SPC5668GF1AVMG

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5668GF1AVMGLast Revision (GMT):
Friday, 13 September 2024, 08:49:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5668GF1AVMGSOT1513-1BGA208828.748593 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 222 395572023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.82131898.1000000.219767
Gold and its compoundsGold, metal7440-57-50.0018570.1000000.000224
Palladium and its compoundsPalladium, metal7440-05-30.0334191.8000000.004032
Subtotal1.856593100.00000000.224024
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins23.9200005.0000002.886279
Inorganic Silicon compoundsSilica, vitreous60676-86-0320.52800067.00000038.676144
Inorganic Silicon compoundsSilicon dioxide7631-86-9119.60000025.00000014.431397
Inorganic compoundsCarbon Black1333-86-42.3920000.5000000.288628
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins11.9600002.5000001.443140
Subtotal478.400000100.000000057.725588
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.21500045.0000000.146607
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0002700.0100000.000033
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1350005.0000000.016290
PolymersPlastic: EP - Epoxide, Epoxy1.34973049.9900000.162864
Subtotal2.700000100.00000000.325792
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped39.20000098.0000004.730023
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8000002.0000000.096531
Subtotal40.000000100.00000004.826554
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-46.1072203.5000000.736921
Tin and its compoundsTin, metal7440-31-5168.38478096.50000020.317957
Subtotal174.492000100.000000021.054877
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-837.98277599.9900004.583148
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0037990.0100000.000458
Subtotal37.986574100.00000004.583607
Copper PlatingCopper and its compoundsCopper, metal7440-50-839.54880699.9800004.772111
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0079110.0200000.000955
Subtotal39.556717100.00000004.773066
Gold PlatingGold and its compoundsGold, metal7440-57-50.34131299.9900000.041184
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000340.0100000.000004
Subtotal0.341346100.00000000.041188
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0006420.0300000.000077
Nickel and its compoundsNickel, metal7440-02-02.13933399.9700000.258140
Subtotal2.139975100.00000000.258218
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0175400.1000000.002116
Barium and its compoundsBarium sulfate7727-43-75.10411629.1000000.615882
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1052390.6000000.012699
Magnesium and its compoundsTalc14807-96-60.5261983.0000000.063493
Organic compoundsOther organic compounds.0.6314373.6000000.076192
PolymersPlastic: EP - Epoxide, Epoxy3.42028419.5000000.412705
PolymersPlastic: PAK7.73510444.1000000.933347
Subtotal17.539919100.00000002.116434
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-33.12853046.6700000.377501
Inorganic Silicon compoundsSilica, vitreous60676-86-00.4464546.6600000.053871
PolymersPlastic: PI - Polyimide3.12853046.6700000.377501
Subtotal6.703514100.00000000.808872
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-310.00182437.0000001.206859
Inorganic Silicon compoundsSilica, vitreous60676-86-04.32511316.0000000.521885
PolymersPlastic: PI - Polyimide12.70501947.0000001.533037
Subtotal27.031956100.00000003.261780
Total828.748593100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5668GF1AVMG
Product content declaration of SPC5668GF1AVMG
上次修订 Last Revision (GMT):
Friday, 13 September 2024, 08:49:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5668GF1AVMGLast Revision (GMT):
Friday, 13 September 2024, 08:49:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - Lead FreeTest Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Substrate, Pre-plated NiAuAU PLATINGTest Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
AUS308Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
10 Jul 2023
Test Report
10 Jul 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
17 May 2022
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.