MPC8555EPXAPF

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8555EPXAPFLast Revision (GMT):
Monday, 09 August 2021, 07:44:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8555EPXAPFSOT1622-1BGA7834261.175200 mg NoNoNoTin/Lead (Sn63/Pb37)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 240 515572020-01-169Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCadmium and its compoundsCadmium, metal7440-43-90.0109300.0010000.000257
Chromium and Chromium III compoundsChromium, metal7440-47-30.0109300.0010000.000257
Copper and its compoundsCopper, metal7440-50-81073.44738598.20850025.191346
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0109300.0010000.000257
Magnesium and its compoundsMagnesium, metal7439-95-41.5029150.1375000.035270
Mercury and its compoundsMercury7439-97-60.0109300.0010000.000257
Nickel and its compoundsNickel, metal7440-02-018.0349791.6500000.423239
Subtotal1093.029000100.000000025.650881
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-713.34160065.4000000.313097
Copper and its compoundsCopper, metal7440-50-82.81520013.8000000.066066
Nickel and its compoundsNickel, metal7440-02-03.97800019.5000000.093355
Tin and its compoundsTin, metal7440-31-50.2652001.3000000.006224
Subtotal20.400000100.00000000.478741
Epoxy AdhesiveEpoxy AdhesiveAluminum and its compoundsAluminum, metal7429-90-525.41500085.0000000.596432
Organic Silicon compoundsOther organic Silicon Compounds4.48500015.0000000.105253
Subtotal29.900000100.00000000.701684
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped141.07577289.1000003.310725
Lead and its compoundsLead, metallic lead and lead alloys7439-92-114.9114409.4177000.349937
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4250080.9000000.033442
Nickel and its compoundsNickel, metal7440-02-00.1306260.0825000.003066
Tin and its compoundsTin, metal7440-31-50.7847040.4956000.018415
Titanium and its compoundsTitanium, metal7440-32-60.0066500.0042000.000156
Subtotal158.334200100.00000003.715740
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1170.65512036.0000004.004884
Silver and its compoundsSilver, metal7440-22-49.4808402.0000000.222494
Tin and its compoundsTin, metal7440-31-5293.90604062.0000006.897300
Subtotal474.042000100.000000011.124678
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.1066500.5000000.002503
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0017700.0083000.000041
Silver and its compoundsSilver, metal7440-22-40.6399003.0000000.015017
Tin and its compoundsTin, metal7440-31-520.58168096.4917000.483005
Subtotal21.330000100.00000000.500566
SubstrateSubstrateCopper and its compoundsCopper, metal7440-50-8908.85233537.36750021.328678
Epoxy ResinsOther Epoxy resins744.18753130.59730017.464373
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3690.00541128.36960016.192843
Inorganic Silicon compoundsOther silica compounds68.7728872.8276001.613942
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.5642700.0232000.013242
Silver and its compoundsSilver, metal7440-22-40.5302200.0218000.012443
Tin and its compoundsTin, metal7440-31-519.2873460.7930000.452630
Subtotal2432.200000100.000000057.078150
UnderfillUnderfillAnhydridesMethylhexahydrophthalic anhydride25550-51-04.82501615.1065000.113232
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.7788985.5695000.041747
Epoxy ResinsElastomer Modified Diglycidyl Ether68909-14-81.7788985.5695000.041747
Epoxy ResinsNeopentyl glycol diglycidyl ether17557-23-21.7788985.5695000.041747
Inorganic Silicon compoundsQuartz14808-60-720.84982565.2781000.489297
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9284642.9069000.021789
Subtotal31.940000100.00000000.749559
Total4261.175200100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8555EPXAPF
Product content declaration of MPC8555EPXAPF
上次修订 Last Revision (GMT):
Monday, 09 August 2021, 07:44:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8555EPXAPFLast Revision (GMT):
Monday, 09 August 2021, 07:44:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapNot AvailableNot AvailableNot AvailableNot Available
CapacitorCERAMICTest Report
15 Jan 2021
Test Report
15 Jan 2021
Test Report
15 Jan 2021
Test Report
15 Jan 2021
INNER ELECTRODETest Report
5 Nov 2020
Test Report
5 Nov 2020
Test Report
5 Nov 2020
Test Report
5 Nov 2020
NI PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
18 Jun 2020
Test Report
18 Jun 2020
OUTER ELECTRODETest Report
21 Nov 2020
Test Report
21 Nov 2020
Test Report
9 Nov 2020
Test Report
9 Nov 2020
SN PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Epoxy AdhesiveTest Report
15 May 2018
Not AvailableNot AvailableNot Available
Semiconductor DieTest Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Solder Ball - Low LeadTest Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
Solder FluxTest Report
28 Aug 2020
Test Report
28 Aug 2020
Test Report
28 Aug 2020
Test Report
28 Aug 2020
SubstrateNot AvailableNot AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.