SPC5748GGK1MMJ6R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5748GGK1MMJ6RLast Revision (GMT):
Tuesday, 05 March 2024, 02:17:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5748GGK1MMJ6RSOT740-3LBGA256677.300985 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 163 025182023-11-2493 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.64450298.1000000.095157
Gold and its compoundsGold, metal7440-57-50.0006570.1000000.000097
Palladium and its compoundsPalladium, metal7440-05-30.0118261.8000000.001746
Subtotal0.656985100.00000000.097000
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins15.3000005.0000002.258966
Inorganic Silicon compoundsSilica, vitreous60676-86-0205.02000067.00000030.270146
Inorganic Silicon compoundsSilicon dioxide7631-86-976.50000025.00000011.294831
Inorganic compoundsCarbon Black1333-86-41.5300000.5000000.225897
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins7.6500002.5000001.129483
Subtotal306.000000100.000000045.179323
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-95.40000045.0000000.797282
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0012000.0100000.000177
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.6000005.0000000.088587
PolymersPlastic: EP - Epoxide, Epoxy5.99880049.9900000.885692
Subtotal12.000000100.00000001.771738
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped20.58000098.0000003.038531
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4200002.0000000.062011
Subtotal21.000000100.00000003.100542
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0013030.0010000.000192
Antimony and its compoundsAntimony, metal7440-36-00.0651720.0500000.009622
Arsenic and its compoundsArsenic, metal7440-38-20.0391030.0300000.005773
Bismuth and its compoundsBismuth, metal7440-69-90.0391030.0300000.005773
Cadmium and its compoundsCadmium, metal7440-43-90.0026070.0020000.000385
Copper and its compoundsCopper, metal7440-50-80.0391030.0300000.005773
Gold and its compoundsGold, metal7440-57-50.0065170.0050000.000962
Indium and its compoundsIndium, metal7440-74-60.0260690.0200000.003849
Iron and its compoundsIron, metal7439-89-60.0130340.0100000.001924
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0651720.0500000.009622
Nickel and its compoundsNickel, metal7440-02-00.0065170.0050000.000962
Silver and its compoundsSilver, metal7440-22-44.5620403.5000000.673562
Tin and its compoundsTin, metal7440-31-5125.47695596.26600018.526026
Zinc and its compoundsZinc, metal7440-66-60.0013030.0010000.000192
Subtotal130.344000100.000000019.244620
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-863.43562399.9900009.365943
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0063440.0100000.000937
Subtotal63.441968100.00000009.366880
Copper PlatingCopper and its compoundsCopper, metal7440-50-863.08207399.9800009.313743
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0126190.0200000.001863
Subtotal63.094692100.00000009.315606
Gold PlatingGold and its compoundsGold, metal7440-57-50.64846399.9900000.095742
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000650.0100000.000010
Subtotal0.648528100.00000000.095752
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0012340.0300000.000182
Nickel and its compoundsNickel, metal7440-02-04.11086599.9700000.606948
Subtotal4.112098100.00000000.607130
Solder MaskBarium and its compoundsBarium sulfate7727-43-78.05751929.1000001.189651
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1661340.6000000.024529
Magnesium and its compoundsTalc14807-96-60.8306723.0000000.122645
Organic compoundsOther organic compounds.0.9968073.6000000.147173
PolymersPlastic: EP - Epoxide, Epoxy5.42705819.6000000.801277
PolymersPlastic: PAK12.21088044.1000001.802873
Subtotal27.689069100.00000004.088148
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-35.22463646.6666000.771389
Inorganic Silicon compoundsSilica, vitreous60676-86-00.7463806.6667000.110199
PolymersPlastic: PI - Polyimide5.22463646.6667000.771391
Subtotal11.195641100.00000001.652979
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-313.73366237.0000002.027704
Inorganic Silicon compoundsSilica, vitreous60676-86-05.93888116.0000000.876845
PolymersPlastic: PI - Polyimide17.44546247.0000002.575732
Subtotal37.118004100.00000005.480282
Total677.300985100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5748GGK1MMJ6R
Product content declaration of SPC5748GGK1MMJ6R
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 02:17:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5748GGK1MMJ6RLast Revision (GMT):
Tuesday, 05 March 2024, 02:17:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
COPPERTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FGBTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.