S32G254AABK0VUCT

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of S32G254AABK0VUCTLast Revision (GMT):
Thursday, 12 May 2022, 12:23:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
S32G254AABK0VUCTSOT1655FBGA5252482.381000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 198 485572021-04-1243 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-74.00000040.0000000.161136
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.50000015.0000000.060426
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-24.50000045.0000000.181278
Subtotal10.000000100.00000000.402839
Heat SpreaderCopper AlloyCopper and its compoundsCopper, metal7440-50-81515.59447099.99000061.054063
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1515750.0100000.006106
Subtotal1515.746045100.000000061.060169
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0023860.0100000.000096
Nickel and its compoundsNickel, metal7440-02-023.86156999.9900000.961237
Subtotal23.863955100.00000000.961333
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-364.29248089.6000002.589952
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6457950.9000000.026015
Nickel and its compoundsNickel, metal7440-02-00.3587750.5000000.014453
Silver and its compoundsSilver, metal7440-22-40.2260280.3150000.009105
Tin and its compoundsTin, metal7440-31-56.2319228.6850000.251046
Subtotal71.755000100.00000002.890572
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-44.5645603.5000000.183878
Tin and its compoundsTin, metal7440-31-5125.85144096.5000005.069787
Subtotal130.416000100.00000005.253666
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8258.52866499.99000010.414544
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0258560.0100000.001042
Subtotal258.554520100.000000010.415586
Solder 1Copper and its compoundsCopper, metal7440-50-80.0277540.7000000.001118
Tin and its compoundsTin, metal7440-31-53.93716699.3000000.158604
Subtotal3.964920100.00000000.159722
Solder 2Copper and its compoundsCopper, metal7440-50-80.0198250.5000000.000799
Silver and its compoundsSilver, metal7440-22-40.1189483.0000000.004792
Tin and its compoundsTin, metal7440-31-53.82614896.5000000.154132
Subtotal3.964920100.00000000.159722
Solder MaskBarium and its compoundsBarium sulfate7727-43-74.73008025.0000000.190546
Inorganic Silicon compoundsSilica, vitreous60676-86-01.89203210.0000000.076218
Organic compoundsOther organic compounds.0.9460165.0000000.038109
PolymersPlastic: EP - Epoxide, Epoxy11.35219260.0000000.457311
Subtotal18.920320100.00000000.762184
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-310.45285110.4500000.421082
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-510.45285110.4500000.421082
Inorganic Silicon compoundsSilicon dioxide7631-86-941.86141741.8500001.686341
PolymersPlastic: EP - Epoxide, Epoxy37.26016237.2500001.500985
Subtotal100.027280100.00000004.029489
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3155.08402050.0000006.247390
Inorganic Silicon compoundsSilica, vitreous60676-86-062.03360820.0000002.498956
PolymersPlastic: EP - Epoxide, Epoxy93.05041230.0000003.748434
Subtotal310.168040100.000000012.494780
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-518.00000072.0000000.725110
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones2.50000010.0000000.100710
Zinc and its compoundsZinc oxide1314-13-24.50000018.0000000.181278
Subtotal25.000000100.00000001.007098
UnderfillUnderfillAromatic amines and their salts6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine106264-79-30.2099802.0998000.008459
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-60.3499703.4997000.014098
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.89981018.9981000.076532
Inorganic Silicon compoundsSilica, vitreous60676-86-06.69932066.9932000.269875
Inorganic compoundsCarbon Black1333-86-40.0080000.0800000.000322
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1839801.8398000.007411
Organic compoundsOther organic compounds.0.6299406.2994000.025376
Phosphorus compoundsTriphenyl phosphine603-35-00.0190000.1900000.000765
Subtotal10.000000100.00000000.402839
Total2482.381000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 S32G254AABK0VUCT
Product content declaration of S32G254AABK0VUCT
上次修订 Last Revision (GMT):
Thursday, 12 May 2022, 12:23:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of S32G254AABK0VUCTLast Revision (GMT):
Thursday, 12 May 2022, 12:23:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Heat SpreaderCOPPER ALLOYTest Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
NI PLATINGTest Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - Lead FreeTest Report
28 Apr 2021
Test Report
28 Apr 2021
Test Report
28 Apr 2021
Test Report
13 Mar 2020
SubstrateCU FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E700GRTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
M705Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
SR7300GRBTest Report
24 Feb 2022
Test Report
24 Feb 2022
Test Report
24 Feb 2022
Test Report
24 Feb 2022
Thermally Conductive GelTest Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
UnderfillTest Report
23 Feb 2022
Test Report
23 Feb 2022
Test Report
23 Feb 2022
Test Report
6 Apr 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.