SVF532R3K1CMK4

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SVF532R3K1CMK4Last Revision (GMT):
Monday, 06 February 2023, 08:50:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SVF532R3K1CMK4SOT1517-1LFBGA3641276.156912 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 234 435572022-08-31143 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.85223198.0994000.066781
Gold and its compoundsGold, metal7440-57-50.0008690.1000000.000068
Palladium and its compoundsPalladium, metal7440-05-30.0156431.8006000.001226
Subtotal0.868742100.00000000.068075
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-513.6868402.0010001.072504
Inorganic Silicon compoundsSilica, vitreous60676-86-0478.69740069.98500037.510857
Inorganic Silicon compoundsSilicon dioxide7631-86-9123.18156018.0090009.652540
Magnesium and its compoundsMagnesium, metal7439-95-46.8434201.0005000.536252
Phenols and Phenolic ResinsOther phenolic resins20.5302603.0015001.608757
PolymersOther acrylic/epoxy resin mixture41.0605206.0030003.217513
Subtotal684.000000100.000000053.598425
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-94.72500045.0000000.370252
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0010500.0100000.000082
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.5250005.0000000.041139
PolymersPlastic: EP - Epoxide, Epoxy5.24895049.9900000.411309
Subtotal10.500000100.00000000.822783
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-374.28808798.0000005.821235
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.5160832.0000000.118801
Subtotal75.804170100.00000005.940035
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.4527340.5009000.035476
Silver and its compoundsSilver, metal7440-22-42.7164013.0054000.212858
Tin and its compoundsTin, metal7440-31-587.21486696.4937006.834180
Subtotal90.384000100.00000007.082515
Substrate, Pre-plated NiAuCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0053590.0050000.000420
Copper and its compoundsCopper, metal7440-50-8107.09371999.9250008.391893
Nickel and its compoundsNickel, metal7440-02-00.0535870.0500000.004199
Zinc and its compoundsZinc, metal7440-66-60.0214350.0200000.001680
Subtotal107.174100100.00000008.398191
Copper PlatingCopper and its compoundsCopper, metal7440-50-8120.11376699.9000009.412147
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1202340.1000000.009422
Subtotal120.234000100.00000009.421569
Gold PlatingGold and its compoundsGold, metal7440-57-54.10043599.9000000.321311
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0041040.1000000.000322
Subtotal4.104540100.00000000.321633
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0191550.1000000.001501
Nickel and its compoundsNickel, metal7440-02-019.13536599.9000001.499452
Subtotal19.154520100.00000001.500953
Solder MaskBarium and its compoundsBarium sulfate7727-43-713.92284829.1000001.090998
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2870690.6000000.022495
Magnesium and its compoundsTalc14807-96-61.4353453.0000000.112474
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-91.7224143.6000000.134969
PolymersPlastic: EP - Epoxide, Epoxy9.37758919.6000000.734830
PolymersPlastic: PAK21.09957544.1000001.653368
Subtotal47.844840100.00000003.749134
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-634.01378429.3000002.665329
Inorganic Silicon compoundsFibrous-glass-wool65997-17-330.18288026.0000002.365139
Inorganic Silicon compoundsSilicon dioxide7631-86-91.9734961.7000000.154644
Miscellaneous substancesOther miscellaneous substances (less than 10%).9.5192168.2000000.745928
Phenols - SpecificBisphenol A80-05-71.1608801.0000000.090967
PolymersBT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]22.86933619.7000001.792047
PolymersPlastic: EP - Epoxide, Epoxy16.36840814.1000001.282633
Subtotal116.088000100.00000009.096687
Total1276.156912100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SVF532R3K1CMK4
Product content declaration of SVF532R3K1CMK4
上次修订 Last Revision (GMT):
Monday, 06 February 2023, 08:50:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SVF532R3K1CMK4Last Revision (GMT):
Monday, 06 February 2023, 08:50:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
16 Jan 2023
Test Report
16 Jan 2023
Test Report
16 Jan 2023
Test Report
16 Jan 2023
Die EncapsulantTest Report
14 Mar 2022
Test Report
14 Mar 2022
Test Report
14 Mar 2022
Test Report
14 Mar 2022
Epoxy AdhesiveTest Report
29 Jun 2022
Test Report
29 Jun 2022
Test Report
29 Jun 2022
Test Report
29 Jun 2022
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - SAC, Lead FreeTest Report
21 Jun 2022
Test Report
21 Jun 2022
Test Report
21 Jun 2022
Test Report
21 Jun 2022
Substrate, Pre-plated NiAuAU PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
AUS308Test Report
26 Aug 2022
Test Report
26 Aug 2022
Test Report
26 Aug 2022
Test Report
26 Aug 2022
CU FOILTest Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
CU PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
HL832NXATest Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
NI PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.