MMRF5014HR5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MMRF5014HR5Last Revision (GMT):
Sunday, 07 July 2024, 10:14:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MMRF5014HR5SOT1791-1CFM2F1998.334845 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 205 841282023-11-249NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-517.99827599.9900000.900664
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0018000.0100000.000090
Subtotal18.000075100.00000000.900754
CapCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1367.76024096.00000018.403334
Inorganic Silicon compoundsSilicon dioxide7631-86-99.1940062.4000000.460083
Magnesium and its compoundsMagnesium-oxide1309-48-46.1293371.6000000.306722
Subtotal383.083584100.000000019.170140
EpoxyAzo compounds1,3,5-Triazine-2,4,6(1H,3H,5H)-trione, compd. with 6-(2-(2-methyl-1H-imidazol-1-yl)ethyl)-1,3,5-triazine-2,4-diamine (1:1)68490-66-40.4502150.9000000.022530
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.4502150.9000000.022530
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-615.10722330.2000000.755991
PolymersBisphenol A/F epoxy resin40216-08-87.55361115.1000000.377995
Zinc and its compoundsZinc oxide1314-13-226.46265252.9000001.324235
Subtotal50.023916100.00000002.503280
Header Assembly/FlangeCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-157.71397689.4100002.888103
Chromium and Chromium III compoundsDichromium trioxide1308-38-93.8729886.0000000.193811
Inorganic Silicon compoundsSilicon dioxide7631-86-91.9364943.0000000.096905
Inorganic compoundsOther inorganic compounds1.0263421.5900000.051360
Subtotal64.549800100.00000003.230180
ConductorAluminum and its compoundsAluminum oxide1302-74-51.67737918.3200000.083939
Inorganic compoundsOther inorganic compounds0.1327621.4500000.006644
Molybdenum and its compoundsMolybdenum, metal7439-98-70.2224912.4300000.011134
Tungsten and its compoundsTungsten, metal7440-33-77.12336877.8000000.356465
Subtotal9.156000100.00000000.458181
FlangeCopper and its compoundsCopper, metal7440-50-8704.70222251.80000035.264471
Molybdenum and its compoundsMolybdenum, metal7439-98-7655.72677848.20000032.813659
Subtotal1360.429000100.000000068.078130
Gold Plating 1Gold and its compoundsGold, metal7440-57-51.37333199.9950000.068724
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000690.0050000.000003
Subtotal1.373400100.00000000.068727
Gold Plating 2Gold and its compoundsGold, metal7440-57-514.95405299.9950000.748326
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0007480.0050000.000037
Subtotal14.954800100.00000000.748363
Iron AlloyIron and its compoundsIron, metal7439-89-620.35684058.0000001.018690
Nickel and its compoundsNickel, metal7440-02-014.74116042.0000000.737672
Subtotal35.098000100.00000001.756362
Metal BrazeCopper and its compoundsCopper, metal7440-50-83.03368828.0000000.151811
Silver and its compoundsSilver, metal7440-22-47.80091272.0000000.390371
Subtotal10.834600100.00000000.542181
Nickel Cobalt Plating 1Cobalt and its compoundsCobalt, metal7440-48-40.86982030.0000000.043527
Nickel and its compoundsNickel, metal7440-02-02.02958070.0000000.101564
Subtotal2.899400100.00000000.145091
Nickel Cobalt Plating 2Cobalt and its compoundsCobalt, metal7440-48-41.83120030.0000000.091636
Nickel and its compoundsNickel, metal7440-02-04.27280070.0000000.213818
Subtotal6.104000100.00000000.305454
Nickel Cobalt Plating 3Cobalt and its compoundsCobalt, metal7440-48-46.18030030.0000000.309273
Nickel and its compoundsNickel, metal7440-02-014.42070070.0000000.721636
Subtotal20.601000100.00000001.030908
Semiconductor Die 1Semiconductor DieInorganic compoundsGallium nitride25617-97-419.62672598.0000000.982154
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4005452.0000000.020044
Subtotal20.027270100.00000001.002198
Semiconductor Die 2Semiconductor DieInorganic compoundsGallium nitride25617-97-40.19600098.0000000.009808
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0040002.0000000.000200
Subtotal0.200000100.00000000.010008
Solder AttachSolder AttachGold and its compoundsGold, metal7440-57-50.80000080.0000000.040033
Tin and its compoundsTin, metal7440-31-50.20000020.0000000.010008
Subtotal1.000000100.00000000.050042
Total1998.334845100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MMRF5014HR5
Product content declaration of MMRF5014HR5
上次修订 Last Revision (GMT):
Sunday, 07 July 2024, 10:14:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
陶瓷的
Ceramic
OOOOOO

环氧胶
Epoxy
OOOOOO
封装焊头/法兰
Header Assembly/Flange
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

法兰盘
Flange
OOOOOO

镀金材料
Gold Plating 1
OOOOOO

镀金材料
Gold Plating 2
OOOOOO

铁合金
Iron Alloy
OOOOOO

金属钎焊
Metal Braze
OOOOOO

镍钴电镀
Nickel Cobalt Plating 1
OOOOOO

镍钴电镀
Nickel Cobalt Plating 2
OOOOOO

镍钴电镀
Nickel Cobalt Plating 3
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
焊料连接
Solder Attach
焊料连接
Solder Attach
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MMRF5014HR5Last Revision (GMT):
Sunday, 07 July 2024, 10:14:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CapCERAMICTest Report
26 Apr 2022
Not AvailableNot AvailableNot Available
EPOXYTest Report
10 Mar 2022
Test Report
10 Mar 2022
Test Report
10 Mar 2022
Not Available
Header Assembly/FlangeAU PLATINGTest Report
2 Aug 2021
Test Report
30 Oct 2021
Test Report
30 Oct 2021
Test Report
30 Oct 2021
BRAZINGTest Report
21 Feb 2022
Test Report
21 Feb 2022
Test Report
21 Feb 2022
Test Report
21 Feb 2022
CERAMICTest Report
12 Sep 2021
Test Report
12 Sep 2021
Test Report
12 Sep 2021
Test Report
12 Sep 2021
CONDUCTORTest Report
3 Sep 2021
Test Report
3 Sep 2021
Test Report
3 Sep 2021
Test Report
3 Sep 2021
FLANGETest Report
23 Mar 2022
Test Report
23 Mar 2022
Test Report
23 Mar 2022
Test Report
23 Mar 2022
NI PLATINGTest Report
21 Sep 2021
Test Report
21 Sep 2021
Test Report
21 Sep 2021
Test Report
21 Sep 2021
YEF42Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
Semiconductor Die 1Test Report
9 Sep 2021
Test Report
9 Sep 2021
Test Report
9 Sep 2021
Test Report
9 Sep 2021
Semiconductor Die 2Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder AttachTest Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.