MPC8548VTAQGD

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NXP Semiconductors
Product content declaration of MPC8548VTAQGDLast Revision (GMT):
Wednesday, 21 December 2022, 10:10:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8548VTAQGDSOT1625-2BGA7838210.886300 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 175 675572023-11-245Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCopper and its compoundsCopper, metal7440-50-85107.80105099.00000062.207670
Nickel and its compoundsNickel, metal7440-02-051.5939501.0000000.628360
Subtotal5159.395000100.000000062.836030
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-748.91920065.4000000.595785
Copper and its compoundsCopper, metal7440-50-810.32240013.8000000.125716
Nickel and its compoundsNickel, metal7440-02-014.58600019.5000000.177642
Tin and its compoundsTin, metal7440-31-50.9724001.3000000.011843
Subtotal74.800000100.00000000.910986
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-736.00000030.0000000.438442
Inorganic Silicon compoundsSilylated silica68909-20-64.8000004.0000000.058459
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0240000.0200000.000292
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-24.8000004.0000000.058459
Organic Silicon compoundsOther siloxanes and silicones3.6000003.0000000.043844
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-85.4000004.5000000.065766
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-264.80000054.0000000.789196
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.3600000.3000000.004384
Organic compoundsOther organic compounds.0.1800000.1500000.002192
Platinum and its compoundsOther platinum compounds0.0360000.0300000.000438
Subtotal120.000000100.00000001.461474
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped119.59830689.1000001.456582
Lead and its compoundsLead, metallic lead and lead alloys7439-92-112.6413139.4177000.153958
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2080640.9000000.014713
Nickel and its compoundsNickel, metal7440-02-00.1107390.0825000.001349
Tin and its compoundsTin, metal7440-31-50.6652400.4956000.008102
Titanium and its compoundsTitanium, metal7440-32-60.0056380.0042000.000069
Subtotal134.229300100.00000001.634772
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-422.9901703.5000000.279996
Tin and its compoundsTin, metal7440-31-5633.87183096.5000007.719895
Subtotal656.862000100.00000007.999892
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.96500096.5000000.011753
Silver and its compoundsSilver, metal7440-22-40.0300003.0000000.000365
Tin and its compoundsTin, metal7440-31-50.0050000.5000000.000061
Subtotal1.000000100.00000000.012179
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8215.52108099.8700002.624821
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2805420.1300000.003417
Subtotal215.801622100.00000002.628238
Copper PlatingCopper and its compoundsCopper, metal7440-50-8827.48990699.75000010.077961
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.0739100.2500000.025258
Subtotal829.563816100.000000010.103219
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-318.31606610.4500000.223071
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-518.31606610.4500000.223071
Inorganic Silicon compoundsSilicon dioxide7631-86-973.35190241.8500000.893349
PolymersPlastic: EP - Epoxide, Epoxy65.28932837.2500000.795156
Subtotal175.273363100.00000002.134646
SolderCopper and its compoundsCopper, metal7440-50-80.1628840.5000000.001984
Silver and its compoundsSilver, metal7440-22-40.9773023.0000000.011902
Tin and its compoundsTin, metal7440-31-531.43654696.5000000.382864
Subtotal32.576732100.00000000.396751
Solder BallCopper and its compoundsCopper, metal7440-50-80.0204110.5000000.000249
Silver and its compoundsSilver, metal7440-22-40.1224633.0000000.001491
Tin and its compoundsTin, metal7440-31-53.93924096.5000000.047976
Subtotal4.082114100.00000000.049716
Solder MaskBarium and its compoundsBarium sulfate7727-43-720.65145231.1000000.251513
Copper and its compoundsCopper phthalocyanine147-14-80.1328070.2000000.001617
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3320170.5000000.004044
Magnesium and its compoundsTalc14807-96-62.3905223.6000000.029114
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7304371.1000000.008896
Organic compoundsProprietary Material-Other organic compounds.0.0664030.1000000.000809
PolymersPlastic: EP - Epoxide, Epoxy42.09974463.4000000.512731
Subtotal66.403381100.00000000.808724
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3341.68588950.0000004.161376
Inorganic Silicon compoundsSilica, vitreous60676-86-034.1685895.0000000.416138
PolymersPlastic: EP - Epoxide, Epoxy307.51730045.0000003.745239
Subtotal683.371777100.00000008.322753
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-16.03500552.3545000.073500
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.8544767.4127000.010407
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0603790.5238000.000735
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-62.57684722.3545000.031383
PolymersPlastic: EP - Epoxide, Epoxy2.00048717.3545000.024364
Subtotal11.527195100.00000000.140389
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-516.10000070.0000000.196081
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.6900003.0000000.008403
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.2300001.0000000.002801
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2300001.0000000.002801
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.30000010.0000000.028012
Zinc and its compoundsZinc oxide1314-13-23.45000015.0000000.042017
Subtotal23.000000100.00000000.280116
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-32.53000011.0000000.030813
Bismuth and its compoundsBismuth nitrate10361-44-10.0230000.1000000.000280
Bismuth and its compoundsBismuth trioxide1304-76-30.1840000.8000000.002241
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-63.22000014.0000000.039216
Epoxy ResinsOther Epoxy resins0.9200004.0000000.011205
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.30000010.0000000.028012
Inorganic Silicon compoundsSilica, vitreous60676-86-013.80000060.0000000.168070
Inorganic compoundsCarbon Black1333-86-40.0230000.1000000.000280
Subtotal23.000000100.00000000.280116
Total8210.886300100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8548VTAQGD
Product content declaration of MPC8548VTAQGD
上次修订 Last Revision (GMT):
Wednesday, 21 December 2022, 10:10:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊料
Solder
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8548VTAQGDLast Revision (GMT):
Wednesday, 21 December 2022, 10:10:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapC1100Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
NI PLATINGTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
CapacitorCERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Epoxy AdhesiveTest Report
1 Aug 2022
Test Report
1 Aug 2022
Test Report
1 Aug 2022
Not Available
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateABF-GX13Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
AUS 703Test Report
10 Nov 2022
Test Report
10 Nov 2022
Not AvailableNot Available
AUS703Not AvailableTest Report
10 Nov 2022
Not AvailableNot Available
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023Test Report
14 Dec 2022
Test Report
7 Dec 2023Test Report
14 Dec 2022
E679FG SERIESTest Report
7 Dec 2023
Not AvailableNot AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
IR6PNot AvailableNot AvailableNot AvailableTest Report
17 Feb 2022
PHP-900 IR-6Test Report
20 Apr 2023
Test Report
18 Jun 2023
Test Report
20 Apr 2023
Not Available
SAC305Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
SOLDER PASTETest Report
8 Feb 2023Test Report
14 Oct 2021
Test Report
8 Feb 2023Test Report
14 Oct 2021
Test Report
8 Feb 2023
Test Report
8 Feb 2023Test Report
14 Oct 2021
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.