5G Integrated Solutions

RF power multi-chip modules (MCM) meet performance, time to market, size and weight requirements of 5G mMIMO networks

NXP’s Airfast MCMs offer the highest levels of integration, ease of use and performance on the market. No matter what frequency band or power, we enable 5G.

  • 50 ohm
    50 ohm
    Input/Output
  • Compact Surface Devices
    Compact Surface Mount
    Devices
  • High Integration
    High Levels of
    Integration
  • Longevity programs for product life cycles beyond 10 to 15 years
    Comprehensive
    Portfolio

RF Power Multi-Chip Modules