NXP simplifies 5G massive MIMO deployments by enabling smaller, lighter active antenna systems (AAS). Our RF power Multi-Chip Modules (MCM) offer the highest levels of integration and performance on the market.

No matter what frequency band or power, we enable 5G.

Benefits of 5G Integrated Solutions

  • 50 ohm input/output, 2-stage solution with integrated Doherty, enabling fast time to market
    • Simplifies customer PA design by bringing more RF content within the device
    • Pin-compatibility between devices enables reuse across all frequency bands and power levels
  • Compact, surface mount devices in 10 mm x 6 mm and 4 mm x 3 mm footprint
    • Reduces assembly and testing time
    • Compatible with standard pick and place equipment
  • No compromises on performance
    • Leveraging best performing semiconductor technology for each function of the PA with high performance substrate
RF 5G Solutions Diagram
RF 5G Solutions Board

What's New

5G Revolution

NXP Drives the 5G Revolution with Its Industry-Leading Portfolio of RF Infrastructure Solutions

5G CES Video

NXP 5G Wireless Infrastructure

See how NXP is solving key challenges for 5G

European Microwave 2019

European Microwave

Paris, France
September 29th - October 4th