MPC8541VTAJD

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8541VTAJDLast Revision (GMT):
Tuesday, 05 March 2024, 01:02:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8541VTAJDSOT1622BGA7831753.567000 mg YesNoYesTin/Silver (Sn/Ag)Not Applicablee2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 137 065572024-02-068Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCadmium and its compoundsCadmium, metal7440-43-90.0109300.0010000.000623
Chromium and Chromium III compoundsChromium, metal7440-47-30.0109300.0010000.000623
Copper and its compoundsCopper, metal7440-50-81073.44738598.20850061.215077
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0109300.0010000.000623
Magnesium and its compoundsMagnesium, metal7439-95-41.5029150.1375000.085706
Mercury and its compoundsMercury7439-97-60.0109300.0010000.000623
Nickel and its compoundsNickel, metal7440-02-018.0349791.6500001.028474
Subtotal1093.029000100.000000062.331750
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-713.34160065.4000000.760826
Copper and its compoundsCopper, metal7440-50-82.81520013.8000000.160541
Nickel and its compoundsNickel, metal7440-02-03.97800019.5000000.226852
Tin and its compoundsTin, metal7440-31-50.2652001.3000000.015123
Subtotal20.400000100.00000001.163343
Epoxy AdhesiveEpoxy AdhesiveAluminum and its compoundsAluminum, metal7429-90-525.41500085.0000001.449332
Organic Silicon compoundsOther organic Silicon Compounds4.48500015.0000000.255764
Subtotal29.900000100.00000001.705096
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped141.04530089.1000008.043337
Lead and its compoundsLead, metallic lead and lead alloys7439-92-114.9082199.4177000.850165
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4247000.9000000.081246
Nickel and its compoundsNickel, metal7440-02-00.1305980.0825000.007448
Tin and its compoundsTin, metal7440-31-50.7845350.4956000.044739
Titanium and its compoundsTitanium, metal7440-32-60.0066490.0042000.000379
Subtotal158.300000100.00000009.027314
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0039870.0010000.000227
Antimony and its compoundsAntimony, metal7440-36-00.1993340.0500000.011367
Arsenic and its compoundsArsenic, metal7440-38-20.1196000.0300000.006820
Bismuth and its compoundsBismuth, metal7440-69-90.1196000.0300000.006820
Cadmium and its compoundsCadmium, metal7440-43-90.0079730.0020000.000455
Copper and its compoundsCopper, metal7440-50-80.1196000.0300000.006820
Gold and its compoundsGold, metal7440-57-50.0199330.0050000.001137
Indium and its compoundsIndium, metal7440-74-60.0797340.0200000.004547
Iron and its compoundsIron, metal7439-89-60.0398670.0100000.002273
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.1993340.0500000.011367
Nickel and its compoundsNickel, metal7440-02-00.0199330.0050000.001137
Silver and its compoundsSilver, metal7440-22-413.9533803.5000000.795714
Tin and its compoundsTin, metal7440-31-5383.78173796.26600021.885776
Zinc and its compoundsZinc, metal7440-66-60.0039870.0010000.000227
Subtotal398.668000100.000000022.734689
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-820.58345096.5000001.173805
Silver and its compoundsSilver, metal7440-22-40.6399003.0000000.036491
Tin and its compoundsTin, metal7440-31-50.1066500.5000000.006082
Subtotal21.330000100.00000001.216378
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amines0.9582003.0000000.054643
Epoxy Resins(Chloromethyl)oxirane,homopolymer61788-97-49.26260029.0000000.528215
Inorganic Silicon compoundsSilica, vitreous60676-86-010.85960034.0000000.619286
Inorganic Silicon compoundsSilicon dioxide7631-86-910.85960034.0000000.619286
Subtotal31.940000100.00000001.821430
Total1753.567000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8541VTAJD
Product content declaration of MPC8541VTAJD
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 01:02:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8541VTAJDLast Revision (GMT):
Tuesday, 05 March 2024, 01:02:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapNot AvailableNot AvailableNot AvailableNot Available
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Epoxy AdhesiveTest Report
26 Jun 2023
Test Report
26 Jun 2023
Test Report
26 Jun 2023
Test Report
26 Jun 2023
Semiconductor DieTest Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.