PCF2131TFY

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of PCF2131TFYLast Revision (GMT):
Thursday, 04 April 2024, 04:24:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PCF2131TFYSOT1992HLSON1658.977150 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 787 755182023-11-2533 / 168 hours26030 sec.3 / 168 hours24020 sec.3Bangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000030.0020000.000004
Gold and its compoundsGold, metal7440-57-50.12666398.8400000.214767
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000100.0080000.000017
Palladium and its compoundsPalladium, metal7440-05-30.0014741.1500000.002499
Subtotal0.128150100.00000000.217287
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-820.54493097.83300034.835407
Iron and its compoundsIron, metal7439-89-60.4411052.1005000.747925
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0002100.0010000.000356
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0031710.0151000.005377
Zinc and its compoundsZinc, metal7440-66-60.0105840.0504000.017946
Subtotal21.000000100.000000035.607011
Crystal OscillatorCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-16.29937099.99000010.681035
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0006300.0100000.001068
Subtotal6.300000100.000000010.682103
CrystalInorganic Silicon compoundsQuartz14808-60-70.12987099.9000000.220204
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001300.1000000.000220
Subtotal0.130000100.00000000.220424
ElectrodeChromium and Chromium III compoundsChromium, metal7440-47-30.0006006.0000000.001017
Gold and its compoundsGold, metal7440-57-50.00940094.0000000.015938
Subtotal0.010000100.00000000.016956
EpoxyOrganic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.01080012.0000000.018312
Silver and its compoundsSilver, metal7440-22-40.07920088.0000000.134289
Subtotal0.090000100.00000000.152602
GlassGold and its compoundsGold, metal7440-57-50.30400080.0000000.515454
Tin and its compoundsTin, metal7440-31-50.07600020.0000000.128863
Subtotal0.380000100.00000000.644317
Gold PlatingGold and its compoundsGold, metal7440-57-50.02799799.9900000.047471
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.0100000.000005
Subtotal0.028000100.00000000.047476
Iron AlloyCobalt and its compoundsCobalt, metal7440-48-40.45360018.0000000.769111
Iron and its compoundsIron, metal7439-89-61.33560053.0000002.264606
Nickel and its compoundsNickel, metal7440-02-00.73080029.0000001.239124
Subtotal2.520000100.00000004.272841
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000250.0100000.000043
Nickel and its compoundsNickel, metal7440-02-00.25197599.9900000.427241
Subtotal0.252000100.00000000.427284
TerminationGold and its compoundsGold, metal7440-57-50.0295005.0000000.050019
Nickel and its compoundsNickel, metal7440-02-00.08850015.0000000.150058
Tungsten and its compoundsTungsten, metal7440-33-70.47200080.0000000.800310
Subtotal0.590000100.00000001.000387
Die EncapsulantDie EncapsulantEpoxy ResinsOther Non-halogenated Epoxy resins0.9378723.6072001.590229
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-60.4019341.5459000.681508
Inorganic Silicon compoundsSilica, vitreous60676-86-022.19898285.38070037.639971
Inorganic compoundsCarbon Black1333-86-40.0472940.1819000.080190
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.9326203.5870001.581324
Organic Phosphorus compoundsOther organic phosphorous compounds0.0206180.0793000.034959
Phenols and Phenolic Resins1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol25917-04-80.0821860.3161000.139352
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.9450223.6347001.602353
Zinc and its compoundsZinc Hydroxide20427-58-10.4334721.6672000.734983
Subtotal26.000000100.000000044.084870
Epoxy Adhesive 1Epoxy AdhesivePolymersPlastic: ABAK - Acrylonitrile-butadiene-acrylate0.08349015.1800000.141563
PolymersPlastic: EP - Epoxide, Epoxy0.0382806.9600000.064907
Silver and its compoundsSilver, metal7440-22-40.42823077.8600000.726095
Subtotal0.550000100.00000000.932565
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.02550075.0000000.043237
Organic compoundsOther organic compounds.0.0005101.5000000.000865
PolymersPlastic: EP - Epoxide, Epoxy0.00799023.5000000.013548
Subtotal0.034000100.00000000.057649
Pre-plating - Precious metal - OtherPre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.0057003.0000000.009665
Nickel and its compoundsNickel, metal7440-02-00.17537092.3000000.297352
Palladium and its compoundsPalladium, metal7440-05-30.0058903.1000000.009987
Silver and its compoundsSilver, metal7440-22-40.0030401.6000000.005155
Subtotal0.190000100.00000000.322159
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.75950098.0000001.287787
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0155002.0000000.026281
Subtotal0.775000100.00000001.314068
Total58.977150100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 PCF2131TFY
Product content declaration of PCF2131TFY
上次修订 Last Revision (GMT):
Thursday, 04 April 2024, 04:24:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
晶体振荡器
Crystal Oscillator
陶瓷的
Ceramic
OOOOOO

水晶
Crystal
OOOOOO

电极
Electrode
OOOOOO

环氧胶
Epoxy
OOOOOO

玻璃
Glass
OOOOOO

镀金材料
Gold Plating
OOOOOO

铁合金
Iron Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO

终端材料
Termination
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of PCF2131TFYLast Revision (GMT):
Thursday, 04 April 2024, 04:24:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Copper Lead-FrameAG PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
AU PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
C194Test Report
5 Feb 2024
Test Report
5 Feb 2024
Test Report
5 Feb 2024
Test Report
5 Feb 2024
NI PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
PD PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Crystal OscillatorNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy Adhesive 1Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Epoxy Adhesive 2Test Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
30 Mar 2023
Pre-plating - Precious metal - OtherTest Report
1 Jan 2024
Test Report
1 Jan 2024
Test Report
1 Jan 2024
Not Available
Semiconductor DieTest Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.