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NXP enhances active antenna systems with the flexibility of GaN discrete solutions and the high integration of multi-chip modules. Our full lineup solutions of multi-chip modules, GaN discrete products, LNAs and ICs support the evolution of 5G mMIMO active antenna system requirements for cellular base stations. Our innovative GaN, LDMOS and SiGe devices offer high levels of integration, increased output power, extended frequency coverage and improved efficiency ─ all in compact form factors.
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Browse our active antenna systems portfolio comprised of multi-chip modules, GaN discretes, LNAs and ICs.
Electronic Products includes NXP’s family of top-side cooled RF amplifier modules in its top ten 5G chips and modules for 2023.
Massive MIMO systems uniformly provide improved service in high-density environments.
NXP’s top-side cooling technology helps radio designers create thinner, lighter 5G radio units while reducing design and manufacturing complexities.
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Comprehensive board design including LDMOS multi-chip module PA with integrated bias control, pre-driver and Rx.
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Access our comprehensive library of more than 400 RF power amplifier designs.
Use our interactive product guide to browse our macro, mMIMO and consumer and industrial portfolios.
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