MPC8548EVTAVHD

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MPC8548EVTAVHDLast Revision (GMT):
Wednesday, 09 June 2021, 10:50:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8548EVTAVHDSOT1625-2BGA7836192.420300 mg YesNoYesTin/Silver (Sn/Ag)Not Applicablee2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 232 295572019-11-063Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCopper and its compoundsCopper, metal7440-50-85107.80105099.00000082.484728
Nickel and its compoundsNickel, metal7440-02-051.5939501.0000000.833179
Subtotal5159.395000100.000000083.317907
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-748.91920065.4000000.789985
Copper and its compoundsCopper, metal7440-50-810.32240013.8000000.166694
Nickel and its compoundsNickel, metal7440-02-014.58600019.5000000.235546
Tin and its compoundsTin, metal7440-31-50.9724001.3000000.015703
Subtotal74.800000100.00000001.207928
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-736.00000030.0000000.581356
Inorganic Silicon compoundsSilylated silica68909-20-64.8000004.0000000.077514
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0240000.0200000.000388
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-24.8000004.0000000.077514
Organic Silicon compoundsOther siloxanes and silicones3.6000003.0000000.058136
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-85.4000004.5000000.087203
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-264.80000054.0000001.046441
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.3600000.3000000.005814
Organic compoundsOther organic compounds.0.1800000.1500000.002907
Platinum and its compoundsOther platinum compounds0.0360000.0300000.000581
Subtotal120.000000100.00000001.937853
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped119.71770089.1000001.933294
Lead and its compoundsLead, metallic lead and lead alloys7439-92-112.6539329.4177000.204346
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2092700.9000000.019528
Nickel and its compoundsNickel, metal7440-02-00.1108500.0825000.001790
Tin and its compoundsTin, metal7440-31-50.6659050.4956000.010753
Titanium and its compoundsTitanium, metal7440-32-60.0056430.0042000.000091
Subtotal134.363300100.00000002.169803
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-422.9901703.5000000.371263
Tin and its compoundsTin, metal7440-31-5633.87183096.50000010.236253
Subtotal656.862000100.000000010.607516
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.96500096.5000000.015584
Silver and its compoundsSilver, metal7440-22-40.0300003.0000000.000485
Tin and its compoundsTin, metal7440-31-50.0050000.5000000.000081
Subtotal1.000000100.00000000.016149
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-516.10000070.0000000.259995
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.6900003.0000000.011143
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.2300001.0000000.003714
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2300001.0000000.003714
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.30000010.0000000.037142
Zinc and its compoundsZinc oxide1314-13-23.45000015.0000000.055713
Subtotal23.000000100.00000000.371422
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-32.53000011.0000000.040856
Bismuth and its compoundsBismuth nitrate10361-44-10.0230000.1000000.000371
Bismuth and its compoundsBismuth trioxide1304-76-30.1840000.8000000.002971
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-63.22000014.0000000.051999
Epoxy ResinsOther Epoxy resins0.9200004.0000000.014857
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.30000010.0000000.037142
Inorganic Silicon compoundsSilica, vitreous60676-86-013.80000060.0000000.222853
Inorganic compoundsCarbon Black1333-86-40.0230000.1000000.000371
Subtotal23.000000100.00000000.371422
Total6192.420300100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8548EVTAVHD
Product content declaration of MPC8548EVTAVHD
上次修订 Last Revision (GMT):
Wednesday, 09 June 2021, 10:50:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8548EVTAVHDLast Revision (GMT):
Wednesday, 09 June 2021, 10:50:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapC1100Test Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
NI PLATINGTest Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
CapacitorCERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
OUTER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Epoxy AdhesiveTest Report
1 Aug 2022
Test Report
1 Aug 2022
Test Report
1 Aug 2022
Not Available
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
28 Sep 2022
Test Report
28 Sep 2022
Test Report
28 Sep 2022
Test Report
28 Sep 2022
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Thermally Conductive GelTest Report
3 Aug 2022
Test Report
3 Aug 2022
Test Report
3 Aug 2022
Test Report
3 Aug 2022
UnderfillTest Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.