MCIMX6QP6AVT8AA

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX6QP6AVT8AALast Revision (GMT):
Monday, 06 May 2024, 09:01:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX6QP6AVT8AASOT1643-1FBGA6243305.075700 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 259 955572023-11-24153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCopper and its compoundsCopper, metal7440-50-81986.13800099.00000060.093571
Nickel and its compoundsNickel, metal7440-02-020.0620001.0000000.607006
Subtotal2006.200000100.000000060.700576
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-72.91000030.0000000.088046
Inorganic Silicon compoundsSilylated silica68909-20-60.3880004.0000000.011739
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0019400.0200000.000059
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.3880004.0000000.011739
Organic Silicon compoundsOther siloxanes and silicones0.2910003.0000000.008805
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-80.4365004.5000000.013207
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.23800054.0000000.158483
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0291000.3000000.000880
Organic compoundsOther organic compounds.0.0145500.1500000.000440
Platinum and its compoundsOther platinum compounds0.0029100.0300000.000088
Subtotal9.700000100.00000000.293488
Semiconductor DieDieInorganic Silicon compoundsSilicon, doped36.73600089.6000001.111503
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3690000.9000000.011165
Nickel and its compoundsNickel, metal7440-02-00.2050000.5000000.006203
Silver and its compoundsSilver, metal7440-22-40.1291500.3150000.003908
Tin and its compoundsTin, metal7440-31-53.5608508.6850000.107739
Subtotal41.000000100.00000001.240516
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.8157500.6000000.054938
Silver and its compoundsSilver, metal7440-22-49.0787503.0000000.274691
Tin and its compoundsTin, metal7440-31-5291.73050096.4000008.826742
Subtotal302.625000100.00000009.156371
SubstrateCopper FoilArsenic and its compoundsArsenic, metal7440-38-20.0003890.0010000.000012
Cobalt and its compoundsCobalt, metal7440-48-40.0155500.0400000.000470
Copper and its compoundsCopper, metal7440-50-838.84024099.9090001.175169
Nickel and its compoundsNickel, metal7440-02-00.0194380.0500000.000588
Subtotal38.875616100.00000001.176240
Copper PlatingCopper and its compoundsCopper, metal7440-50-8364.99525899.99000011.043477
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0365030.0100000.001105
Subtotal365.031762100.000000011.044581
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-38.65216110.4500000.261784
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-58.65216110.4500000.261784
Inorganic Silicon compoundsSilicon dioxide7631-86-934.65004341.8500001.048389
PolymersPlastic: EP - Epoxide, Epoxy30.84143637.2500000.933154
Subtotal82.795801100.00000002.505111
Solder BallCopper and its compoundsCopper, metal7440-50-80.0979610.5000000.002964
Silver and its compoundsSilver, metal7440-22-40.5877653.0000000.017784
Tin and its compoundsTin, metal7440-31-518.90644296.5000000.572043
Subtotal19.592168100.00000000.592790
Solder MaskBarium and its compoundsBarium sulfate7727-43-79.69546831.1000000.293351
Copper and its compoundsCopper phthalocyanine147-14-80.0623500.2000000.001886
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1558760.5000000.004716
Magnesium and its compoundsTalc14807-96-61.1223053.6000000.033957
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3429271.1000000.010376
Organic compoundsOther organic compounds.0.0311750.1000000.000943
PolymersPlastic: EP - Epoxide, Epoxy19.76503863.4000000.598021
Subtotal31.175139100.00000000.943250
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3191.06787150.0000005.781044
Inorganic Silicon compoundsSilica, vitreous60676-86-019.1067875.0000000.578104
PolymersPlastic: EP - Epoxide, Epoxy171.96108445.0000005.202939
Subtotal382.135742100.000000011.562087
Via PluggingInorganic Silicon compoundsSilicon dioxide7631-86-90.85556844.0000000.025886
Phenols and Phenolic Resins2-[[4-[2-[4-[1,1-bis[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenyl]propan-2-yl]phenoxy]methyl]oxirane115254-47-21.08890456.0000000.032946
Subtotal1.944472100.00000000.058833
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-58.40000070.0000000.254155
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3600003.0000000.010892
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.1200001.0000000.003631
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.1200001.0000000.003631
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.20000010.0000000.036308
Zinc and its compoundsZinc oxide1314-13-21.80000015.0000000.054462
Subtotal12.000000100.00000000.363078
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-31.32000011.0000000.039939
Bismuth and its compoundsBismuth nitrate10361-44-10.0120000.1000000.000363
Bismuth and its compoundsBismuth trioxide1304-76-30.0960000.8000000.002905
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.68000014.0000000.050831
Epoxy ResinsOther Epoxy resins0.4800004.0000000.014523
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20000010.0000000.036308
Inorganic Silicon compoundsSilica, vitreous60676-86-07.20000060.0000000.217847
Inorganic compoundsCarbon Black1333-86-40.0120000.1000000.000363
Subtotal12.000000100.00000000.363078
Total3305.075700100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX6QP6AVT8AA
Product content declaration of MCIMX6QP6AVT8AA
上次修订 Last Revision (GMT):
Monday, 06 May 2024, 09:01:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX6QP6AVT8AALast Revision (GMT):
Monday, 06 May 2024, 09:01:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapC1100Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
NI PLATINGTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Epoxy AdhesiveTest Report
26 Feb 2024
Test Report
26 Feb 2024
Test Report
26 Feb 2024
Not Available
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - SAC, Lead FreeTest Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
SubstrateABF-GX13Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
AUS 703Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
30 Nov 2023
Test Report
9 Dec 2021
Test Report
30 Nov 2023
Test Report
30 Nov 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
14 Dec 2022
Not Available
E679FGB SERIESNot AvailableNot AvailableNot AvailableTest Report
7 Dec 2023
PHP-900 IR-6Test Report
18 Mar 2024
Test Report
18 Jun 2023
Test Report
8 Apr 2024
Test Report
18 Mar 2024
SAC305Test Report
8 Aug 2023
Test Report
8 Aug 2023
Test Report
8 Aug 2023
Test Report
8 Aug 2023
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.