An evaluation and development system supporting all peripheral functions and commonly used memory configurations, includes a Linux BSP and a voice command recognition demo. May be used as a reference design or base for end application hardware designs.
This document demonstrates how to determine the package temperature and thermal mass dependent moisture sensitivity level (MSL) of products to ensure reliable processing of moisture sensitive surface mount components. Comply with these recommendations to maintain package integrity of components during any heat exposure of board soldering and de-soldering.
This document describes the Multimedia Card (MMC) and the Secure Digital (SD) modules on NXP Semiconductors i.MX application processors. This document gives an overview of the similarities and differences of both the MMC and SD protocols and cards including configuration of the MMC/SD module. The document also describes the interface of the MMC/SD modules, specifically the card identification mode and the system clock controller, along with example code. System considerations at various data trans
Some of the high-end ColdFire products (such as the MCF532x, MCF537x, MCF5253, and MCF5445x devices) contain an EHCI-compatible host or dual-role/OTG USB controller. The dual-role module can be used as a USB host, a USB device, or as an On-the-Go device. When the dual-role module is used as a device, it uses data structures to control USB data movement. These data structures are similar in some ways to the embedded host controller interface (EHCI) data structures that are used when operating in host mode.