SPC5748CK0AMMJ6

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5748CK0AMMJ6Last Revision (GMT):
Thursday, 07 March 2024, 07:37:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5748CK0AMMJ6SOT740LBGA256471.000985 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 586 925572023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.64450298.1000000.136837
Gold and its compoundsGold, metal7440-57-50.0006570.1000000.000140
Palladium and its compoundsPalladium, metal7440-05-30.0118261.8000000.002511
Subtotal0.656985100.00000000.139487
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins15.3000005.0000003.248401
Inorganic Silicon compoundsSilica, vitreous60676-86-0205.02000067.00000043.528571
Inorganic Silicon compoundsSilicon dioxide7631-86-976.50000025.00000016.242004
Inorganic compoundsCarbon Black1333-86-41.5300000.5000000.324840
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins7.6500002.5000001.624200
Subtotal306.000000100.000000064.968017
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-95.40000045.0000001.146494
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0012000.0100000.000255
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.6000005.0000000.127388
PolymersPlastic: EP - Epoxide, Epoxy5.99880049.9900001.273628
Subtotal12.000000100.00000002.547765
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-320.58000098.0000004.369418
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4200002.0000000.089172
Subtotal21.000000100.00000004.458589
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0013030.0010000.000277
Antimony and its compoundsAntimony, metal7440-36-00.0651720.0500000.013837
Arsenic and its compoundsArsenic, metal7440-38-20.0391030.0300000.008302
Bismuth and its compoundsBismuth, metal7440-69-90.0391030.0300000.008302
Cadmium and its compoundsCadmium, metal7440-43-90.0026070.0020000.000553
Copper and its compoundsCopper, metal7440-50-80.0391030.0300000.008302
Gold and its compoundsGold, metal7440-57-50.0065170.0050000.001384
Indium and its compoundsIndium, metal7440-74-60.0260690.0200000.005535
Iron and its compoundsIron, metal7439-89-60.0130340.0100000.002767
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0651720.0500000.013837
Nickel and its compoundsNickel, metal7440-02-00.0065170.0050000.001384
Silver and its compoundsSilver, metal7440-22-44.5620403.5000000.968584
Tin and its compoundsTin, metal7440-31-5125.47695596.26600026.640487
Zinc and its compoundsZinc, metal7440-66-60.0013030.0010000.000277
Subtotal130.344000100.000000027.673827
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-80.30597899.9800000.064963
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000610.0200000.000013
Subtotal0.306039100.00000000.064976
Copper PlatingCopper and its compoundsCopper, metal7440-50-80.30430399.9800000.064608
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000610.0200000.000013
Subtotal0.304364100.00000000.064621
Gold PlatingGold and its compoundsGold, metal7440-57-50.00312799.9900000.000664
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.003128100.00000000.000664
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.0300000.000001
Nickel and its compoundsNickel, metal7440-02-00.01983199.9700000.004210
Subtotal0.019836100.00000000.004212
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.03886929.1000000.008252
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0008010.6000000.000170
Magnesium and its compoundsTalc14807-96-60.0040073.0000000.000851
Organic compoundsOther organic compounds.0.0048093.6000000.001021
PolymersPlastic: EP - Epoxide, Epoxy0.02618019.6000000.005558
PolymersPlastic: PAK0.05890444.1000000.012506
Subtotal0.133570100.00000000.028359
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.02520346.6666000.005351
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0036006.6667000.000764
PolymersPlastic: PI - Polyimide0.02520346.6667000.005351
Subtotal0.054007100.00000000.011466
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.06625037.0000000.014066
Inorganic Silicon compoundsSilica, vitreous60676-86-00.02864916.0000000.006083
PolymersPlastic: PI - Polyimide0.08415647.0000000.017867
Subtotal0.179055100.00000000.038016
Total471.000985100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5748CK0AMMJ6
Product content declaration of SPC5748CK0AMMJ6
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 07:37:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5748CK0AMMJ6Last Revision (GMT):
Thursday, 07 March 2024, 07:37:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
SubstrateAU PLATINGTest Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
CORETest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
4 May 2023
Test Report
4 May 2023
Test Report
4 May 2023
Test Report
4 May 2023
NI PLATINGTest Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
SOLDER MASKTest Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.