MPC8543VJANGD

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MPC8543VJANGDLast Revision (GMT):
Wednesday, 11 May 2022, 12:11:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8543VJANGDSOT1625-2BGA7838211.457000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 204 575572021-09-1193 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCopper and its compoundsCopper, metal7440-50-85107.80105099.00000062.203347
Nickel and its compoundsNickel, metal7440-02-051.5939501.0000000.628317
Subtotal5159.395000100.000000062.831663
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-748.91920065.4000000.595743
Copper and its compoundsCopper, metal7440-50-810.32240013.8000000.125707
Nickel and its compoundsNickel, metal7440-02-014.58600019.5000000.177630
Tin and its compoundsTin, metal7440-31-50.9724001.3000000.011842
Subtotal74.800000100.00000000.910922
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-736.00000030.0000000.438412
Inorganic Silicon compoundsSilylated silica68909-20-64.8000004.0000000.058455
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0240000.0200000.000292
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-24.8000004.0000000.058455
Organic Silicon compoundsOther siloxanes and silicones3.6000003.0000000.043841
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-85.4000004.5000000.065762
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-264.80000054.0000000.789141
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.3600000.3000000.004384
Organic compoundsOther organic compounds.0.1800000.1500000.002192
Platinum and its compoundsOther platinum compounds0.0360000.0300000.000438
Subtotal120.000000100.00000001.461373
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped120.78080089.6000001.470881
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2132000.9000000.014774
Nickel and its compoundsNickel, metal7440-02-00.6740000.5000000.008208
Silver and its compoundsSilver, metal7440-22-40.4246200.3150000.005171
Tin and its compoundsTin, metal7440-31-511.7073808.6850000.142574
Subtotal134.800000100.00000001.641609
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-422.9901703.5000000.279977
Tin and its compoundsTin, metal7440-31-5633.87183096.5000007.719359
Subtotal656.862000100.00000007.999335
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.96500096.5000000.011752
Silver and its compoundsSilver, metal7440-22-40.0300003.0000000.000365
Tin and its compoundsTin, metal7440-31-50.0050000.5000000.000061
Subtotal1.000000100.00000000.012178
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2203.41835910.0772002.477250
Aromatic hydrocarbon compoundsOther Aromatic carbonyl compounds3.4094150.1689000.041520
Barium and its compoundsBarium sulfate7727-43-721.2316351.0518000.258561
Copper and its compoundsCopper, metal7440-50-81099.67675954.47720013.391981
Epoxy ResinsEpikote 86228064-14-4124.1701426.1513001.512157
Epoxy ResinsFormaldehyde, polymer with 2-methylphenol, glycidyl ether64425-89-432.8951061.6296000.400600
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3415.31282020.5743005.057724
Inorganic Silicon compoundsSilicon dioxide7631-86-935.5980111.7635000.433516
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.4541850.0225000.005531
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-467.8067933.3591000.825758
Tin and its compoundsTin, metal7440-31-514.6267760.7246000.178126
Subtotal2018.600000100.000000024.582726
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-516.10000070.0000000.196068
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.6900003.0000000.008403
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.2300001.0000000.002801
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2300001.0000000.002801
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.30000010.0000000.028010
Zinc and its compoundsZinc oxide1314-13-23.45000015.0000000.042015
Subtotal23.000000100.00000000.280097
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-32.53000011.0000000.030811
Bismuth and its compoundsBismuth nitrate10361-44-10.0230000.1000000.000280
Bismuth and its compoundsBismuth trioxide1304-76-30.1840000.8000000.002241
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-63.22000014.0000000.039213
Epoxy ResinsOther Epoxy resins0.9200004.0000000.011204
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.30000010.0000000.028010
Inorganic Silicon compoundsSilica, vitreous60676-86-013.80000060.0000000.168058
Inorganic compoundsCarbon Black1333-86-40.0230000.1000000.000280
Subtotal23.000000100.00000000.280097
Total8211.457000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8543VJANGD
Product content declaration of MPC8543VJANGD
上次修订 Last Revision (GMT):
Wednesday, 11 May 2022, 12:11:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8543VJANGDLast Revision (GMT):
Wednesday, 11 May 2022, 12:11:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapC1100Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
NI PLATINGTest Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
CapacitorCERAMICTest Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
INNER ELECTRODETest Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
OUTER ELECTRODETest Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
SN PLATINGTest Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Epoxy AdhesiveTest Report
23 Mar 2021
Test Report
23 Mar 2021
Test Report
23 Mar 2021
Not Available
Semiconductor DieTest Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
23 Jul 2021
Not Available
Solder Ball - Lead FreeTest Report
19 Oct 2021
Test Report
19 Oct 2021
Test Report
19 Oct 2021
Test Report
19 Oct 2021
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateABF-GX13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
AUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
PHP-900 IR6Test Report
18 Jun 2021
Not AvailableTest Report
18 Aug 2019
Not Available
Thermally Conductive GelTest Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.