NXP simplifies 5G massive MIMO deployments by enabling smaller, lighter active antenna systems (AAS). Our RF power Multi-Chip Modules (MCM) offer the highest levels of integration and performance on the market.
No matter what frequency band or power, we enable 5G.
Benefits of 5G Integrated Solutions
- 50 ohm input/output, 2-stage solution with integrated Doherty, enabling fast time to market
- Simplifies customer PA design by bringing more RF content within the device
- Pin-compatibility between devices enables reuse across all frequency bands and power levels
- Compact, surface mount devices in 10 mm x 6 mm and 4 mm x 3 mm footprint
- Reduces assembly and testing time
- Compatible with standard pick and place equipment
- No compromises on performance
- Leveraging best performing semiconductor technology for each function of the PA with high performance substrate