Package Search



Find mechanical outline drawings and related information

Use the nxp.com search function at the top, right-hand corner of any page to find the package for any part

Search Results:


Package Version Package Name Package Description Reference Codes Issue Date
HWFLGA56 HWFLGA56, thermal enhanced very very thin fine-pitch land grid array package, 56 terminals, 0.5 mm pitch, 5 mm x 11 mm x 0.71 mm body 2018-05-25
HWFLGA36 HWFLGA36, plastic thermal enhanced very very thin fine-pitch land grid array package, 0.4 mm pitch, 2.1 mm x 6 mm x 0.637 mm body 2019-11-14
HWFLGA16 HWFLGA16, thermal enhanced very-very thin fine-pitch land grid array package, 16 terminals, 0.4 mm pitch, 2 mm x 2 mm x 0.64 mm body 2020-05-20
HWFLGA38 HWFLGA38, thermal enhanced very very thin fine-pitch land grid array package, 38 terminals, 0.35 mm pitch, 4 mm x 3 mm x 0.65 mm body 2021-03-22
HWFLGA18 HWFLGA18, thermal enhanced very-very thin fine-pitched land grid array package, 18 terminals, 0.4 mm pitch, 2.4 mm x 2 mm x 0.64 mm body 2020-09-10
HWFLGA18 HWFLGA18, thermal enhanced very-very thin fine-pitched land grid array package, 18 terminals, 0.4 mm pitch, 2.4 mm x 2 mm x 0.64 mm body 2021-03-18
HWFLGA60 HWFLGA60, thermal enhanced very very thin finepitch land grid array package, 0.4 mm pitch, 9.05 mm x 4.05 mm x 0.63 mm body 2021-12-15
HWFLGA36 HWFLGA36, plastic thermal enhanced very very thin fine-pitch land grid array package, 0.4 mm pitch, 4.45 mm x 3.65 mm x 0.63 mm body 2021-12-15