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5G Integrated Solutions
RF power multi-chip modules (MCM) meet performance, time to market, size and weight requirements of 5G mMIMO networks
NXP’s Airfast MCMs offer the highest levels of integration, ease of use and performance on the market. No matter what frequency band or power, we enable 5G.
-
50 ohm
Input/Output -
Compact Surface Mount
Devices -
High Levels of
Integration -
Comprehensive
Portfolio
RF Power Multi-Chip Modules
| Power Amplifiers | Description |
|---|---|
| 2300-2700 MHz | |
| AFSC5G23D37 | 2300-2400 MHz, 5 W Avg., 27 dB Airfast Power Amplifier Module |
| AFSC5G26E39 | 2496-2690 MHz, 8 W Avg., 30 dB Airfast Power Amplifier Module |
| AFSC5G26F38 | 2496-2690 MHz, 7 W Avg., 35 dB Airfast Power Amplifier Module |
| AFSC5G26E38 | 2496-2690 MHz, 6 W Avg., 35 dB Airfast Power Amplifier Module |
| AFSC5G26D37 | 2496-2690 MHz, 5 W Avg., 27 dB Airfast Power Amplifier Module |
| 3400-4000 MHz | |
| A3M35TL039 | 3400-3600 MHz, 7 W Avg., 28 dB Airfast Power Amplifier Module |
| AFSC5G35D37 | 3400-3600 MHz, 5 W Avg., 29 dB Airfast Power Amplifier Module |
| AFSC5G35D35 | 3400-3600 MHz, 3 W Avg., 26 dB Airfast Power Amplifier Module |
| AFSC5G35E38 | 3400-3700 MHz, 7 W Avg., 30 dB Airfast Power Amplifier Module |
| A3M37TL039 | 3600-3800 MHz, 7 W Avg., 28 dB Airfast Power Amplifier Module |
| AFSC5G37E38 | 3600-3800 MHz, 6.3 W Avg., 28 dB Airfast Power Amplifier Module |
| AFSC5G37D37 | 3600-3800 MHz, 5.7 W Avg., 29 dB Airfast Power Amplifier Module |
| AFSC5G40E38 | 3700-4000 MHz, 6.3 W Avg., 27 dB Airfast Power Amplifier Module |
| Pre-driver Modules | Description |
|---|---|
| AFLP5G25641 | 2300-2700 MHz, 32 dB, 29 dBm Airfast Pre-Driver Module |
| AFLP5G35645 | 3400-3800 MHz, 32 dB, 29 dBm Airfast Pre-Driver Module |
| A3M40PD012 | 2300-4200 MHz, 37 dB, 25 dBm Airfast Pre-driver Module |
| Receiver Modules | Description |
|---|---|
| AFRX5G272 | 2300-2690 MHz, 33 dB, 1.2 dB NF Airfast Rx Module |
| AFRX5G372 | 3300-5000 MHz, 34 dB, 1.4 dB NF Airfast Rx Module |
Benefits of 5G Integrated Solutions
- High levels of integration:
- Dual stage LDMOS solutions
- 50 ohm input and output matching with integrated Doherty
- Minimized external components and board area
- Comprehensive Portfolio:
- Covering all 5G active antenna frequencies
- Common footprint across product families
- Surface mount components compatible with standard manufacturing flows
Comprehensive Portfolio of Evaluation Boards
The 5G MCM solutions are supported with compact reference circuits designed to jump-start power amplifier designs.
What's New
NXP strengthens 5G development support with mass market release of multi-chip modules offering the highest levels of integration, ease of use and performance on the market.
NXP releases the RF Circuit Collection – RF Power On-Demand
Explore this library of more than 400 RF power reference circuits addressing a wide range of fast-growing markets from 5G communications infrastructure to smart industrial applications.