MPC8533EVJALFA

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NXP Semiconductors
Product content declaration of MPC8533EVJALFALast Revision (GMT):
Friday, 13 January 2023, 04:56:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8533EVJALFASOT1622-4BGA7833443.602000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 258 335572021-09-11153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-751.14280065.4000001.485154
Copper and its compoundsCopper, metal7440-50-810.79160013.8000000.313381
Nickel and its compoundsNickel, metal7440-02-015.24900019.5000000.442821
Tin and its compoundsTin, metal7440-31-51.0166001.3000000.029521
Subtotal78.200000100.00000002.270878
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped115.04640089.6000003.340874
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1556000.9000000.033558
Nickel and its compoundsNickel, metal7440-02-00.6420000.5000000.018643
Silver and its compoundsSilver, metal7440-22-40.4044600.3150000.011745
Tin and its compoundsTin, metal7440-31-511.1515408.6850000.323834
Subtotal128.400000100.00000003.728654
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-422.9901703.5000000.667620
Tin and its compoundsTin, metal7440-31-5633.87183096.50000018.407233
Subtotal656.862000100.000000019.074852
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-844.63125096.5000001.296063
Silver and its compoundsSilver, metal7440-22-41.3875003.0000000.040292
Tin and its compoundsTin, metal7440-31-50.2312500.5000000.006715
Subtotal46.250000100.00000001.343071
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8310.47380599.8700009.015961
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4041410.1300000.011736
Subtotal310.877946100.00000009.027697
Copper PlatingCopper and its compoundsCopper, metal7440-50-8863.08460599.75000025.063425
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.1631190.2500000.062816
Subtotal865.247724100.000000025.126241
DielectricEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-523.16338810.4600000.672650
Inorganic Silicon compoundsSilicon dioxide7631-86-992.67569741.8500002.691243
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-623.16338810.4600000.672650
PolymersPlastic: EP - Epoxide, Epoxy82.44483137.2300002.394145
Subtotal221.447304100.00000006.430688
Solder 1Copper and its compoundsCopper, metal7440-50-80.0175350.5000000.000509
Silver and its compoundsSilver, metal7440-22-40.1052133.0000000.003055
Tin and its compoundsTin, metal7440-31-53.38433696.5000000.098279
Subtotal3.507084100.00000000.101844
Solder 2Copper and its compoundsCopper, metal7440-50-80.0150300.5000000.000436
Silver and its compoundsSilver, metal7440-22-40.0901823.0000000.002619
Tin and its compoundsTin, metal7440-31-52.90085996.5000000.084239
Subtotal3.006072100.00000000.087294
Solder BallCopper and its compoundsCopper, metal7440-50-80.1302630.5000000.003783
Silver and its compoundsSilver, metal7440-22-40.7815793.0000000.022697
Tin and its compoundsTin, metal7440-31-525.14078296.5000000.730072
Subtotal26.052624100.00000000.756552
Solder MaskBarium and its compoundsBarium sulfate7727-43-712.26727929.5000000.356234
Inorganic compoundsProprietary Material - Other inorganic compounds0.2495040.6000000.007245
Magnesium and its compoundsTalc14807-96-61.3306883.2000000.038642
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9564322.3000000.027774
PolymersPlastic: EP - Epoxide, Epoxy8.23363119.8000000.239099
PolymersPlastic: PAK18.54646244.6000000.538577
Subtotal41.583996100.00000001.207573
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3393.89563440.00000011.438477
Inorganic Silicon compoundsSilica, vitreous60676-86-0344.65868035.00000010.008668
PolymersPlastic: EP - Epoxide, Epoxy246.18477225.0000007.149048
Subtotal984.739086100.000000028.596193
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-125.44599952.3600000.738935
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.6011247.4100000.104574
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2527110.5200000.007339
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-610.86654922.3600000.315558
PolymersPlastic: EP - Epoxide, Epoxy8.43178117.3500000.244854
Subtotal48.598164100.00000001.411259
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-33.17130011.0000000.092092
Bismuth and its compoundsBismuth nitrate10361-44-10.0288300.1000000.000837
Bismuth and its compoundsBismuth trioxide1304-76-30.2306400.8000000.006698
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-64.03620014.0000000.117209
Epoxy ResinsOther Epoxy resins1.1532004.0000000.033488
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.88300010.0000000.083721
Inorganic Silicon compoundsSilica, vitreous60676-86-017.29800060.0000000.502323
Inorganic compoundsCarbon Black1333-86-40.0288300.1000000.000837
Subtotal28.830000100.00000000.837205
Total3443.602000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8533EVJALFA
Product content declaration of MPC8533EVJALFA
上次修订 Last Revision (GMT):
Friday, 13 January 2023, 04:56:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

电介质
Dielectric
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8533EVJALFALast Revision (GMT):
Friday, 13 January 2023, 04:56:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateABF-GX13Test Report
20 Jul 2022
Test Report
20 Jul 2022
Test Report
20 Jul 2022
Test Report
20 Jul 2022
AUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679 SERIESNot AvailableTest Report
14 Dec 2022
Not AvailableNot Available
E679FG SERIESTest Report
14 Dec 2022
Not AvailableTest Report
21 Dec 2021
Test Report
21 Dec 2021
PHP-900 IR6Test Report
18 Jun 2021
Not AvailableTest Report
18 Aug 2019
Not Available
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.