MPXV2102GP

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPXV2102GPLast Revision (GMT):
Friday, 09 September 2022, 03:42:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPXV2102GPSOT1693-3SO81925.234553 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 253 371172021-05-15NA / Not Available24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-5185.27272499.9900009.623385
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0185290.0100000.000962
Subtotal185.291253100.00000009.624347
CapCapChromium and Chromium III compoundsChromium, metal7440-47-336.08006618.4270001.874061
Copper and its compoundsCopper, metal7440-50-80.4902830.2504000.025466
Inorganic Silicon compoundsSilicon7440-21-30.9803710.5007000.050922
Inorganic compoundsCarbon7440-44-00.0932010.0476000.004841
Inorganic compoundsSulfur7704-34-90.0097900.0050000.000508
Iron and its compoundsIron, metal7439-89-6139.18971771.0877007.229754
Manganese and its compoundsManganese, metal7439-96-52.2550291.1517000.117130
Nickel and its compoundsNickel, metal7440-02-016.4712838.4123000.855547
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0342650.0175000.001780
Titanium and its compoundsTitanium, metal7440-32-60.1959960.1001000.010180
Subtotal195.800000100.000000010.170189
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8438.62404155.37530022.782888
Epoxy ResinsProprietary Material-Other Epoxy resins16.6909902.1072000.866959
Gold and its compoundsGold, metal7440-57-50.6233770.0787000.032379
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3217.48901827.45750011.296754
Iron and its compoundsIron, metal7439-89-610.4809791.3232000.544400
Nickel and its compoundsNickel, metal7440-02-06.5609090.8283000.340785
Palladium and its compoundsPalladium, metal7440-05-30.3215900.0406000.016704
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3667390.0463000.019049
PolymersPolyphenylene Sulfide (PPS)26125-40-6100.37960812.6727005.213890
Zinc and its compoundsZinc, metal7440-66-60.5560490.0702000.028882
Subtotal792.093300100.000000041.142691
Die EncapsulantDie EncapsulantOrganic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.1126450.3061000.005851
Organic Silicon compoundsDimethyl Siloxane69430-24-61.6897824.5918000.087770
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones34.99757395.1021001.817834
Subtotal36.800000100.00000001.911455
Epoxy Adhesive 1Epoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0600003.0000000.003116
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.50000025.0000000.025971
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.50000025.0000000.025971
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.94000047.0000000.048825
Subtotal2.000000100.00000000.103884
Epoxy Adhesive 2Epoxy AdhesiveAluminum and its compoundsProprietary Material-Other aluminum compounds9.31500045.0000000.483837
Guanidine compoundsOther guanidine compounds0.5175002.5000000.026880
Inorganic compoundsCarbon Black1333-86-40.5175002.5000000.026880
Phenols and Phenolic ResinsOther phenolic resins10.35000050.0000000.537597
Subtotal20.700000100.00000001.075194
PortPortInorganic Silicon compoundsFibrous-glass-wool65997-17-3275.28000040.00000014.298518
Inorganic compoundsCarbon Black1333-86-43.4410000.5000000.178731
Miscellaneous substancesOther miscellaneous substances (less than 10%).6.8820001.0000000.357463
PolymersPolyphenylene Sulfide (PPS)26125-40-6402.59700058.50000020.911582
Subtotal688.200000100.000000035.746294
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-34.26300098.0000000.221428
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0870002.0000000.004519
Subtotal4.350000100.00000000.225946
Total1925.234553100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPXV2102GP
Product content declaration of MPXV2102GP
上次修订 Last Revision (GMT):
Friday, 09 September 2022, 03:42:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
端口
Port
端口
Port
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPXV2102GPLast Revision (GMT):
Friday, 09 September 2022, 03:42:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Apr 2022
Test Report
13 Apr 2022
Test Report
13 Apr 2022
Test Report
13 Apr 2022
CapTest Report
20 Jan 2020
Test Report
20 Jan 2020
Test Report
20 Jan 2020
Test Report
20 Jan 2020
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
CDA 194Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
FORTRON RESINTest Report
2 Jan 2019
Test Report
2 Jan 2019
Test Report
2 Jan 2019
Test Report
13 Mar 2019
NI PLATINGTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
PD PLATINGTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Die EncapsulantTest Report
24 Mar 2021
Test Report
24 Mar 2021
Test Report
24 Mar 2021
Test Report
24 Mar 2021
Epoxy Adhesive 1Test Report
17 Sep 2020
Test Report
17 Sep 2020
Test Report
17 Sep 2020
Test Report
17 Sep 2020
Epoxy Adhesive 2Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
PortTest Report
13 Jul 2020
Test Report
13 Jul 2020
Test Report
13 Jul 2020
Test Report
13 Jul 2020
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.