575910100.00000000.108449
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-58.40000070.0000000.254752
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3600003.0000000.010918
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.1200001.0000000.003639
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.1200001.0000000.003639
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.20000010.0000000.036393
Zinc and its compoundsZinc oxide1314-13-21.80000015.0000000.054590
Subtotal12.000000100.00000000.363931
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-31.32000011.0000000.040032
Bismuth and its compoundsBismuth nitrate10361-44-10.0120000.1000000.000364
Bismuth and its compoundsBismuth trioxide1304-76-30.0960000.8000000.002912
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.68000014.0000000.050950
Epoxy ResinsOther Epoxy resins0.4800004.0000000.014557
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20000010.0000000.036393
Inorganic Silicon compoundsSilica, vitreous60676-86-07.20000060.0000000.218359
Inorganic compoundsCarbon Black1333-86-40.0120000.1000000.000364
Subtotal12.000000100.00000000.363931
Total3297.325000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX6D6AVT08AE
Product content declaration of MCIMX6D6AVT08AE
上次修订 Last Revision (GMT):
Thursday, 21 March 2024, 07:39:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX6D6AVT08AELast Revision (GMT):
Thursday, 21 March 2024, 07:39:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapC1100Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
NI PLATINGTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Epoxy AdhesiveTest Report
26 Feb 2024
Test Report
26 Feb 2024
Test Report
26 Feb 2024
Not Available
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - SAC, Lead FreeTest Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
SubstrateAUS703Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
CU PLATINGTest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
E679FGTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
GX-13Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
PHP-900 IR-6PTest Report
31 Jan 2023
Test Report
15 Dec 2023
Test Report
15 Dec 2023
Test Report
31 Jan 2023
SOP1Test Report
8 Jun 2023
Test Report
8 Jun 2023
Test Report
8 Jun 2023
Test Report
8 Jun 2023
SOP2Test Report
17 Apr 2023
Test Report
17 Apr 2023
Test Report
17 Apr 2023
Test Report
17 Apr 2023
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.