NCJ3321AHF/00100SY

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of NCJ3321AHF/00100SYLast Revision (GMT):
Sunday, 05 February 2023, 04:32:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
NCJ3321AHF/00100SYSOT2088HWQFN4042.000000 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 493 545182023-05-1543 / 168 hours26030 sec.NA / Not AvailableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-819.97977896.20000047.570900
Inorganic Silicon compoundsSilicon7440-21-30.1349980.6500000.321425
Magnesium and its compoundsMagnesium, metal7439-95-40.0311540.1500000.074175
Nickel and its compoundsNickel, metal7440-02-00.6230703.0000001.483500
Subtotal20.769000100.000000049.450000
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.1026206.9000002.625286
Inorganic Silicon compoundsSilica, vitreous60676-86-012.75204079.80000030.362000
Inorganic Silicon compoundsSilicon dioxide7631-86-91.5181009.5000003.614524
Inorganic compoundsCarbon Black1333-86-40.1278400.8000000.304381
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.4794003.0000001.141429
Subtotal15.980000100.000000038.047619
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000430.0030000.000101
Bismuth and its compoundsBismuth, metal7440-69-90.0000140.0010000.000034
Copper and its compoundsCopper, metal7440-50-80.0000140.0010000.000034
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000710.0050000.000169
Tin and its compoundsTin, metal7440-31-51.41985899.9900003.380614
Subtotal1.420000100.00000003.380952
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000230.0100000.000055
Silver and its compoundsSilver, metal7440-22-40.23097799.9900000.549945
Subtotal0.231000100.00000000.550000
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-32.84680398.0000006.778101
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0580982.0000000.138329
Subtotal2.904901100.00000006.916430
Polyimide CoatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0011811.0000000.002811
PolymersPolyimide Resin39355-34-50.11689999.0000000.278330
Subtotal0.118080100.00000000.281142
Redistribution Metal 1Copper and its compoundsCopper, metal7440-50-80.00715279.5374000.017028
Titanium and its compoundsTitanium, metal7440-32-60.00184020.4626000.004381
Subtotal0.008992100.00000000.021409
Redistribution Metal 2Copper and its compoundsCopper, metal7440-50-80.20380499.9900000.485247
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000200.0100000.000048
Subtotal0.203824100.00000000.485296
Solder BallCopper and its compoundsCopper, metal7440-50-80.19916354.8885000.474198
Nickel and its compoundsNickel, metal7440-02-00.0160764.4305000.038276
Silver and its compoundsSilver, metal7440-22-40.0026570.7323000.006327
Tin and its compoundsTin, metal7440-31-50.14495439.9487000.345129
Subtotal0.362850100.00000000.863929
Under Bump MetalCopper and its compoundsCopper, metal7440-50-80.00107679.5374000.002563
Titanium and its compoundsTitanium, metal7440-32-60.00027720.4626000.000659
Subtotal0.001354100.00000000.003223
Total42.000000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 NCJ3321AHF/00100SY
Product content declaration of NCJ3321AHF/00100SY
上次修订 Last Revision (GMT):
Sunday, 05 February 2023, 04:32:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO

电气再分配
Redistribution Metal 1
OOOOOO

电气再分配
Redistribution Metal 2
OOOOOO

焊锡球
Solder Ball
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of NCJ3321AHF/00100SYLast Revision (GMT):
Sunday, 05 February 2023, 04:32:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Copper Lead-FrameAG PLATINGTest Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2023
C7025Test Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
Die EncapsulantTest Report
18 Apr 2023
Test Report
18 Apr 2023
Test Report
18 Apr 2023
Test Report
18 Apr 2023
Post-plating - Lead FreeTest Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Pre-plating - Precious metal - AgTest Report
29 Dec 2022
Test Report
29 Dec 2022
Test Report
29 Dec 2022
Test Report
29 Dec 2022
Semiconductor DieCU PILLARTest Report
26 Jul 2023
Test Report
26 Jul 2023
Test Report
26 Jul 2023
Test Report
26 Jul 2023
DIETest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
POLYIMIDETest Report
10 Nov 2022
Test Report
10 Nov 2022
Test Report
10 Nov 2022
Test Report
10 Nov 2022
RDL CUTest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
RDL CU PLATINGTest Report
25 Apr 2023
Test Report
25 Apr 2023
Test Report
25 Apr 2023
Test Report
25 Apr 2023
RDL TITest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
UBM CUTest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
UBM TITest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.