MPC8533EVTALFA

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8533EVTALFALast Revision (GMT):
Monday, 25 December 2023, 06:36:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8533EVTALFASOT1622-4BGA7833569.242000 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 105 165572023-11-245Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-751.14280065.4000001.432876
Copper and its compoundsCopper, metal7440-50-810.79160013.8000000.302350
Nickel and its compoundsNickel, metal7440-02-015.24900019.5000000.427234
Tin and its compoundsTin, metal7440-31-51.0166001.3000000.028482
Subtotal78.200000100.00000002.190941
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped114.40440089.1000003.205286
Lead and its compoundsLead, metallic lead and lead alloys7439-92-112.0923279.4177000.338793
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1556000.9000000.032377
Nickel and its compoundsNickel, metal7440-02-00.1059300.0825000.002968
Tin and its compoundsTin, metal7440-31-50.6363500.4956000.017829
Titanium and its compoundsTitanium, metal7440-32-60.0053930.0042000.000151
Subtotal128.400000100.00000003.597402
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-422.9901703.5000000.644119
Tin and its compoundsTin, metal7440-31-5633.87183096.50000017.759284
Subtotal656.862000100.000000018.403403
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-844.63125096.5000001.250441
Silver and its compoundsSilver, metal7440-22-41.3875003.0000000.038874
Tin and its compoundsTin, metal7440-31-50.2312500.5000000.006479
Subtotal46.250000100.00000001.295793
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8325.98011999.8700009.133035
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4243260.1300000.011888
Subtotal326.404445100.00000009.144923
Copper PlatingCopper and its compoundsCopper, metal7440-50-8905.47207099.75000025.368750
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.2693540.2500000.063581
Subtotal907.741424100.000000025.432330
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-324.28546610.4500000.680410
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-524.28546610.4500000.680410
Inorganic Silicon compoundsSilicon dioxide7631-86-997.25806141.8500002.724894
PolymersPlastic: EP - Epoxide, Epoxy86.56780837.2500002.425384
Subtotal232.396801100.00000006.511097
Solder Ball 1Copper and its compoundsCopper, metal7440-50-80.1601930.5000000.004488
Silver and its compoundsSilver, metal7440-22-40.9611583.0000000.026929
Tin and its compoundsTin, metal7440-31-530.91726096.5000000.866214
Subtotal32.038611100.00000000.897631
Solder Ball 2Lead and its compoundsLead, metallic lead and lead alloys7439-92-11.39842537.0000000.039180
Tin and its compoundsTin, metal7440-31-52.38110263.0000000.066712
Subtotal3.779527100.00000000.105892
Solder MaskBarium and its compoundsBarium sulfate7727-43-713.59336931.1000000.380848
Copper and its compoundsCopper phthalocyanine147-14-80.0874170.2000000.002449
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2185430.5000000.006123
Magnesium and its compoundsTalc14807-96-61.5735093.6000000.044085
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.4807941.1000000.013470
Organic compoundsProprietary Material-Other organic compounds.0.0437090.1000000.001225
PolymersPlastic: EP - Epoxide, Epoxy27.71124063.4000000.776390
Subtotal43.708581100.00000001.224590
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3330.75650532.0000009.266856
Inorganic Silicon compoundsSilica, vitreous60676-86-062.0168456.0000001.737535
PolymersPlastic: PI - Polyimide640.84072962.00000017.954533
Subtotal1033.614079100.000000028.958924
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-125.71233350.4000000.720386
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-54.3874228.6000000.122923
Epoxy ResinsProprietary Material-Other Epoxy resins7.65248015.0000000.214401
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5101651.0000000.014293
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-612.75413325.0000000.357334
Subtotal51.016534100.00000001.429338
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-33.17130011.0000000.088851
Bismuth and its compoundsBismuth nitrate10361-44-10.0288300.1000000.000808
Bismuth and its compoundsBismuth trioxide1304-76-30.2306400.8000000.006462
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-64.03620014.0000000.113083
Epoxy ResinsOther Epoxy resins1.1532004.0000000.032309
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.88300010.0000000.080773
Inorganic Silicon compoundsSilica, vitreous60676-86-017.29800060.0000000.484641
Inorganic compoundsCarbon Black1333-86-40.0288300.1000000.000808
Subtotal28.830000100.00000000.807735
Total3569.242000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8533EVTALFA
Product content declaration of MPC8533EVTALFA
上次修订 Last Revision (GMT):
Monday, 25 December 2023, 06:36:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball 1
OOOOOO

焊锡球
Solder Ball 2
XOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8533EVTALFALast Revision (GMT):
Monday, 25 December 2023, 06:36:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateNot AvailableNot AvailableNot AvailableNot Available
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.