MPC8541EVTALF

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8541EVTALFLast Revision (GMT):
Monday, 31 May 2021, 10:45:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8541EVTALFSOT1622BGA7834185.801200 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 192 035572020-01-167Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCadmium and its compoundsCadmium, metal7440-43-90.0109300.0010000.000261
Chromium and Chromium III compoundsChromium, metal7440-47-30.0109300.0010000.000261
Copper and its compoundsCopper, metal7440-50-81073.44738598.20850025.644968
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0109300.0010000.000261
Magnesium and its compoundsMagnesium, metal7439-95-41.5029150.1375000.035905
Mercury and its compoundsMercury7439-97-60.0109300.0010000.000261
Nickel and its compoundsNickel, metal7440-02-018.0349791.6500000.430861
Subtotal1093.029000100.000000026.112779
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-713.34160065.4000000.318735
Copper and its compoundsCopper, metal7440-50-82.81520013.8000000.067256
Nickel and its compoundsNickel, metal7440-02-03.97800019.5000000.095036
Tin and its compoundsTin, metal7440-31-50.2652001.3000000.006336
Subtotal20.400000100.00000000.487362
Epoxy AdhesiveEpoxy AdhesiveAluminum and its compoundsAluminum, metal7429-90-525.41500085.0000000.607172
Organic Silicon compoundsOther organic Silicon Compounds4.48500015.0000000.107148
Subtotal29.900000100.00000000.714320
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped141.07577289.1000003.370341
Lead and its compoundsLead, metallic lead and lead alloys7439-92-114.9114409.4177000.356239
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4250080.9000000.034044
Nickel and its compoundsNickel, metal7440-02-00.1306260.0825000.003121
Tin and its compoundsTin, metal7440-31-50.7847040.4956000.018747
Titanium and its compoundsTitanium, metal7440-32-60.0066500.0042000.000159
Subtotal158.334200100.00000003.782650
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0127570.0032000.000305
Antimony and its compoundsAntimony, metal7440-36-00.0498340.0125000.001190
Arsenic and its compoundsArsenic, metal7440-38-20.0299000.0075000.000714
Bismuth and its compoundsBismuth, metal7440-69-90.0749500.0188000.001791
Cadmium and its compoundsCadmium, metal7440-43-90.0051830.0013000.000124
Copper and its compoundsCopper, metal7440-50-80.0251160.0063000.000600
Gold and its compoundsGold, metal7440-57-50.0251160.0063000.000600
Indium and its compoundsIndium, metal7440-74-60.0251160.0063000.000600
Inorganic compoundsSulfur7704-34-90.0039870.0010000.000095
Iron and its compoundsIron, metal7439-89-60.0498340.0125000.001190
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.1247830.0313000.002981
Nickel and its compoundsNickel, metal7440-02-00.0127570.0032000.000305
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0251160.0063000.000600
Silver and its compoundsSilver, metal7440-22-413.9541773.5002000.333369
Tin and its compoundsTin, metal7440-31-5384.24180096.3814009.179648
Zinc and its compoundsZinc, metal7440-66-60.0075750.0019000.000181
Subtotal398.668000100.00000009.524294
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.1066500.5000000.002548
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0017700.0083000.000042
Silver and its compoundsSilver, metal7440-22-40.6399003.0000000.015287
Tin and its compoundsTin, metal7440-31-520.58168096.4917000.491702
Subtotal21.330000100.00000000.509580
SubstrateSubstrateCopper and its compoundsCopper, metal7440-50-8908.85233537.36750021.712745
Epoxy ResinsOther Epoxy resins744.18753130.59730017.778855
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3690.00541128.36960016.484429
Inorganic Silicon compoundsOther silica compounds68.7728872.8276001.643004
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.5642700.0232000.013481
Silver and its compoundsSilver, metal7440-22-40.5302200.0218000.012667
Tin and its compoundsTin, metal7440-31-519.2873460.7930000.460780
Subtotal2432.200000100.000000058.105961
UnderfillUnderfillAnhydridesMethylhexahydrophthalic anhydride25550-51-04.82501615.1065000.115271
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.7788985.5695000.042498
Epoxy ResinsElastomer Modified Diglycidyl Ether68909-14-81.7788985.5695000.042498
Epoxy ResinsNeopentyl glycol diglycidyl ether17557-23-21.7788985.5695000.042498
Inorganic Silicon compoundsQuartz14808-60-720.84982565.2781000.498108
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9284642.9069000.022181
Subtotal31.940000100.00000000.763056
Total4185.801200100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8541EVTALF
Product content declaration of MPC8541EVTALF
上次修订 Last Revision (GMT):
Monday, 31 May 2021, 10:45:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8541EVTALFLast Revision (GMT):
Monday, 31 May 2021, 10:45:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapNot AvailableNot AvailableNot AvailableNot Available
CapacitorCERAMICTest Report
15 Jan 2021
Test Report
15 Jan 2021
Test Report
15 Jan 2021
Test Report
15 Jan 2021
INNER ELECTRODETest Report
5 Nov 2020
Test Report
5 Nov 2020
Test Report
5 Nov 2020
Test Report
5 Nov 2020
NI PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
18 Jun 2020
Test Report
18 Jun 2020
OUTER ELECTRODETest Report
21 Nov 2020
Test Report
21 Nov 2020
Test Report
9 Nov 2020
Test Report
9 Nov 2020
SN PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Epoxy AdhesiveTest Report
15 May 2018
Not AvailableNot AvailableNot Available
Semiconductor DieTest Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Solder Ball - Lead FreeTest Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Solder FluxNot AvailableNot AvailableNot AvailableNot Available
SubstrateNot AvailableNot AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.