MPC8548VTAUJD

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NXP Semiconductors
Product content declaration of MPC8548VTAUJDLast Revision (GMT):
Thursday, 07 March 2024, 11:22:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8548VTAUJDSOT1625-2BGA7833051.491300 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 244 935572024-02-066Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-748.91920065.4000001.603124
Copper and its compoundsCopper, metal7440-50-810.32240013.8000000.338274
Nickel and its compoundsNickel, metal7440-02-014.58600019.5000000.477996
Tin and its compoundsTin, metal7440-31-50.9724001.3000000.031866
Subtotal74.800000100.00000002.451260
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-736.00000030.0000001.179751
Inorganic Silicon compoundsSilylated silica68909-20-64.8000004.0000000.157300
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0240000.0200000.000786
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-24.8000004.0000000.157300
Organic Silicon compoundsOther siloxanes and silicones3.6000003.0000000.117975
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-85.4000004.5000000.176963
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-264.80000054.0000002.123552
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.3600000.3000000.011798
Organic compoundsOther organic compounds.0.1800000.1500000.005899
Platinum and its compoundsOther platinum compounds0.0360000.0300000.001180
Subtotal120.000000100.00000003.932504
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped119.59830689.1000003.919340
Lead and its compoundsLead, metallic lead and lead alloys7439-92-112.6413139.4177000.414267
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2080640.9000000.039589
Nickel and its compoundsNickel, metal7440-02-00.1107390.0825000.003629
Tin and its compoundsTin, metal7440-31-50.6652400.4956000.021801
Titanium and its compoundsTitanium, metal7440-32-60.0056380.0042000.000185
Subtotal134.229300100.00000004.398810
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-422.9901703.5000000.753408
Tin and its compoundsTin, metal7440-31-5633.87183096.50000020.772526
Subtotal656.862000100.000000021.525934
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.96500096.5000000.031624
Silver and its compoundsSilver, metal7440-22-40.0300003.0000000.000983
Tin and its compoundsTin, metal7440-31-50.0050000.5000000.000164
Subtotal1.000000100.00000000.032771
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8215.52108099.8700007.062812
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2805420.1300000.009194
Subtotal215.801622100.00000007.072005
Copper PlatingCopper and its compoundsCopper, metal7440-50-8827.48990699.75000027.117557
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.0739100.2500000.067964
Subtotal829.563816100.000000027.185521
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-318.31606610.4500000.600233
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-518.31606610.4500000.600233
Inorganic Silicon compoundsSilicon dioxide7631-86-973.35190241.8500002.403805
PolymersPlastic: EP - Epoxide, Epoxy65.28932837.2500002.139588
Subtotal175.273363100.00000005.743859
SolderCopper and its compoundsCopper, metal7440-50-80.1628840.5000000.005338
Silver and its compoundsSilver, metal7440-22-40.9773023.0000000.032027
Tin and its compoundsTin, metal7440-31-531.43654696.5000001.030203
Subtotal32.576732100.00000001.067568
Solder BallCopper and its compoundsCopper, metal7440-50-80.0204110.5000000.000669
Silver and its compoundsSilver, metal7440-22-40.1224633.0000000.004013
Tin and its compoundsTin, metal7440-31-53.93924096.5000000.129092
Subtotal4.082114100.00000000.133774
Solder MaskBarium and its compoundsBarium sulfate7727-43-720.65145231.1000000.676766
Copper and its compoundsCopper phthalocyanine147-14-80.1328070.2000000.004352
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3320170.5000000.010880
Magnesium and its compoundsTalc14807-96-62.3905223.6000000.078340
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7304371.1000000.023937
Organic compoundsProprietary Material-Other organic compounds.0.0664030.1000000.002176
PolymersPlastic: EP - Epoxide, Epoxy42.09974463.4000001.379645
Subtotal66.403381100.00000002.176096
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3341.68588950.00000011.197341
Inorganic Silicon compoundsSilica, vitreous60676-86-034.1685895.0000001.119734
PolymersPlastic: EP - Epoxide, Epoxy307.51730045.00000010.077607
Subtotal683.371777100.000000022.394682
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-16.03500552.3545000.197772
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.8544767.4127000.028002
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0603790.5238000.001979
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-62.57684722.3545000.084446
PolymersPlastic: EP - Epoxide, Epoxy2.00048717.3545000.065558
Subtotal11.527195100.00000000.377756
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-516.10000070.0000000.527611
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.6900003.0000000.022612
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.2300001.0000000.007537
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2300001.0000000.007537
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.30000010.0000000.075373
Zinc and its compoundsZinc oxide1314-13-23.45000015.0000000.113059
Subtotal23.000000100.00000000.753730
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-32.53000011.0000000.082910
Bismuth and its compoundsBismuth nitrate10361-44-10.0230000.1000000.000754
Bismuth and its compoundsBismuth trioxide1304-76-30.1840000.8000000.006030
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-63.22000014.0000000.105522
Epoxy ResinsOther Epoxy resins0.9200004.0000000.030149
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.30000010.0000000.075373
Inorganic Silicon compoundsSilica, vitreous60676-86-013.80000060.0000000.452238
Inorganic compoundsCarbon Black1333-86-40.0230000.1000000.000754
Subtotal23.000000100.00000000.753730
Total3051.491300100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8548VTAUJD
Product content declaration of MPC8548VTAUJD
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 11:22:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊料
Solder
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8548VTAUJDLast Revision (GMT):
Thursday, 07 March 2024, 11:22:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Epoxy AdhesiveTest Report
26 Feb 2024
Test Report
26 Feb 2024
Test Report
26 Feb 2024
Not Available
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateABF-GX13Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
AUS 703Test Report
10 Nov 2022
Test Report
10 Nov 2022
Not AvailableNot Available
AUS703Not AvailableTest Report
10 Nov 2022
Not AvailableNot Available
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023Test Report
14 Dec 2022
Test Report
7 Dec 2023Test Report
14 Dec 2022
E679FG SERIESTest Report
7 Dec 2023
Not AvailableNot AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
IR6PNot AvailableNot AvailableNot AvailableTest Report
17 Feb 2022
PHP-900 IR-6Test Report
20 Apr 2023
Test Report
18 Jun 2023
Test Report
20 Apr 2023
Not Available
SAC305Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
SOLDER PASTETest Report
8 Feb 2023Test Report
14 Oct 2021
Test Report
8 Feb 2023Test Report
14 Oct 2021
Test Report
8 Feb 2023
Test Report
8 Feb 2023Test Report
14 Oct 2021
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.