MK81FN256VDC15R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MK81FN256VDC15RLast Revision (GMT):
Monday, 04 March 2024, 10:07:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK81FN256VDC15RSOT1557XFBGA12176.681835 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 130 435182023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.78481098.0994001.023463
Gold and its compoundsGold, metal7440-57-50.0008000.1000000.001043
Palladium and its compoundsPalladium, metal7440-05-30.0144051.8006000.018786
Subtotal0.800015100.00000001.043291
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.5600006.0000002.034380
Inorganic Silicon compoundsSilica, vitreous60676-86-019.24000074.00000025.090688
Inorganic Silicon compoundsSilicon dioxide7631-86-93.90000015.0000005.085950
Inorganic compoundsCarbon Black1333-86-40.1300000.5000000.169532
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.5200002.0000000.678127
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.6500002.5000000.847658
Subtotal26.000000100.000000033.906335
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.07000010.0000000.091286
Inorganic Silicon compoundsSilicon dioxide7631-86-90.17500025.0000000.228216
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.21000030.0000000.273859
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.17500025.0000000.228216
PolymersAcrylic acid ester copolymer78506-70-40.07000010.0000000.091286
Subtotal0.700000100.00000000.912863
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-326.41964498.00000034.453588
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5391762.0000000.703134
Subtotal26.958820100.000000035.156723
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0186600.5012000.024334
Silver and its compoundsSilver, metal7440-22-40.0373191.0024000.048668
Tin and its compoundsTin, metal7440-31-53.66702198.4964004.782125
Subtotal3.723000100.00000004.855126
Substrate, Pre-plated NiAuCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0002110.0050000.000276
Copper and its compoundsCopper, metal7440-50-84.22592899.9250005.510990
Nickel and its compoundsNickel, metal7440-02-00.0021150.0500000.002758
Zinc and its compoundsZinc, metal7440-66-60.0008460.0200000.001103
Subtotal4.229100100.00000005.515126
Copper PlatingCopper and its compoundsCopper, metal7440-50-83.59419099.9900004.687147
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003600.0100000.000469
Subtotal3.594550100.00000004.687616
Gold PlatingGold and its compoundsGold, metal7440-57-50.45690499.9900000.595844
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000460.0100000.000060
Subtotal0.456950100.00000000.595904
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002110.0100000.000276
Nickel and its compoundsNickel, metal7440-02-02.11433999.9900002.757287
Subtotal2.114550100.00000002.757563
Solder MaskBarium and its compoundsBarium sulfate7727-43-71.02555729.1000001.337418
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0211460.6000000.027576
Magnesium and its compoundsTalc14807-96-60.1057283.0000000.137878
Organic compoundsOther organic compounds.0.1268733.6000000.165454
PolymersPlastic: EP - Epoxide, Epoxy0.69075319.6000000.900804
PolymersPlastic: PAK1.55419444.1000002.026809
Subtotal3.524250100.00000004.595939
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-60.99857121.8000001.302226
Inorganic Silicon compoundsFibrous-glass-wool65997-17-32.05210944.8000002.676134
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0549671.2000000.071682
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2931586.4000000.382305
Phenols - SpecificBisphenol A80-05-70.0458061.0000000.059735
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)0.65960614.4000000.860186
PolymersPlastic: EP - Epoxide, Epoxy0.47638210.4000000.621245
Subtotal4.580600100.00000005.973514
Total76.681835100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK81FN256VDC15R
Product content declaration of MK81FN256VDC15R
上次修订 Last Revision (GMT):
Monday, 04 March 2024, 10:07:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK81FN256VDC15RLast Revision (GMT):
Monday, 04 March 2024, 10:07:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
AUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
COPPERTest Report
24 Jul 2020
Test Report
24 Jul 2020
Test Report
24 Jul 2020
Test Report
30 Jul 2020
COPPER FOILTest Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
HL832NXATest Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
NI PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.