MPC8548VJATGD

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NXP Semiconductors
Product content declaration of MPC8548VJATGDLast Revision (GMT):
Thursday, 07 March 2024, 11:08:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8548VJATGDSOT1625-2BGA7833052.062000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 236 635572023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-748.91920065.4000001.602825
Copper and its compoundsCopper, metal7440-50-810.32240013.8000000.338211
Nickel and its compoundsNickel, metal7440-02-014.58600019.5000000.477906
Tin and its compoundsTin, metal7440-31-50.9724001.3000000.031860
Subtotal74.800000100.00000002.450802
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-736.00000030.0000001.179530
Inorganic Silicon compoundsSilylated silica68909-20-64.8000004.0000000.157271
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0240000.0200000.000786
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-24.8000004.0000000.157271
Organic Silicon compoundsOther siloxanes and silicones3.6000003.0000000.117953
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-85.4000004.5000000.176930
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-264.80000054.0000002.123155
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.3600000.3000000.011795
Organic compoundsOther organic compounds.0.1800000.1500000.005898
Platinum and its compoundsOther platinum compounds0.0360000.0300000.001179
Subtotal120.000000100.00000003.931768
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped120.78080089.6000003.957351
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2132000.9000000.039750
Nickel and its compoundsNickel, metal7440-02-00.6740000.5000000.022083
Silver and its compoundsSilver, metal7440-22-40.4246200.3150000.013913
Tin and its compoundsTin, metal7440-31-511.7073808.6850000.383589
Subtotal134.800000100.00000004.416686
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-422.9901703.5000000.753267
Tin and its compoundsTin, metal7440-31-5633.87183096.50000020.768642
Subtotal656.862000100.000000021.521909
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.96500096.5000000.031618
Silver and its compoundsSilver, metal7440-22-40.0300003.0000000.000983
Tin and its compoundsTin, metal7440-31-50.0050000.5000000.000164
Subtotal1.000000100.00000000.032765
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8240.90911099.8700007.893323
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3135900.1300000.010275
Subtotal241.222700100.00000007.903598
Copper PlatingCopper and its compoundsCopper, metal7440-50-8753.06900999.75000024.674106
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.8873910.2500000.061840
Subtotal754.956400100.000000024.735946
DielectricEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-516.34266610.4600000.535463
Inorganic Silicon compoundsSilicon dioxide7631-86-965.38628941.8500002.142364
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-616.34266610.4600000.535463
PolymersPlastic: EP - Epoxide, Epoxy58.16801837.2300001.905860
Subtotal156.239640100.00000005.119150
Solder 1Copper and its compoundsCopper, metal7440-50-80.0121120.5000000.000397
Silver and its compoundsSilver, metal7440-22-40.0726703.0000000.002381
Tin and its compoundsTin, metal7440-31-52.33753996.5000000.076589
Subtotal2.422320100.00000000.079367
Solder 2Copper and its compoundsCopper, metal7440-50-80.0121120.5000000.000397
Silver and its compoundsSilver, metal7440-22-40.0726703.0000000.002381
Tin and its compoundsTin, metal7440-31-52.33753996.5000000.076589
Subtotal2.422320100.00000000.079367
Solder BallCopper and its compoundsCopper, metal7440-50-80.1009300.5000000.003307
Silver and its compoundsSilver, metal7440-22-40.6055803.0000000.019842
Tin and its compoundsTin, metal7440-31-519.47949096.5000000.638240
Subtotal20.186000100.00000000.661389
Solder MaskBarium and its compoundsBarium sulfate7727-43-79.52779229.5000000.312176
Inorganic compoundsProprietary Material - Other inorganic compounds0.1937860.6000000.006349
Magnesium and its compoundsTalc14807-96-61.0335233.2000000.033863
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7428452.3000000.024339
PolymersPlastic: EP - Epoxide, Epoxy6.39492519.8000000.209528
PolymersPlastic: PAK14.40473044.6000000.471967
Subtotal32.297600100.00000001.058222
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3305.69678440.00000010.016074
Inorganic Silicon compoundsSilica, vitreous60676-86-0267.48468635.0000008.764065
PolymersPlastic: EP - Epoxide, Epoxy191.06049025.0000006.260046
Subtotal764.241960100.000000025.040185
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-123.35835152.3600000.765330
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.3056807.4100000.108310
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2319780.5200000.007601
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-69.97503322.3600000.326829
PolymersPlastic: EP - Epoxide, Epoxy7.74001917.3500000.253600
Subtotal44.611060100.00000001.461670
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-516.10000070.0000000.527512
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.6900003.0000000.022608
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.2300001.0000000.007536
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2300001.0000000.007536
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.30000010.0000000.075359
Zinc and its compoundsZinc oxide1314-13-23.45000015.0000000.113038
Subtotal23.000000100.00000000.753589
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-32.53000011.0000000.082895
Bismuth and its compoundsBismuth nitrate10361-44-10.0230000.1000000.000754
Bismuth and its compoundsBismuth trioxide1304-76-30.1840000.8000000.006029
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-63.22000014.0000000.105502
Epoxy ResinsOther Epoxy resins0.9200004.0000000.030144
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.30000010.0000000.075359
Inorganic Silicon compoundsSilica, vitreous60676-86-013.80000060.0000000.452153
Inorganic compoundsCarbon Black1333-86-40.0230000.1000000.000754
Subtotal23.000000100.00000000.753589
Total3052.062000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8548VJATGD
Product content declaration of MPC8548VJATGD
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 11:08:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

电介质
Dielectric
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8548VJATGDLast Revision (GMT):
Thursday, 07 March 2024, 11:08:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Epoxy AdhesiveTest Report
26 Feb 2024
Test Report
26 Feb 2024
Test Report
26 Feb 2024
Not Available
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateABF-GX13Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
AUS 703Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
PHP-900 IR6Test Report
20 Apr 2023
Test Report
18 Jun 2023
Test Report
20 Apr 2023
Not Available
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.